Microsemi Corporation M2S060TS-1FGG676I
- Part Number:
- M2S060TS-1FGG676I
- Manufacturer:
- Microsemi Corporation
- Ventron No:
- 3669285-M2S060TS-1FGG676I
- Description:
- IC FPGA SOC 60K LUTS
- ECAD Model:
-
- Datasheet:
- M2S060TS-1FGG676I
Microsemi Corporation M2S060TS-1FGG676I technical specifications, attributes, parameters and parts with similar specifications to Microsemi Corporation M2S060TS-1FGG676I.
- Factory Lead Time10 Weeks
- Lifecycle StatusIN PRODUCTION (Last Updated: 3 weeks ago)
- Package / Case676-BGA
- Surface MountYES
- Operating Temperature-40°C~100°C TJ
- PackagingTray
- SeriesSmartFusion®2
- JESD-609 Codee3
- Part StatusActive
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Number of Terminations676
- Terminal FinishMATTE TIN
- HTS Code8542.39.00.01
- SubcategoryField Programmable Gate Arrays
- TechnologyCMOS
- Terminal PositionBOTTOM
- Terminal FormBALL
- Peak Reflow Temperature (Cel)NOT SPECIFIED
- Supply Voltage1.2V
- Terminal Pitch1mm
- Reflow Temperature-Max (s)NOT SPECIFIED
- JESD-30 CodeS-PBGA-B676
- Number of Outputs387
- Qualification StatusNot Qualified
- Supply Voltage-Max (Vsup)1.26V
- Power Supplies1.2V
- Supply Voltage-Min (Vsup)1.14V
- Number of I/O387
- Speed166MHz
- RAM Size64KB
- Core ProcessorARM® Cortex®-M3
- PeripheralsDDR, PCIe, SERDES
- ConnectivityCANbus, Ethernet, I2C, SPI, UART/USART, USB
- ArchitectureMCU, FPGA
- Number of Inputs387
- Programmable Logic TypeFIELD PROGRAMMABLE GATE ARRAY
- Primary AttributesFPGA - 60K Logic Modules
- Number of Logic Cells56520
- Flash Size256KB
- Height Seated (Max)2.44mm
- Length27mm
- Width27mm
- RoHS StatusRoHS Compliant
This SoC is built on ARM? Cortex?-M3 core processor(s).
The product is a surface mount device with a JESD-609 Code of e3. It is an active part with a terminal finish of matte tin. The terminal position is at the bottom and the terminal pitch is 1mm. The product has peripherals such as DDR, PCIe, and SERDES. It also has various connectivity options including CANbus, Ethernet, I2C, SPI, UART/USART, and USB. The primary attribute of the product is that it is an FPGA with 60K logic modules. Additionally, it has a flash size of 256KB.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
There are a lot of Microsemi Corporation
M2S060TS-1FGG676I System On Chip (SoC) applications.
High-end PLC
Keyboard
Cyber security for critical applications in the aerospace
Networked Media Encode/Decode
Level
Remote control
Personal Computers
Defense
Servo drive control module
Multiprocessor system-on-chips (MPSoCs)
The product is a surface mount device with a JESD-609 Code of e3. It is an active part with a terminal finish of matte tin. The terminal position is at the bottom and the terminal pitch is 1mm. The product has peripherals such as DDR, PCIe, and SERDES. It also has various connectivity options including CANbus, Ethernet, I2C, SPI, UART/USART, and USB. The primary attribute of the product is that it is an FPGA with 60K logic modules. Additionally, it has a flash size of 256KB.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
There are a lot of Microsemi Corporation
M2S060TS-1FGG676I System On Chip (SoC) applications.
High-end PLC
Keyboard
Cyber security for critical applications in the aerospace
Networked Media Encode/Decode
Level
Remote control
Personal Computers
Defense
Servo drive control module
Multiprocessor system-on-chips (MPSoCs)
M2S060TS-1FGG676I More Descriptions
M2S060Ts-1Fgg676I 676 Pbga 27X27X2.44Mm Tray Rohs Compliant: Yes |Microchip M2S060TS-1FGG676I
SmartFusion2 SoC FPGA, ARM Cortex-M3, 56.5KLEs
IC SOC CORTEX-M3 166MHZ 676FBGA
SmartFusion2 SoC FPGA, ARM Cortex-M3, 56.5KLEs
IC SOC CORTEX-M3 166MHZ 676FBGA
The three parts on the right have similar specifications to M2S060TS-1FGG676I.
