Microsemi Corporation M2S025T-1VFG256
- Part Number:
- M2S025T-1VFG256
- Manufacturer:
- Microsemi Corporation
- Ventron No:
- 4544152-M2S025T-1VFG256
- Description:
- IC FPGA SOC 25K LUTS
- Datasheet:
- M2S025T-1VFG256
Microsemi Corporation M2S025T-1VFG256 technical specifications, attributes, parameters and parts with similar specifications to Microsemi Corporation M2S025T-1VFG256.
- Factory Lead Time10 Weeks
- Package / Case256-LBGA
- Surface MountYES
- Operating Temperature0°C~85°C TJ
- PackagingTray
- Published2015
- SeriesSmartFusion®2
- JESD-609 Codee3
- Part StatusActive
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Number of Terminations256
- Terminal FinishMATTE TIN
- Additional FeatureLG-MIN, WD-MIN
- HTS Code8542.39.00.01
- SubcategoryField Programmable Gate Arrays
- TechnologyCMOS
- Terminal PositionBOTTOM
- Terminal FormBALL
- Peak Reflow Temperature (Cel)NOT SPECIFIED
- Supply Voltage1.2V
- Terminal Pitch0.8mm
- Reflow Temperature-Max (s)NOT SPECIFIED
- JESD-30 CodeS-PBGA-B256
- Number of Outputs138
- Qualification StatusNot Qualified
- Supply Voltage-Max (Vsup)1.26V
- Power Supplies1.2V
- Supply Voltage-Min (Vsup)1.14V
- Number of I/O138
- Speed166MHz
- RAM Size64KB
- Core ProcessorARM® Cortex®-M3
- PeripheralsDDR, PCIe, SERDES
- ConnectivityCANbus, Ethernet, I2C, SPI, UART/USART, USB
- ArchitectureMCU, FPGA
- Number of Inputs138
- Programmable Logic TypeFIELD PROGRAMMABLE GATE ARRAY
- Primary AttributesFPGA - 25K Logic Modules
- Number of Logic Cells27696
- Flash Size256KB
- Height Seated (Max)1.56mm
- Length14mm
- Width14mm
- RoHS StatusRoHS Compliant
This SoC is built on ARM? Cortex?-M3 core processor(s).
A core processor(s) ARM? Cortex?-M3 is integrated into this SoC.Its package is 256-LBGA.Users will enjoy reliable performance with this SoC chip, which has implemented 64KB RAM.The internal architecture of this SoC design is based on the MCU, FPGA technique.SmartFusion?2 is the series name of this system on chip SoC.It is expected that this SoC meaning will operate at 0°C~85°C TJ on average.There is one thing to note about this SoC security: it combines FPGA - 25K Logic Modules.A state-of-the-art Tray package houses this SoC system on a chip.This SoC part contains a total of 138 I/Os in total.Use a power supply with a voltage of 1.2V if possible.There is no safe voltage for the SoCs wireless above 1.26V.At least 1.14V can be supplied as a power source.It is possible to configure FIELD PROGRAMMABLE GATE ARRAY to meet specific needs during the design process.As a result, there are 256 terminations in total, which does really benefit system on a chip.The system on a chip capability is outstanding just like it is for other high-quality Field Programmable Gate Arrays.There are 138 outputs available on this SoC.System on chip requires 1.2V power supplies.A SoC chip with 138 inputs is available to the user.27696 logic cells are present in logic system on chips.There is a flash of 256KB.Further features of this SoC processor are LG-MIN, WD-MIN.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
LG-MIN, WD-MIN
There are a lot of Microsemi Corporation
M2S025T-1VFG256 System On Chip (SoC) applications.
Level
Smart appliances
Networked sensors
Test and Measurement
Robotics
Automotive
Efficient hardware for training of neural networks
Cyber security for critical applications in the aerospace
Medical
Embedded systems
A core processor(s) ARM? Cortex?-M3 is integrated into this SoC.Its package is 256-LBGA.Users will enjoy reliable performance with this SoC chip, which has implemented 64KB RAM.The internal architecture of this SoC design is based on the MCU, FPGA technique.SmartFusion?2 is the series name of this system on chip SoC.It is expected that this SoC meaning will operate at 0°C~85°C TJ on average.There is one thing to note about this SoC security: it combines FPGA - 25K Logic Modules.A state-of-the-art Tray package houses this SoC system on a chip.This SoC part contains a total of 138 I/Os in total.Use a power supply with a voltage of 1.2V if possible.There is no safe voltage for the SoCs wireless above 1.26V.At least 1.14V can be supplied as a power source.It is possible to configure FIELD PROGRAMMABLE GATE ARRAY to meet specific needs during the design process.As a result, there are 256 terminations in total, which does really benefit system on a chip.The system on a chip capability is outstanding just like it is for other high-quality Field Programmable Gate Arrays.There are 138 outputs available on this SoC.System on chip requires 1.2V power supplies.A SoC chip with 138 inputs is available to the user.27696 logic cells are present in logic system on chips.There is a flash of 256KB.Further features of this SoC processor are LG-MIN, WD-MIN.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
LG-MIN, WD-MIN
There are a lot of Microsemi Corporation
M2S025T-1VFG256 System On Chip (SoC) applications.
