Microsemi Corporation M2S010TS-FGG484

This SoC is built on ARM? Cortex?-M3 core processor(s).
A core processor ARM? Cortex?-M3 is used to build this SoC.There is a 484-BGA package assigned to this system on a chip by the manufacturer.The 64KB RAM implementation of this SoC chip ensures efficient performance for users.A MCU, FPGA technique is used for the SoC design's internal architecture.It is part of the SmartFusion?2 series of system on a chips.Typical operating temperatures for this SoC meaning should be 0°C~85°C TJ.This SoC security combines FPGA - 10K Logic Modules and that is something to note.Housed in the state-of-art Tray package.233 I/Os in total are included in this SoC part.A power supply with a 1.2V voltage rating should be utilized when using this system on chip SoC.The SoCs wireless is considered unreliable if the voltage exceeds 1.26V.Power supplies of at least 1.14V are required.It is possible to configure FIELD PROGRAMMABLE GATE ARRAY to meet specific needs during the design process.In total, there are 484 terminations, which makes system on a chip possible.There is no doubt that this system on a chip is outstanding, just as other high-quality Field Programmable Gate Arrays will do.The SoC chip that comes with this module can be configured to have 233 outputs.In order to operate system on chip, you will need 1.2V power supplies.The SoC chip offers 233 inputs.There are 12084 logic cells in the logic system on chips.The flash is set to 256KB.

ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.

There are a lot of Microsemi Corporation
M2S010TS-FGG484 System On Chip (SoC) applications.

Industrial AC-DC
High-end PLC
Communication interfaces ( I2C, SPI )
Smart appliances
Temperature
Central alarm system
Video Imaging
Healthcare
Smartphone accessories
Mobile market