Microsemi Corporation M2S010-1FG484
- Part Number:
- M2S010-1FG484
- Manufacturer:
- Microsemi Corporation
- Ventron No:
- 3828126-M2S010-1FG484
- Description:
- IC FPGA SOC 10K LUTS 484FBGA
- Datasheet:
- SmartFusion2 Pin Descriptions
Microsemi Corporation M2S010-1FG484 technical specifications, attributes, parameters and parts with similar specifications to Microsemi Corporation M2S010-1FG484.
- Factory Lead Time8 Weeks
- Lifecycle StatusIN PRODUCTION (Last Updated: 3 weeks ago)
- Package / Case484-BGA
- Supplier Device Package484-FPBGA (23x23)
- Operating Temperature0°C~85°C TJ
- PackagingTray
- Published2009
- SeriesSmartFusion®2
- Part StatusActive
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Max Operating Temperature85°C
- Min Operating Temperature0°C
- Frequency166MHz
- Base Part NumberM2S010
- InterfaceCAN, Ethernet, I2C, SPI, UART, USART, USB
- Number of I/O233
- Speed166MHz
- RAM Size64KB
- Core ProcessorARM® Cortex®-M3
- PeripheralsDDR, PCIe, SERDES
- ConnectivityCANbus, Ethernet, I2C, SPI, UART/USART, USB
- ArchitectureMCU, FPGA
- Core ArchitectureARM
- Primary AttributesFPGA - 10K Logic Modules
- Flash Size256KB
- RoHS StatusNon-RoHS Compliant
This SoC is built on ARM? Cortex?-M3 core processor(s).
The 484-BGA package/case, published in 2009, offers a reliable and efficient solution for electronic devices. The package is designed to withstand 3 (168 hours) of Moisture Sensitivity Level (MSL), ensuring durability and longevity. With a minimum operating temperature of 0°C, this package is suitable for a wide range of applications. The product features a frequency of 166MHz and is equipped with a powerful ARM® Cortex®-M3 core processor. The package also includes a flash size of 256KB, providing ample space for data storage. It is important to note that this product is Non-RoHS compliant, ensuring its compliance with environmental regulations. Overall, the 484-BGA package offers a high-quality and versatile solution for various electronic devices.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
Core Architecture: ARM
There are a lot of Microsemi Corporation
M2S010-1FG484 System On Chip (SoC) applications.
POS Terminals
Digital Media
Networked Media Encode/Decode
Self-aware system-on-chip (SoC)
AC drive control module
Smart appliances
Keywords
Video Imaging
Deep learning hardware
Cyberphysical system-on-chip
The 484-BGA package/case, published in 2009, offers a reliable and efficient solution for electronic devices. The package is designed to withstand 3 (168 hours) of Moisture Sensitivity Level (MSL), ensuring durability and longevity. With a minimum operating temperature of 0°C, this package is suitable for a wide range of applications. The product features a frequency of 166MHz and is equipped with a powerful ARM® Cortex®-M3 core processor. The package also includes a flash size of 256KB, providing ample space for data storage. It is important to note that this product is Non-RoHS compliant, ensuring its compliance with environmental regulations. Overall, the 484-BGA package offers a high-quality and versatile solution for various electronic devices.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
Core Architecture: ARM
There are a lot of Microsemi Corporation
M2S010-1FG484 System On Chip (SoC) applications.
POS Terminals
Digital Media
Networked Media Encode/Decode
Self-aware system-on-chip (SoC)
AC drive control module
Smart appliances
Keywords
Video Imaging
Deep learning hardware
Cyberphysical system-on-chip
M2S010-1FG484 More Descriptions
FPGA SmartFusion2 Family 9744 Cells 65nm (CMOS) Technology 1.2V 484-Pin FBGA
M2S010-1Fg484 484 Pbga 23X23X2.44Mm Tray Rohs Compliant: Yes |Microchip M2S010-1FG484
SmartFusion2 SoC FPGA, ARM Cortex-M3, 12KLEs
IC SOC CORTEX-M3 166MHZ 484FBGA
M2S010-1Fg484 484 Pbga 23X23X2.44Mm Tray Rohs Compliant: Yes |Microchip M2S010-1FG484
SmartFusion2 SoC FPGA, ARM Cortex-M3, 12KLEs
IC SOC CORTEX-M3 166MHZ 484FBGA
The three parts on the right have similar specifications to M2S010-1FG484.
