Microsemi Corporation M2S005S-1FGG484T2
- Part Number:
- M2S005S-1FGG484T2
- Manufacturer:
- Microsemi Corporation
- Ventron No:
- 3668762-M2S005S-1FGG484T2
- Description:
- IC FPGA SOC
- Datasheet:
- SmartFusion2 Automotive Grade 2 Brief
Microsemi Corporation M2S005S-1FGG484T2 technical specifications, attributes, parameters and parts with similar specifications to Microsemi Corporation M2S005S-1FGG484T2.
- Factory Lead Time12 Weeks
- Lifecycle StatusIN PRODUCTION (Last Updated: 1 month ago)
- Package / Case484-BGA
- Operating Temperature-40°C~125°C TJ
- PackagingTray
- SeriesAutomotive, AEC-Q100, SmartFusion®2
- Pbfree Codeyes
- Part StatusActive
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Peak Reflow Temperature (Cel)NOT SPECIFIED
- Reflow Temperature-Max (s)NOT SPECIFIED
- Number of I/O209
- Speed166MHz
- RAM Size64KB
- Core ProcessorARM® Cortex®-M3
- PeripheralsDDR
- ConnectivityCANbus, Ethernet, I2C, SPI, UART/USART, USB
- ArchitectureMCU, FPGA
- Programmable Logic TypeFIELD PROGRAMMABLE GATE ARRAY
- Primary AttributesFPGA - 5K Logic Modules
- Flash Size128KB
- RoHS StatusRoHS Compliant
This SoC is built on ARM? Cortex?-M3 core processor(s).
The Automotive AEC-Q100 SmartFusion®2 series is a highly reliable and versatile product designed for automotive applications. With an active part status, it ensures availability and ongoing support. The peak reflow temperature and reflow temperature-max are not specified, allowing for flexibility in various manufacturing processes. Boasting 209 I/Os, this product offers extensive connectivity options. Operating at a speed of 166MHz, it delivers high-performance capabilities. The SmartFusion®2 series features DDR peripherals and a field-programmable gate array (FPGA) for enhanced programmability. Its primary attribute is the FPGA, which includes 5K logic modules, enabling complex designs. Additionally, it offers a flash size of 128KB for data storage and processing.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
128KB extended flash.
There are a lot of Microsemi Corporation
M2S005S-1FGG484T2 System On Chip (SoC) applications.
Microprocessors
Central alarm system
Healthcare
Defense
Avionics
Digital Media
Networked Media Encode/Decode
RISC-V
Body control module
Wireless sensor networks
The Automotive AEC-Q100 SmartFusion®2 series is a highly reliable and versatile product designed for automotive applications. With an active part status, it ensures availability and ongoing support. The peak reflow temperature and reflow temperature-max are not specified, allowing for flexibility in various manufacturing processes. Boasting 209 I/Os, this product offers extensive connectivity options. Operating at a speed of 166MHz, it delivers high-performance capabilities. The SmartFusion®2 series features DDR peripherals and a field-programmable gate array (FPGA) for enhanced programmability. Its primary attribute is the FPGA, which includes 5K logic modules, enabling complex designs. Additionally, it offers a flash size of 128KB for data storage and processing.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
128KB extended flash.
There are a lot of Microsemi Corporation
M2S005S-1FGG484T2 System On Chip (SoC) applications.
Microprocessors
Central alarm system
Healthcare
Defense
Avionics
Digital Media
Networked Media Encode/Decode
RISC-V
Body control module
Wireless sensor networks
M2S005S-1FGG484T2 More Descriptions
FPGA SmartFusion2 Family 6060 Cells 65nm Technology 1.2V 484-Pin FBGA
SmartFusion2 SoC and IGLOO2 FPGA Automotive Grade 2
IC SOC CORTEX-M3 166MHZ 144TQFP
SmartFusion2 SoC and IGLOO2 FPGA Automotive Grade 2
IC SOC CORTEX-M3 166MHZ 144TQFP
The three parts on the right have similar specifications to M2S005S-1FGG484T2.
