Microsemi Corporation M2S090-FG676
- Part Number:
- M2S090-FG676
- Manufacturer:
- Microsemi Corporation
- Ventron No:
- 3669328-M2S090-FG676
- Description:
- IC FPGA SOC 90K LUTS 676FBGA
- ECAD Model:
-
Microsemi Corporation M2S090-FG676 technical specifications, attributes, parameters and parts with similar specifications to Microsemi Corporation M2S090-FG676.
- Factory Lead Time12 Weeks
- Lifecycle StatusIN PRODUCTION (Last Updated: 3 weeks ago)
- Package / Case676-BGA
- Surface MountYES
- Operating Temperature0°C~85°C TJ
- PackagingTray
- Published2009
- SeriesSmartFusion®2
- JESD-609 Codee0
- Part StatusActive
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Number of Terminations676
- Terminal FinishTin/Lead (Sn/Pb)
- HTS Code8542.39.00.01
- SubcategoryField Programmable Gate Arrays
- TechnologyCMOS
- Terminal PositionBOTTOM
- Terminal FormBALL
- Peak Reflow Temperature (Cel)NOT SPECIFIED
- Supply Voltage1.2V
- Terminal Pitch1mm
- Reach Compliance Codenot_compliant
- Frequency166MHz
- Reflow Temperature-Max (s)NOT SPECIFIED
- Base Part NumberM2S090
- JESD-30 CodeS-PBGA-B676
- Number of Outputs425
- Qualification StatusNot Qualified
- Supply Voltage-Max (Vsup)1.26V
- Power Supplies1.2V
- Supply Voltage-Min (Vsup)1.14V
- InterfaceCAN, Ethernet, I2C, SPI, UART, USART, USB
- Number of I/O425
- RAM Size64KB
- Core ProcessorARM® Cortex®-M3
- PeripheralsDDR, PCIe, SERDES
- ConnectivityCANbus, Ethernet, I2C, SPI, UART/USART, USB
- ArchitectureMCU, FPGA
- Number of Inputs425
- Programmable Logic TypeFIELD PROGRAMMABLE GATE ARRAY
- Core ArchitectureARM
- Primary AttributesFPGA - 90K Logic Modules
- Number of Logic Cells86316
- Flash Size512KB
- Height Seated (Max)2.44mm
- Length27mm
- Width27mm
- RoHS StatusNon-RoHS Compliant
This SoC is built on ARM? Cortex?-M3 core processor(s).
The product, SmartFusion®2, is currently in production and was last updated 3 weeks ago. It is surface mountable and comes in a tray packaging. The terminal finish is Tin/Lead (Sn/Pb) and the technology used is CMOS. The product has a supply voltage minimum of 1.14V. It is a field programmable gate array with an ARM core architecture. The HTS code for this product is 8542.39.00.01.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
Core Architecture: ARM
There are a lot of Microsemi Corporation
M2S090-FG676 System On Chip (SoC) applications.
Cyberphysical system-on-chip
Deep learning hardware
Industrial automation devices
Cyber security for critical applications in the aerospace
PC peripherals
Smart appliances
Published Paper
Special Issue Information
ARM Cortex M4 microcontroller
Measurement testers
The product, SmartFusion®2, is currently in production and was last updated 3 weeks ago. It is surface mountable and comes in a tray packaging. The terminal finish is Tin/Lead (Sn/Pb) and the technology used is CMOS. The product has a supply voltage minimum of 1.14V. It is a field programmable gate array with an ARM core architecture. The HTS code for this product is 8542.39.00.01.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
Core Architecture: ARM
There are a lot of Microsemi Corporation
M2S090-FG676 System On Chip (SoC) applications.
Cyberphysical system-on-chip
Deep learning hardware
Industrial automation devices
Cyber security for critical applications in the aerospace
PC peripherals
Smart appliances
Published Paper
Special Issue Information
ARM Cortex M4 microcontroller
Measurement testers
M2S090-FG676 More Descriptions
FPGA SmartFusion2 86184 Cells 166MHz 65nm Technology 1.2V 676-Pin FBGA
M2S090-Fg676 676 Pbga 27X27X2.44Mm Tray Rohs Compliant: Yes |Microchip M2S090-FG676
SmartFusion2 SoC FPGA, ARM Cortex-M3, 86KLEs
IC SOC CORTEX-M3 166MHZ 676FBGA
FPGA - Field Programmable Gate Array SmartFusion2
IC SOC CORTEX-A9 667MHZ 484BGA
M2S090-Fg676 676 Pbga 27X27X2.44Mm Tray Rohs Compliant: Yes |Microchip M2S090-FG676
SmartFusion2 SoC FPGA, ARM Cortex-M3, 86KLEs
IC SOC CORTEX-M3 166MHZ 676FBGA
FPGA - Field Programmable Gate Array SmartFusion2
IC SOC CORTEX-A9 667MHZ 484BGA
The three parts on the right have similar specifications to M2S090-FG676.
