Microsemi Corporation M2S050-FGG896I
- Part Number:
- M2S050-FGG896I
- Manufacturer:
- Microsemi Corporation
- Ventron No:
- 3828155-M2S050-FGG896I
- Description:
- IC FPGA SOC 896-FBGA
- Datasheet:
- M2S050-FGG896I
Microsemi Corporation M2S050-FGG896I technical specifications, attributes, parameters and parts with similar specifications to Microsemi Corporation M2S050-FGG896I.
- Factory Lead Time7 Weeks
- Lifecycle StatusIN PRODUCTION (Last Updated: 2 weeks ago)
- Package / Case896-BGA
- Surface MountYES
- Operating Temperature-40°C~100°C TJ
- PackagingTray
- Published2015
- SeriesSmartFusion®2
- JESD-609 Codee3
- Part StatusActive
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Number of Terminations896
- Terminal FinishMATTE TIN
- HTS Code8542.39.00.01
- SubcategoryField Programmable Gate Arrays
- TechnologyCMOS
- Terminal PositionBOTTOM
- Terminal FormBALL
- Peak Reflow Temperature (Cel)NOT SPECIFIED
- Supply Voltage1.2V
- Terminal Pitch1mm
- Reflow Temperature-Max (s)NOT SPECIFIED
- JESD-30 CodeS-PBGA-B896
- Number of Outputs377
- Qualification StatusNot Qualified
- Supply Voltage-Max (Vsup)1.26V
- Power Supplies1.2V
- Supply Voltage-Min (Vsup)1.14V
- Number of I/O377
- Speed166MHz
- RAM Size64KB
- Core ProcessorARM® Cortex®-M3
- PeripheralsDDR, PCIe, SERDES
- ConnectivityCANbus, Ethernet, I2C, SPI, UART/USART, USB
- ArchitectureMCU, FPGA
- Number of Inputs377
- Programmable Logic TypeFIELD PROGRAMMABLE GATE ARRAY
- Primary AttributesFPGA - 50K Logic Modules
- Number of Logic Cells56340
- Flash Size256KB
- Height Seated (Max)2.44mm
- Length31mm
- Width31mm
- RoHS StatusRoHS Compliant
This SoC is built on ARM? Cortex?-M3 core processor(s).
Based on the core processor(s) ARM? Cortex?-M3, this SoC has been developed.Assigned with the package 896-BGA, this system on a chip comes from the manufacturer.As this SoC chip has 64KB RAM implemented, it provides reliable performance to its users.Internally, this SoC design uses the MCU, FPGA technique.It is a member of the SmartFusion?2 series.This SoC meaning should have an average operating temperature of -40°C~100°C TJ when it is operating normally.This SoC security combines FPGA - 50K Logic Modules, an important feature to keep in mind.This SoC system on a chip has been designed in a state-of-the-art Tray package.This SoC part contains a total of 377 I/Os in total.Ideally, a power supply with a voltage of 1.2V should be used.The SoCs wireless cannot operate at a voltage greater than 1.26V because it is considered unsafe for the application.There is a possibility that it can be powered by a power supply of at least 1.14V.The configuration of FIELD PROGRAMMABLE GATE ARRAY can be adapted to meet the needs of different design projects.Having 896 terminations in total makes system on a chip possible.In addition, it boasts impressive system on a chipming capabilities, just like other high-quality Field Programmable Gate Arrays.This SoC chip is capable of having 377 outputs, which is convenient.You will need to provide 1.2V power supplies in order to run system on chip.The SoC chip offers 377 inputs.A logic SoC has 56340 logic cells.It has a 256KB flash.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
There are a lot of Microsemi Corporation
M2S050-FGG896I System On Chip (SoC) applications.
RISC-V
AC-input BLDC motor drive
PC peripherals
Video Imaging
Central alarm system
Avionics
Medical
ARM Cortex M4 microcontroller
System-on-chip (SoC)
Three phase UPS
Based on the core processor(s) ARM? Cortex?-M3, this SoC has been developed.Assigned with the package 896-BGA, this system on a chip comes from the manufacturer.As this SoC chip has 64KB RAM implemented, it provides reliable performance to its users.Internally, this SoC design uses the MCU, FPGA technique.It is a member of the SmartFusion?2 series.This SoC meaning should have an average operating temperature of -40°C~100°C TJ when it is operating normally.This SoC security combines FPGA - 50K Logic Modules, an important feature to keep in mind.This SoC system on a chip has been designed in a state-of-the-art Tray package.This SoC part contains a total of 377 I/Os in total.Ideally, a power supply with a voltage of 1.2V should be used.The SoCs wireless cannot operate at a voltage greater than 1.26V because it is considered unsafe for the application.There is a possibility that it can be powered by a power supply of at least 1.14V.The configuration of FIELD PROGRAMMABLE GATE ARRAY can be adapted to meet the needs of different design projects.Having 896 terminations in total makes system on a chip possible.In addition, it boasts impressive system on a chipming capabilities, just like other high-quality Field Programmable Gate Arrays.This SoC chip is capable of having 377 outputs, which is convenient.You will need to provide 1.2V power supplies in order to run system on chip.The SoC chip offers 377 inputs.A logic SoC has 56340 logic cells.It has a 256KB flash.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
There are a lot of Microsemi Corporation
M2S050-FGG896I System On Chip (SoC) applications.
