Microsemi Corporation M2S050-FGG484

This SoC is built on ARM? Cortex?-M3 core processor(s).
A core processor ARM? Cortex?-M3 is used to build this SoC.It has been assigned a package 484-BGA by its manufacturer for this system on a chip.With 64KB RAM implemented, this SoC chip provides users with a high level of performance.The internal architecture of this SoC design is based on the MCU, FPGA technique.Featured system on chip SoCs of the SmartFusion?2 series.In general, this SoC meaning should operate at a temperature of 0°C~85°C TJ on a regular basis.One important thing to mark down is that this SoC meaning combines FPGA - 50K Logic Modules.In the state-of-the-art Tray package, this SoC system on a chip is housed.267 I/Os are available in this SoC part.The flash size of the SoC meaning is 256KB.Search M2S050 for system on chips with similar specs and purposes.There is 166MHz frequency associated with the wireless SoC.It uses ARM as its core architecture.The computer SoC has a pin count of 484.In order for the SoC computing to start, 0°C is just about right.As far as the design temperature of this SoC system on chip is concerned, the maximum working temperature is 85°C.

ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
Core Architecture: ARM

There are a lot of Microsemi Corporation
M2S050-FGG484 System On Chip (SoC) applications.

Communication interfaces ( I2C, SPI )
System-on-chip (SoC)
Smart appliances
Smartphone accessories
Efficient hardware for inference of neural networks
Functional safety for critical applications in the aerospace
Smartphones
Self-aware system-on-chip (SoC)
Cyber security for critical applications in the aerospace
Sensor network-on-chip (sNoC)