Microsemi Corporation M2S010TS-1FG484I
- Part Number:
- M2S010TS-1FG484I
- Manufacturer:
- Microsemi Corporation
- Ventron No:
- 3668591-M2S010TS-1FG484I
- Description:
- IC FPGA SOC 10K LUTS 484FBGA
- ECAD Model:
-
Microsemi Corporation M2S010TS-1FG484I technical specifications, attributes, parameters and parts with similar specifications to Microsemi Corporation M2S010TS-1FG484I.
- Factory Lead Time10 Weeks
- Lifecycle StatusIN PRODUCTION (Last Updated: 3 weeks ago)
- Package / Case484-BGA
- Supplier Device Package484-FPBGA (23x23)
- Operating Temperature-40°C~100°C TJ
- PackagingTray
- SeriesSmartFusion®2
- Part StatusActive
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Max Operating Temperature100°C
- Min Operating Temperature-40°C
- Frequency166MHz
- Base Part NumberM2S010TS
- InterfaceCAN, Ethernet, I2C, SPI, UART, USART, USB
- Number of I/O233
- Speed166MHz
- RAM Size64KB
- Core ProcessorARM® Cortex®-M3
- PeripheralsDDR, PCIe, SERDES
- ConnectivityCANbus, Ethernet, I2C, SPI, UART/USART, USB
- ArchitectureMCU, FPGA
- Core ArchitectureARM
- Primary AttributesFPGA - 10K Logic Modules
- Flash Size256KB
- RoHS StatusNon-RoHS Compliant
This SoC is built on ARM? Cortex?-M3 core processor(s).
The M2S010TS is a high-performance system-on-chip (SoC) product currently in production, with its last update occurring just 3 weeks ago. This compact and versatile package, measuring 484-BGA, boasts an active part status and can operate in temperatures as low as -40°C. Its base part number is M2S010TS and it is equipped with 64KB of RAM. The M2S010TS also features various peripherals, including DDR, PCIe, and SERDES, as well as a range of connectivity options such as CANbus, Ethernet, I2C, SPI, UART/USART, and USB. Additionally, it offers a flash size of 256KB. Please note that the M2S010TS is currently classified as Non-RoHS Compliant.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
Core Architecture: ARM
There are a lot of Microsemi Corporation
M2S010TS-1FG484I System On Chip (SoC) applications.
Level
Keywords
Robotics
Test and Measurement
Networked sensors
Industrial transport
Transmitters
Smart appliances
ARM Cortex M4 microcontroller
Video Imaging
The M2S010TS is a high-performance system-on-chip (SoC) product currently in production, with its last update occurring just 3 weeks ago. This compact and versatile package, measuring 484-BGA, boasts an active part status and can operate in temperatures as low as -40°C. Its base part number is M2S010TS and it is equipped with 64KB of RAM. The M2S010TS also features various peripherals, including DDR, PCIe, and SERDES, as well as a range of connectivity options such as CANbus, Ethernet, I2C, SPI, UART/USART, and USB. Additionally, it offers a flash size of 256KB. Please note that the M2S010TS is currently classified as Non-RoHS Compliant.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
Core Architecture: ARM
There are a lot of Microsemi Corporation
M2S010TS-1FG484I System On Chip (SoC) applications.
Level
Keywords
Robotics
Test and Measurement
Networked sensors
Industrial transport
Transmitters
Smart appliances
ARM Cortex M4 microcontroller
Video Imaging
M2S010TS-1FG484I More Descriptions
FPGA SmartFusion2 Family 9744 Cells 65nm (CMOS) Technology 1.2V 484-Pin FBGA
Field Programmable Gate Array, Pbga484 Rohs Compliant: Yes |Microchip M2S010TS-1FG484I
SmartFusion2 SoC FPGA, ARM Cortex-M3, 12KLEs
IC SOC CORTEX-M3 166MHZ 484FBGA
Field Programmable Gate Array, Pbga484 Rohs Compliant: Yes |Microchip M2S010TS-1FG484I
SmartFusion2 SoC FPGA, ARM Cortex-M3, 12KLEs
IC SOC CORTEX-M3 166MHZ 484FBGA
The three parts on the right have similar specifications to M2S010TS-1FG484I.
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ImagePart NumberManufacturerFactory Lead TimeLifecycle StatusPackage / CaseSupplier Device PackageOperating TemperaturePackagingSeriesPart StatusMoisture Sensitivity Level (MSL)Max Operating TemperatureMin Operating TemperatureFrequencyBase Part NumberInterfaceNumber of I/OSpeedRAM SizeCore ProcessorPeripheralsConnectivityArchitectureCore ArchitecturePrimary AttributesFlash SizeRoHS StatusSurface MountJESD-609 CodeNumber of TerminationsTerminal FinishHTS CodeSubcategoryTechnologyTerminal PositionTerminal FormPeak Reflow Temperature (Cel)Supply VoltageTerminal PitchReflow Temperature-Max (s)JESD-30 CodeNumber of OutputsQualification StatusSupply Voltage-Max (Vsup)Power SuppliesSupply Voltage-Min (Vsup)Number of InputsProgrammable Logic TypeNumber of Logic CellsHeight Seated (Max)LengthWidthPublishedView Compare
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M2S010TS-1FG484I10 WeeksIN PRODUCTION (Last Updated: 3 weeks ago)484-BGA484-FPBGA (23x23)-40°C~100°C TJTraySmartFusion®2Active3 (168 Hours)100°C-40°C166MHzM2S010TSCAN, Ethernet, I2C, SPI, UART, USART, USB233166MHz64KBARM® Cortex®-M3DDR, PCIe, SERDESCANbus, Ethernet, I2C, SPI, UART/USART, USBMCU, FPGAARMFPGA - 10K Logic Modules256KBNon-RoHS Compliant--------------------------- -
8 WeeksIN PRODUCTION (Last Updated: 2 weeks ago)896-BGA--40°C~100°C TJTraySmartFusion®2Active3 (168 Hours)-----377166MHz64KBARM® Cortex®-M3DDR, PCIe, SERDESCANbus, Ethernet, I2C, SPI, UART/USART, USBMCU, FPGA-FPGA - 50K Logic Modules256KBRoHS CompliantYESe3896MATTE TIN8542.39.00.01Field Programmable Gate ArraysCMOSBOTTOMBALLNOT SPECIFIED1.2V1mmNOT SPECIFIEDS-PBGA-B896377Not Qualified1.26V1.2V1.14V377FIELD PROGRAMMABLE GATE ARRAY563402.44mm31mm31mm-
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8 WeeksIN PRODUCTION (Last Updated: 1 month ago)484-BGA484-FPBGA (23x23)0°C~85°C TJTraySmartFusion®2Active3 (168 Hours)85°C0°C166MHzM2S025CAN, Ethernet, I2C, SPI, UART, USART, USB267166MHz64KBARM® Cortex®-M3DDR, PCIe, SERDESCANbus, Ethernet, I2C, SPI, UART/USART, USBMCU, FPGAARMFPGA - 25K Logic Modules256KBNon-RoHS Compliant-------------------------2009
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10 WeeksIN PRODUCTION (Last Updated: 1 month ago)484-BGA484-FPBGA (23x23)-40°C~100°C TJTraySmartFusion®2Active3 (168 Hours)100°C-40°C166MHzM2S025TCAN, Ethernet, I2C, SPI, UART, USART, USB267166MHz64KBARM® Cortex®-M3DDR, PCIe, SERDESCANbus, Ethernet, I2C, SPI, UART/USART, USBMCU, FPGAARMFPGA - 25K Logic Modules256KBRoHS Compliant-------------------------2009
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