M2S010TS-1FGG484M

Microsemi Corporation M2S010TS-1FGG484M

Part Number:
M2S010TS-1FGG484M
Manufacturer:
Microsemi Corporation
Ventron No:
3669268-M2S010TS-1FGG484M
Description:
IC FPGA SOC 10K LUTS 484FBGA
ECAD Model:
Datasheet:
M2S010TS-1FGG484M

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Specifications
Microsemi Corporation M2S010TS-1FGG484M technical specifications, attributes, parameters and parts with similar specifications to Microsemi Corporation M2S010TS-1FGG484M.
  • Factory Lead Time
    10 Weeks
  • Package / Case
    484-BGA
  • Surface Mount
    YES
  • Operating Temperature
    -55°C~125°C TJ
  • Packaging
    Tray
  • Series
    SmartFusion®2
  • JESD-609 Code
    e3
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    484
  • ECCN Code
    3A001.A.2.C
  • Terminal Finish
    MATTE TIN
  • HTS Code
    8542.39.00.01
  • Subcategory
    Field Programmable Gate Arrays
  • Technology
    CMOS
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Supply Voltage
    1.2V
  • Terminal Pitch
    1mm
  • Reflow Temperature-Max (s)
    NOT SPECIFIED
  • JESD-30 Code
    S-PBGA-B484
  • Number of Outputs
    233
  • Qualification Status
    Not Qualified
  • Supply Voltage-Max (Vsup)
    1.26V
  • Power Supplies
    1.2V
  • Supply Voltage-Min (Vsup)
    1.14V
  • Number of I/O
    233
  • Speed
    166MHz
  • RAM Size
    64KB
  • Core Processor
    ARM® Cortex®-M3
  • Peripherals
    DDR, PCIe, SERDES
  • Connectivity
    CANbus, Ethernet, I2C, SPI, UART/USART, USB
  • Architecture
    MCU, FPGA
  • Number of Inputs
    233
  • Programmable Logic Type
    FIELD PROGRAMMABLE GATE ARRAY
  • Primary Attributes
    FPGA - 10K Logic Modules
  • Number of Logic Cells
    12084
  • Flash Size
    256KB
  • Height Seated (Max)
    2.44mm
  • Length
    23mm
  • Width
    23mm
  • RoHS Status
    RoHS Compliant
Description
This SoC is built on ARM? Cortex?-M3 core processor(s).
The SmartFusion®2 series is a cutting-edge product that combines the power of a microcontroller and a field-programmable gate array (FPGA). It utilizes advanced CMOS technology for high performance and efficiency. The product is packaged in a tray for convenient handling and storage. The terminals are positioned at the bottom for easy integration into electronic systems. With a compact terminal pitch of 1mm, the S-PBGA-B484 JESD-30 code ensures secure connections. This product boasts 233 outputs and I/O, providing ample connectivity options. Operating at a speed of 166MHz, it offers fast and reliable processing. Its versatile architecture as an MCU and FPGA makes it suitable for a wide range of applications.

ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.

There are a lot of Microsemi Corporation
M2S010TS-1FGG484M System On Chip (SoC) applications.