-
ImagePart NumberManufacturerFactory Lead TimeLifecycle StatusPackage / CaseOperating TemperaturePackagingSeriesPbfree CodePart StatusMoisture Sensitivity Level (MSL)Peak Reflow Temperature (Cel)Reflow Temperature-Max (s)Number of I/OSpeedRAM SizeCore ProcessorPeripheralsConnectivityArchitectureProgrammable Logic TypePrimary AttributesFlash SizeRoHS StatusSurface MountJESD-609 CodeNumber of TerminationsTerminal FinishHTS CodeSubcategoryTechnologyTerminal PositionTerminal FormSupply VoltageTerminal PitchJESD-30 CodeNumber of OutputsQualification StatusSupply Voltage-Max (Vsup)Power SuppliesSupply Voltage-Min (Vsup)Number of InputsNumber of Logic CellsHeight Seated (Max)LengthWidthSupplier Device PackagePublishedMax Operating TemperatureMin Operating TemperatureFrequencyBase Part NumberInterfaceCore ArchitectureView Compare
-
M2S005S-1FGG484T212 WeeksIN PRODUCTION (Last Updated: 1 month ago)484-BGA-40°C~125°C TJTrayAutomotive, AEC-Q100, SmartFusion®2yesActive3 (168 Hours)NOT SPECIFIEDNOT SPECIFIED209166MHz64KBARM® Cortex®-M3DDRCANbus, Ethernet, I2C, SPI, UART/USART, USBMCU, FPGAFIELD PROGRAMMABLE GATE ARRAYFPGA - 5K Logic Modules128KBRoHS Compliant-------------------------------
-
8 WeeksIN PRODUCTION (Last Updated: 2 weeks ago)896-BGA-40°C~100°C TJTraySmartFusion®2-Active3 (168 Hours)NOT SPECIFIEDNOT SPECIFIED377166MHz64KBARM® Cortex®-M3DDR, PCIe, SERDESCANbus, Ethernet, I2C, SPI, UART/USART, USBMCU, FPGAFIELD PROGRAMMABLE GATE ARRAYFPGA - 50K Logic Modules256KBRoHS CompliantYESe3896MATTE TIN8542.39.00.01Field Programmable Gate ArraysCMOSBOTTOMBALL1.2V1mmS-PBGA-B896377Not Qualified1.26V1.2V1.14V377563402.44mm31mm31mm--------
-
8 WeeksIN PRODUCTION (Last Updated: 1 month ago)484-BGA0°C~85°C TJTraySmartFusion®2-Active3 (168 Hours)--267166MHz64KBARM® Cortex®-M3DDR, PCIe, SERDESCANbus, Ethernet, I2C, SPI, UART/USART, USBMCU, FPGA-FPGA - 25K Logic Modules256KBNon-RoHS Compliant----------------------484-FPBGA (23x23)200985°C0°C166MHzM2S025CAN, Ethernet, I2C, SPI, UART, USART, USBARM
-
10 WeeksIN PRODUCTION (Last Updated: 1 month ago)484-BGA-40°C~100°C TJTraySmartFusion®2-Active3 (168 Hours)--267166MHz64KBARM® Cortex®-M3DDR, PCIe, SERDESCANbus, Ethernet, I2C, SPI, UART/USART, USBMCU, FPGA-FPGA - 25K Logic Modules256KBRoHS Compliant----------------------484-FPBGA (23x23)2009100°C-40°C166MHzM2S025TCAN, Ethernet, I2C, SPI, UART, USART, USBARM
Popular Search Part Number
Related Keywords
Search Tags
Latest News
-
21 September 2023
8 bit AVR Microcontroller ATMEGA32U4-AU
Ⅰ. Overview of ATMEGA32U4-AUⅡ. Symbol and Footprint of ATMEGA32U4-AUⅢ. Technical parametersⅣ. Features of ATMEGA32U4-AUⅤ. Pin descriptionⅥ. What types of products is ATMEGA32U4-AU suitable for?Ⅰ. Overview of ATMEGA32U4-AUATMEGA32U4-AU is... -
21 September 2023
Difference Between 2N2222 and BC547 Transistor
Ⅰ. What is 2N2222?Ⅱ. What is BC547?Ⅲ. 2N2222 vs BC547 symbolⅣ. 2N2222 vs BC547 technical parametersⅤ. 2N2222 vs BC547 pin comparisonⅥ. 2N2222 vs BC547 featuresⅦ. 2N2222 vs BC547... -
22 September 2023
Power Transistor IC LM317LZ: Symbol, Features and Package
Ⅰ. Overview of LM317LZⅡ. Symbol and Footprint of LM317LZⅢ. Technical parametersⅣ. Features of LM317LZⅤ. Pins and package of LM317LZⅥ. Advantages and disadvantages of LM317LZⅦ. How to optimize the... -
22 September 2023
LM301AN Operational Amplifier: Equivalent, Circuit and Package
Ⅰ. What is LM301AN?Ⅱ. Symbol, footprint and pin connection of LM301ANⅢ. Technical parametersⅣ. LM301AN tone control circuitⅤ. Features of LM301ANⅥ. What is the difference between LM301AN and LM709?Ⅶ....
Help you to save your cost and time.
Reliable package for your goods.
Fast Reliable Delivery to save time.
Quality premium after-sale service.