Microsemi Corporation M2S010TS-VF256

This SoC is built on ARM? Cortex?-M3 core processor(s).
The package or case for this particular electronic component is a 256-LFBGA, which stands for Low Profile Fine-Pitch Ball Grid Array. It is designed to be placed on a tray for easy handling and storage. This component belongs to the SmartFusion®2 series, which is known for its advanced technology. It utilizes CMOS technology, which is a type of integrated circuit that allows for low power consumption and high speeds. The reflow temperature for this component is not specified, meaning it can withstand a wide range of temperatures without causing damage. It has 138 outputs and is equipped with various peripherals such as DDR, PCIe, and SERDES. Its architecture combines the features of a microcontroller unit (MCU) and a field-programmable gate array (FPGA). With 12084 logic cells, this component is capable of performing complex functions. Its maximum seated height is 1.56mm, making it a compact and efficient choice for electronic devices.

ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
LG-MIN, WD-MIN

There are a lot of Microsemi Corporation
M2S010TS-VF256 System On Chip (SoC) applications.

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