CNC control
Keyboard
Avionics
Industrial transport
Mouse
Networked sensors
Remote control
System-on-chip (SoC)
ARM Cortex M4 microcontroller
Embedded systems
M2S010TS-1FGG484M More Descriptions
M2S010Ts-1Fgg484M 484 Pbga 23X23X2.44Mm Tray Rohs Compliant: Yes |Microchip M2S010TS-1FGG484M
FPGA SmartFusion2 Family 12084 Cells 65nm Technology 1.2V 484-Pin FPBGA
Field Programmable Gate Array, 12084-Cell, CMOS, PBGA484
SmartFusion2 SoC FPGA, ARM Cortex-M3, 12KLEs
IC SOC CORTEX-M3 166MHZ 484FBGA
Product Comparison
The three parts on the right have similar specifications to M2S010TS-1FGG484M.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Package / Case
    Surface Mount
    Operating Temperature
    Packaging
    Series
    JESD-609 Code
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    ECCN Code
    Terminal Finish
    HTS Code
    Subcategory
    Technology
    Terminal Position
    Terminal Form
    Peak Reflow Temperature (Cel)
    Supply Voltage
    Terminal Pitch
    Reflow Temperature-Max (s)
    JESD-30 Code
    Number of Outputs
    Qualification Status
    Supply Voltage-Max (Vsup)
    Power Supplies
    Supply Voltage-Min (Vsup)
    Number of I/O
    Speed
    RAM Size
    Core Processor
    Peripherals
    Connectivity
    Architecture
    Number of Inputs
    Programmable Logic Type
    Primary Attributes
    Number of Logic Cells
    Flash Size
    Height Seated (Max)
    Length
    Width
    RoHS Status
    Lifecycle Status
    Published
    Reach Compliance Code
    Pbfree Code
    Supplier Device Package
    Max Operating Temperature
    Min Operating Temperature
    Frequency
    Base Part Number
    Interface
    Core Architecture
    View Compare
  • M2S010TS-1FGG484M
    M2S010TS-1FGG484M
    10 Weeks
    484-BGA
    YES
    -55°C~125°C TJ
    Tray
    SmartFusion®2
    e3
    Active
    3 (168 Hours)
    484
    3A001.A.2.C
    MATTE TIN
    8542.39.00.01
    Field Programmable Gate Arrays
    CMOS
    BOTTOM
    BALL
    NOT SPECIFIED
    1.2V
    1mm
    NOT SPECIFIED
    S-PBGA-B484
    233
    Not Qualified
    1.26V
    1.2V
    1.14V
    233
    166MHz
    64KB
    ARM® Cortex®-M3
    DDR, PCIe, SERDES
    CANbus, Ethernet, I2C, SPI, UART/USART, USB
    MCU, FPGA
    233
    FIELD PROGRAMMABLE GATE ARRAY
    FPGA - 10K Logic Modules
    12084
    256KB
    2.44mm
    23mm
    23mm
    RoHS Compliant
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • M2S050TS-FG896
    4 Weeks
    896-BGA
    YES
    0°C~85°C TJ
    Tray
    SmartFusion®2
    e0
    Active
    3 (168 Hours)
    896
    -
    Tin/Lead (Sn/Pb)
    8542.39.00.01
    Field Programmable Gate Arrays
    CMOS
    BOTTOM
    BALL
    NOT SPECIFIED
    1.2V
    1mm
    NOT SPECIFIED
    S-PBGA-B896
    377
    Not Qualified
    1.26V
    1.2V
    1.14V
    377
    166MHz
    64KB
    ARM® Cortex®-M3
    DDR, PCIe, SERDES
    CANbus, Ethernet, I2C, SPI, UART/USART, USB
    MCU, FPGA
    377
    FIELD PROGRAMMABLE GATE ARRAY
    FPGA - 50K Logic Modules
    56340
    256KB
    2.44mm
    31mm
    31mm
    Non-RoHS Compliant
    IN PRODUCTION (Last Updated: 2 weeks ago)
    2015
    not_compliant
    -
    -
    -
    -
    -
    -
    -
    -
  • M2S010-TQG144I
    8 Weeks
    144-LQFP
    YES
    -40°C~100°C TJ
    Tray
    SmartFusion®2
    e3
    Active
    3 (168 Hours)
    144
    -
    MATTE TIN
    8542.39.00.01
    -
    -
    QUAD
    GULL WING
    NOT SPECIFIED
    1.2V
    0.5mm
    NOT SPECIFIED
    S-PQFP-G144
    -
    -
    1.26V
    -
    1.14V
    84
    166MHz
    64KB
    ARM® Cortex®-M3
    DDR, PCIe, SERDES
    CANbus, Ethernet, I2C, SPI, UART/USART, USB
    MCU, FPGA
    -
    FIELD PROGRAMMABLE GATE ARRAY
    FPGA - 10K Logic Modules
    -
    256KB
    1.6mm
    20mm
    20mm
    RoHS Compliant
    IN PRODUCTION (Last Updated: 2 days ago)
    2015
    -
    yes
    -
    -
    -
    -
    -
    -
    -
  • M2S025T-1FGG484I
    10 Weeks
    484-BGA
    -
    -40°C~100°C TJ
    Tray
    SmartFusion®2
    -
    Active
    3 (168 Hours)
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    267
    166MHz
    64KB
    ARM® Cortex®-M3
    DDR, PCIe, SERDES
    CANbus, Ethernet, I2C, SPI, UART/USART, USB
    MCU, FPGA
    -
    -
    FPGA - 25K Logic Modules
    -
    256KB
    -
    -
    -
    RoHS Compliant
    IN PRODUCTION (Last Updated: 1 month ago)
    2009
    -
    -
    484-FPBGA (23x23)
    100°C
    -40°C
    166MHz
    M2S025T
    CAN, Ethernet, I2C, SPI, UART, USART, USB
    ARM
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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