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ImagePart NumberManufacturerFactory Lead TimeLifecycle StatusPackage / CaseSupplier Device PackageOperating TemperaturePackagingPublishedSeriesPart StatusMoisture Sensitivity Level (MSL)Max Operating TemperatureMin Operating TemperatureFrequencyBase Part NumberInterfaceNumber of I/OSpeedRAM SizeCore ProcessorPeripheralsConnectivityArchitectureCore ArchitecturePrimary AttributesFlash SizeRoHS StatusSurface MountJESD-609 CodePbfree CodeNumber of TerminationsTerminal FinishHTS CodeTerminal PositionTerminal FormPeak Reflow Temperature (Cel)Supply VoltageTerminal PitchReach Compliance CodeReflow Temperature-Max (s)JESD-30 CodeSupply Voltage-Max (Vsup)Supply Voltage-Min (Vsup)Programmable Logic TypeHeight Seated (Max)LengthWidthSubcategoryTechnologyNumber of OutputsQualification StatusPower SuppliesNumber of InputsNumber of Logic CellsView Compare
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M2S010-1FG4848 WeeksIN PRODUCTION (Last Updated: 3 weeks ago)484-BGA484-FPBGA (23x23)0°C~85°C TJTray2009SmartFusion®2Active3 (168 Hours)85°C0°C166MHzM2S010CAN, Ethernet, I2C, SPI, UART, USART, USB233166MHz64KBARM® Cortex®-M3DDR, PCIe, SERDESCANbus, Ethernet, I2C, SPI, UART/USART, USBMCU, FPGAARMFPGA - 10K Logic Modules256KBNon-RoHS Compliant----------------------------
-
-OBSOLETE (Last Updated: 3 weeks ago)144-LQFP--40°C~100°C TJTray2015SmartFusion®2Obsolete3 (168 Hours)-----84166MHz64KBARM® Cortex®-M3DDRCANbus, Ethernet, I2C, SPI, UART/USART, USBMCU, FPGA-FPGA - 5K Logic Modules128KBNon-RoHS CompliantYESe0no144Tin/Lead (Sn/Pb)8542.39.00.01QUADGULL WINGNOT SPECIFIED1.2V0.5mmnot_compliantNOT SPECIFIEDS-PQFP-G1441.26V1.14VFIELD PROGRAMMABLE GATE ARRAY1.6mm20mm20mm-------
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10 WeeksIN PRODUCTION (Last Updated: 1 month ago)144-LQFP-0°C~85°C TJTray2015SmartFusion®2Active3 (168 Hours)-----84166MHz64KBARM® Cortex®-M3DDR, PCIe, SERDESCANbus, Ethernet, I2C, SPI, UART/USART, USBMCU, FPGA-FPGA - 10K Logic Modules256KBRoHS CompliantYESe3-144MATTE TIN8542.39.00.01QUADGULL WINGNOT SPECIFIED1.2V0.5mm-NOT SPECIFIEDS-PQFP-G1441.26V1.14VFIELD PROGRAMMABLE GATE ARRAY1.6mm20mm20mmField Programmable Gate ArraysCMOS84Not Qualified1.2V84-
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8 WeeksIN PRODUCTION (Last Updated: 2 weeks ago)896-BGA--40°C~100°C TJTray-SmartFusion®2Active3 (168 Hours)-----377166MHz64KBARM® Cortex®-M3DDR, PCIe, SERDESCANbus, Ethernet, I2C, SPI, UART/USART, USBMCU, FPGA-FPGA - 50K Logic Modules256KBRoHS CompliantYESe3-896MATTE TIN8542.39.00.01BOTTOMBALLNOT SPECIFIED1.2V1mm-NOT SPECIFIEDS-PBGA-B8961.26V1.14VFIELD PROGRAMMABLE GATE ARRAY2.44mm31mm31mmField Programmable Gate ArraysCMOS377Not Qualified1.2V37756340
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