RISC-V
AC-input BLDC motor drive
PC peripherals
Video Imaging
Central alarm system
Avionics
Medical
ARM Cortex M4 microcontroller
System-on-chip (SoC)
Three phase UPS
M2S050-FGG896I More Descriptions
M2S050-Fgg896I 896 Pbga 31X31X2.44Mm Tray Rohs Compliant: Yes |Microchip M2S050-FGG896I
FPGA SmartFusion2 56340 Cells 166MHz 65nm Technology 1.2V 896-Pin FBGA
SmartFusion2 SoC FPGA, ARM Cortex-M3, 56KLEs
IC SOC CORTEX-M3 166MHZ 896FBGA
FPGA SmartFusion2 56340 Cells 166MHz 65nm Technology 1.2V 896-Pin FBGA
SmartFusion2 SoC FPGA, ARM Cortex-M3, 56KLEs
IC SOC CORTEX-M3 166MHZ 896FBGA
The three parts on the right have similar specifications to M2S050-FGG896I.
-
ImagePart NumberManufacturerFactory Lead TimeLifecycle StatusPackage / CaseSurface MountOperating TemperaturePackagingPublishedSeriesJESD-609 CodePart StatusMoisture Sensitivity Level (MSL)Number of TerminationsTerminal FinishHTS CodeSubcategoryTechnologyTerminal PositionTerminal FormPeak Reflow Temperature (Cel)Supply VoltageTerminal PitchReflow Temperature-Max (s)JESD-30 CodeNumber of OutputsQualification StatusSupply Voltage-Max (Vsup)Power SuppliesSupply Voltage-Min (Vsup)Number of I/OSpeedRAM SizeCore ProcessorPeripheralsConnectivityArchitectureNumber of InputsProgrammable Logic TypePrimary AttributesNumber of Logic CellsFlash SizeHeight Seated (Max)LengthWidthRoHS StatusSupplier Device PackageMax Operating TemperatureMin Operating TemperatureFrequencyBase Part NumberInterfaceCore ArchitectureView Compare
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M2S050-FGG896I7 WeeksIN PRODUCTION (Last Updated: 2 weeks ago)896-BGAYES-40°C~100°C TJTray2015SmartFusion®2e3Active3 (168 Hours)896MATTE TIN8542.39.00.01Field Programmable Gate ArraysCMOSBOTTOMBALLNOT SPECIFIED1.2V1mmNOT SPECIFIEDS-PBGA-B896377Not Qualified1.26V1.2V1.14V377166MHz64KBARM® Cortex®-M3DDR, PCIe, SERDESCANbus, Ethernet, I2C, SPI, UART/USART, USBMCU, FPGA377FIELD PROGRAMMABLE GATE ARRAYFPGA - 50K Logic Modules56340256KB2.44mm31mm31mmRoHS Compliant--------
-
10 WeeksIN PRODUCTION (Last Updated: 1 month ago)144-LQFPYES0°C~85°C TJTray2015SmartFusion®2e3Active3 (168 Hours)144MATTE TIN8542.39.00.01Field Programmable Gate ArraysCMOSQUADGULL WINGNOT SPECIFIED1.2V0.5mmNOT SPECIFIEDS-PQFP-G14484Not Qualified1.26V1.2V1.14V84166MHz64KBARM® Cortex®-M3DDR, PCIe, SERDESCANbus, Ethernet, I2C, SPI, UART/USART, USBMCU, FPGA84FIELD PROGRAMMABLE GATE ARRAYFPGA - 10K Logic Modules-256KB1.6mm20mm20mmRoHS Compliant-------
-
8 WeeksIN PRODUCTION (Last Updated: 2 weeks ago)896-BGAYES-40°C~100°C TJTray-SmartFusion®2e3Active3 (168 Hours)896MATTE TIN8542.39.00.01Field Programmable Gate ArraysCMOSBOTTOMBALLNOT SPECIFIED1.2V1mmNOT SPECIFIEDS-PBGA-B896377Not Qualified1.26V1.2V1.14V377166MHz64KBARM® Cortex®-M3DDR, PCIe, SERDESCANbus, Ethernet, I2C, SPI, UART/USART, USBMCU, FPGA377FIELD PROGRAMMABLE GATE ARRAYFPGA - 50K Logic Modules56340256KB2.44mm31mm31mmRoHS Compliant-------
-
10 WeeksIN PRODUCTION (Last Updated: 1 month ago)484-BGA--40°C~100°C TJTray2009SmartFusion®2-Active3 (168 Hours)-----------------267166MHz64KBARM® Cortex®-M3DDR, PCIe, SERDESCANbus, Ethernet, I2C, SPI, UART/USART, USBMCU, FPGA--FPGA - 25K Logic Modules-256KB---RoHS Compliant484-FPBGA (23x23)100°C-40°C166MHzM2S025TCAN, Ethernet, I2C, SPI, UART, USART, USBARM
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