Level
Smart appliances
Networked sensors
Test and Measurement
Robotics
Automotive
Efficient hardware for training of neural networks
Cyber security for critical applications in the aerospace
Medical
Embedded systems
M2S025T-1VFG256 More Descriptions
M2S025T-1Vfg256 256 Lfbga 14X14X1.56Mm Tray Rohs Compliant: Yes |Microchip M2S025T-1VFG256
SmartFusion2 SoC FPGA, ARM Cortex-M3, 27.6KLEs
IC SOC CORTEX-M3 166MHZ 256FBGA
SmartFusion2 SoC FPGA, ARM Cortex-M3, 27.6KLEs
IC SOC CORTEX-M3 166MHZ 256FBGA
The three parts on the right have similar specifications to M2S025T-1VFG256.
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ImagePart NumberManufacturerFactory Lead TimePackage / CaseSurface MountOperating TemperaturePackagingPublishedSeriesJESD-609 CodePart StatusMoisture Sensitivity Level (MSL)Number of TerminationsTerminal FinishAdditional FeatureHTS CodeSubcategoryTechnologyTerminal PositionTerminal FormPeak Reflow Temperature (Cel)Supply VoltageTerminal PitchReflow Temperature-Max (s)JESD-30 CodeNumber of OutputsQualification StatusSupply Voltage-Max (Vsup)Power SuppliesSupply Voltage-Min (Vsup)Number of I/OSpeedRAM SizeCore ProcessorPeripheralsConnectivityArchitectureNumber of InputsProgrammable Logic TypePrimary AttributesNumber of Logic CellsFlash SizeHeight Seated (Max)LengthWidthRoHS StatusLifecycle StatusSupplier Device PackageMax Operating TemperatureMin Operating TemperatureFrequencyBase Part NumberInterfaceCore ArchitectureView Compare
-
M2S025T-1VFG25610 Weeks256-LBGAYES0°C~85°C TJTray2015SmartFusion®2e3Active3 (168 Hours)256MATTE TINLG-MIN, WD-MIN8542.39.00.01Field Programmable Gate ArraysCMOSBOTTOMBALLNOT SPECIFIED1.2V0.8mmNOT SPECIFIEDS-PBGA-B256138Not Qualified1.26V1.2V1.14V138166MHz64KBARM® Cortex®-M3DDR, PCIe, SERDESCANbus, Ethernet, I2C, SPI, UART/USART, USBMCU, FPGA138FIELD PROGRAMMABLE GATE ARRAYFPGA - 25K Logic Modules27696256KB1.56mm14mm14mmRoHS Compliant---------
-
10 Weeks144-LQFPYES0°C~85°C TJTray2015SmartFusion®2e3Active3 (168 Hours)144MATTE TIN-8542.39.00.01Field Programmable Gate ArraysCMOSQUADGULL WINGNOT SPECIFIED1.2V0.5mmNOT SPECIFIEDS-PQFP-G14484Not Qualified1.26V1.2V1.14V84166MHz64KBARM® Cortex®-M3DDR, PCIe, SERDESCANbus, Ethernet, I2C, SPI, UART/USART, USBMCU, FPGA84FIELD PROGRAMMABLE GATE ARRAYFPGA - 10K Logic Modules-256KB1.6mm20mm20mmRoHS CompliantIN PRODUCTION (Last Updated: 1 month ago)-------
-
8 Weeks896-BGAYES-40°C~100°C TJTray-SmartFusion®2e3Active3 (168 Hours)896MATTE TIN-8542.39.00.01Field Programmable Gate ArraysCMOSBOTTOMBALLNOT SPECIFIED1.2V1mmNOT SPECIFIEDS-PBGA-B896377Not Qualified1.26V1.2V1.14V377166MHz64KBARM® Cortex®-M3DDR, PCIe, SERDESCANbus, Ethernet, I2C, SPI, UART/USART, USBMCU, FPGA377FIELD PROGRAMMABLE GATE ARRAYFPGA - 50K Logic Modules56340256KB2.44mm31mm31mmRoHS CompliantIN PRODUCTION (Last Updated: 2 weeks ago)-------
-
-484-BGA--40°C~100°C TJTray-SmartFusion®2-Obsolete3 (168 Hours)------------------267166MHz64KBARM® Cortex®-M3DDR, PCIe, SERDESCANbus, Ethernet, I2C, SPI, UART/USART, USBMCU, FPGA--FPGA - 90K Logic Modules-512KB---RoHS Compliant-484-FPBGA (23x23)100°C-40°C166MHzM2S090SCAN, Ethernet, I2C, SPI, UART, USART, USBARM
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