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ImagePart NumberManufacturerFactory Lead TimeLifecycle StatusPackage / CaseSurface MountOperating TemperaturePackagingPublishedSeriesJESD-609 CodePart StatusMoisture Sensitivity Level (MSL)Number of TerminationsTerminal FinishHTS CodeSubcategoryTechnologyTerminal PositionTerminal FormPeak Reflow Temperature (Cel)Supply VoltageTerminal PitchReach Compliance CodeFrequencyReflow Temperature-Max (s)Base Part NumberJESD-30 CodeNumber of OutputsQualification StatusSupply Voltage-Max (Vsup)Power SuppliesSupply Voltage-Min (Vsup)InterfaceNumber of I/ORAM SizeCore ProcessorPeripheralsConnectivityArchitectureNumber of InputsProgrammable Logic TypeCore ArchitecturePrimary AttributesNumber of Logic CellsFlash SizeHeight Seated (Max)LengthWidthRoHS StatusSpeedSupplier Device PackageMax Operating TemperatureMin Operating TemperatureView Compare
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M2S090-FG67612 WeeksIN PRODUCTION (Last Updated: 3 weeks ago)676-BGAYES0°C~85°C TJTray2009SmartFusion®2e0Active3 (168 Hours)676Tin/Lead (Sn/Pb)8542.39.00.01Field Programmable Gate ArraysCMOSBOTTOMBALLNOT SPECIFIED1.2V1mmnot_compliant166MHzNOT SPECIFIEDM2S090S-PBGA-B676425Not Qualified1.26V1.2V1.14VCAN, Ethernet, I2C, SPI, UART, USART, USB42564KBARM® Cortex®-M3DDR, PCIe, SERDESCANbus, Ethernet, I2C, SPI, UART/USART, USBMCU, FPGA425FIELD PROGRAMMABLE GATE ARRAYARMFPGA - 90K Logic Modules86316512KB2.44mm27mm27mmNon-RoHS Compliant----- -
8 WeeksIN PRODUCTION (Last Updated: 2 weeks ago)896-BGAYES-40°C~100°C TJTray-SmartFusion®2e3Active3 (168 Hours)896MATTE TIN8542.39.00.01Field Programmable Gate ArraysCMOSBOTTOMBALLNOT SPECIFIED1.2V1mm--NOT SPECIFIED-S-PBGA-B896377Not Qualified1.26V1.2V1.14V-37764KBARM® Cortex®-M3DDR, PCIe, SERDESCANbus, Ethernet, I2C, SPI, UART/USART, USBMCU, FPGA377FIELD PROGRAMMABLE GATE ARRAY-FPGA - 50K Logic Modules56340256KB2.44mm31mm31mmRoHS Compliant166MHz---
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8 WeeksIN PRODUCTION (Last Updated: 1 month ago)484-BGA-0°C~85°C TJTray2009SmartFusion®2-Active3 (168 Hours)-----------166MHz-M2S025------CAN, Ethernet, I2C, SPI, UART, USART, USB26764KBARM® Cortex®-M3DDR, PCIe, SERDESCANbus, Ethernet, I2C, SPI, UART/USART, USBMCU, FPGA--ARMFPGA - 25K Logic Modules-256KB---Non-RoHS Compliant166MHz484-FPBGA (23x23)85°C0°C
-
10 WeeksIN PRODUCTION (Last Updated: 1 month ago)484-BGA--40°C~100°C TJTray2009SmartFusion®2-Active3 (168 Hours)-----------166MHz-M2S025T------CAN, Ethernet, I2C, SPI, UART, USART, USB26764KBARM® Cortex®-M3DDR, PCIe, SERDESCANbus, Ethernet, I2C, SPI, UART/USART, USBMCU, FPGA--ARMFPGA - 25K Logic Modules-256KB---RoHS Compliant166MHz484-FPBGA (23x23)100°C-40°C
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