-
ImagePart NumberManufacturerFactory Lead TimeLifecycle StatusPackage / CaseSurface MountOperating TemperaturePackagingSeriesJESD-609 CodePart StatusMoisture Sensitivity Level (MSL)Number of TerminationsTerminal FinishHTS CodeSubcategoryTechnologyTerminal PositionTerminal FormPeak Reflow Temperature (Cel)Supply VoltageTerminal PitchReflow Temperature-Max (s)JESD-30 CodeNumber of OutputsQualification StatusSupply Voltage-Max (Vsup)Power SuppliesSupply Voltage-Min (Vsup)Number of I/OSpeedRAM SizeCore ProcessorPeripheralsConnectivityArchitectureNumber of InputsProgrammable Logic TypePrimary AttributesNumber of Logic CellsFlash SizeHeight Seated (Max)LengthWidthRoHS StatusSupplier Device PackageMax Operating TemperatureMin Operating TemperatureFrequencyBase Part NumberInterfaceCore ArchitecturePublishedView Compare
-
M2S060TS-1FGG676I10 WeeksIN PRODUCTION (Last Updated: 3 weeks ago)676-BGAYES-40°C~100°C TJTraySmartFusion®2e3Active3 (168 Hours)676MATTE TIN8542.39.00.01Field Programmable Gate ArraysCMOSBOTTOMBALLNOT SPECIFIED1.2V1mmNOT SPECIFIEDS-PBGA-B676387Not Qualified1.26V1.2V1.14V387166MHz64KBARM® Cortex®-M3DDR, PCIe, SERDESCANbus, Ethernet, I2C, SPI, UART/USART, USBMCU, FPGA387FIELD PROGRAMMABLE GATE ARRAYFPGA - 60K Logic Modules56520256KB2.44mm27mm27mmRoHS Compliant--------- -
8 WeeksIN PRODUCTION (Last Updated: 2 weeks ago)896-BGAYES-40°C~100°C TJTraySmartFusion®2e3Active3 (168 Hours)896MATTE TIN8542.39.00.01Field Programmable Gate ArraysCMOSBOTTOMBALLNOT SPECIFIED1.2V1mmNOT SPECIFIEDS-PBGA-B896377Not Qualified1.26V1.2V1.14V377166MHz64KBARM® Cortex®-M3DDR, PCIe, SERDESCANbus, Ethernet, I2C, SPI, UART/USART, USBMCU, FPGA377FIELD PROGRAMMABLE GATE ARRAYFPGA - 50K Logic Modules56340256KB2.44mm31mm31mmRoHS Compliant--------
-
--484-BGA--40°C~100°C TJTraySmartFusion®2-Obsolete3 (168 Hours)-----------------267166MHz64KBARM® Cortex®-M3DDR, PCIe, SERDESCANbus, Ethernet, I2C, SPI, UART/USART, USBMCU, FPGA--FPGA - 90K Logic Modules-512KB---RoHS Compliant484-FPBGA (23x23)100°C-40°C166MHzM2S090SCAN, Ethernet, I2C, SPI, UART, USART, USBARM-
-
10 WeeksIN PRODUCTION (Last Updated: 1 month ago)484-BGA--40°C~100°C TJTraySmartFusion®2-Active3 (168 Hours)-----------------267166MHz64KBARM® Cortex®-M3DDR, PCIe, SERDESCANbus, Ethernet, I2C, SPI, UART/USART, USBMCU, FPGA--FPGA - 25K Logic Modules-256KB---RoHS Compliant484-FPBGA (23x23)100°C-40°C166MHzM2S025TCAN, Ethernet, I2C, SPI, UART, USART, USBARM2009
Popular Search Part Number
Related Keywords
Search Tags
Latest News
-
14 November 2023
BAT54S Schottky Diode Structure, Technical Parameters, Package and Other Details
Ⅰ. Overview of BAT54S diodeⅡ. BAT54S symbol, footprint and pin configurationⅢ. Structure and working principle of BAT54S diodeⅣ. What are the features of BAT54S diode?Ⅴ. Technical parameters of... -
14 November 2023
HX711 Load Cell Amplifier: Symbol, Manufacturer, Working Principle and Applications
Ⅰ. Overview of HX711Ⅱ. HX711 symbol, footprint and pin configurationⅢ. Manufacturer of HX711Ⅳ. Features of HX711Ⅴ. Technical parameters of HX711Ⅵ. Working principle of HX711 pressure sensorⅦ. Internal block... -
15 November 2023
An Introduction to USB to Serial Converter Module CP2102
Ⅰ. Overview of CP2102Ⅱ. Manufacturer of CP2102Ⅲ. CP2102 symbol, footprint and pin configurationⅣ. Features of CP2102Ⅴ. Technical parameters of CP2102Ⅵ. What are the advantages of CP2102?Ⅶ. What is... -
15 November 2023
S9015 PNP Transistor Equivalents, Structure, S9015 vs C9015 and More
Ⅰ. Overview of S9015 transistorⅡ. Structure and working principle of S9015 transistorⅢ. Pin configuration of S9015 transistorⅣ. Features of S9015 transistorⅤ. Technical parameters of S9015 transistorⅥ. Absolute maximum...
Help you to save your cost and time.
Reliable package for your goods.
Fast Reliable Delivery to save time.
Quality premium after-sale service.