Microsemi Corporation M2S005-FGG484
- Part Number:
- M2S005-FGG484
- Manufacturer:
- Microsemi Corporation
- Ventron No:
- 3828032-M2S005-FGG484
- Description:
- IC FPGA SOC 5K LUTS 484FBGA
Microsemi Corporation M2S005-FGG484 technical specifications, attributes, parameters and parts with similar specifications to Microsemi Corporation M2S005-FGG484.
- Factory Lead Time11 Weeks
- Lifecycle StatusIN PRODUCTION (Last Updated: 1 month ago)
- Package / Case484-BGA
- Number of Pins484
- Supplier Device Package484-FPBGA (23x23)
- Operating Temperature0°C~85°C TJ
- PackagingTray
- Published2009
- SeriesSmartFusion®2
- Part StatusActive
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Max Operating Temperature85°C
- Min Operating Temperature0°C
- Frequency166MHz
- Base Part NumberM2S005
- Operating Supply Voltage1.2V
- InterfaceCAN, Ethernet, I2C, SPI, UART, USART, USB
- Memory Size23.9kB
- Number of I/O209
- Speed166MHz
- RAM Size64KB
- Core ProcessorARM® Cortex®-M3
- PeripheralsDDR
- ConnectivityCANbus, Ethernet, I2C, SPI, UART/USART, USB
- ArchitectureMCU, FPGA
- Number of Logic Elements/Cells6060
- Core ArchitectureARM
- Number of Logic Blocks (LABs)505
- Primary AttributesFPGA - 5K Logic Modules
- Flash Size128KB
- Length23mm
- Width23mm
- RoHS StatusRoHS Compliant
This SoC is built on ARM? Cortex?-M3 core processor(s).
A core processor ARM? Cortex?-M3 is embedded in this SoC.According to the manufacturer, this system on a chip has a package of 484-BGA.The SoC chip provides users with reliable performance because it is implemented with 64KB RAM.The internal architecture of this SoC design utilizes the MCU, FPGA technique.It is a member of the SmartFusion?2 series.Typical operating temperatures for this SoC meaning should be 0°C~85°C TJ.It is important to note that this SoC security combines FPGA - 5K Logic Modules.An advanced Tray package houses this SoC system on a chip.As a whole, this SoC part includes 209 I/Os.A flashing 128KB appears on it.A search for M2S005 will result in system on chips that have similar specs and purposes.A frequency of 166MHz is used by the wireless SoC to operate.The SoC meaning is based on the core architecture of ARM.There is a 484-pin version of this computer SoC available.In order for the SoC computing to start, 0°C is just about right.This SoC system on chip is designed to operate at a temperature of 85°C.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
128KB extended flash.
Core Architecture: ARM
There are a lot of Microsemi Corporation
M2S005-FGG484 System On Chip (SoC) applications.
Medical
POS Terminals
Networked sensors
Wireless sensor networks
Medical
Smartphone accessories
AC drive control module
PC peripherals
Functional safety for critical applications in the industrial sectors
Vending machines
A core processor ARM? Cortex?-M3 is embedded in this SoC.According to the manufacturer, this system on a chip has a package of 484-BGA.The SoC chip provides users with reliable performance because it is implemented with 64KB RAM.The internal architecture of this SoC design utilizes the MCU, FPGA technique.It is a member of the SmartFusion?2 series.Typical operating temperatures for this SoC meaning should be 0°C~85°C TJ.It is important to note that this SoC security combines FPGA - 5K Logic Modules.An advanced Tray package houses this SoC system on a chip.As a whole, this SoC part includes 209 I/Os.A flashing 128KB appears on it.A search for M2S005 will result in system on chips that have similar specs and purposes.A frequency of 166MHz is used by the wireless SoC to operate.The SoC meaning is based on the core architecture of ARM.There is a 484-pin version of this computer SoC available.In order for the SoC computing to start, 0°C is just about right.This SoC system on chip is designed to operate at a temperature of 85°C.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
128KB extended flash.
Core Architecture: ARM
There are a lot of Microsemi Corporation
M2S005-FGG484 System On Chip (SoC) applications.
Medical
POS Terminals
Networked sensors
Wireless sensor networks
Medical
Smartphone accessories
AC drive control module
PC peripherals
Functional safety for critical applications in the industrial sectors
Vending machines
M2S005-FGG484 More Descriptions
FPGA SmartFusion2 Family 6060 Cells 65nm Technology 1.2V 484-Pin FBGA Tray
SmartFusion2 SoC FPGA, ARM Cortex-M3, 6KLEs
M2S005-Fgg484 484 Pbga 23X23X2.44Mm Tray Rohs Compliant: Yes |Microchip M2S005-FGG484
IC SOC CORTEX-M3 166MHZ 400VFBGA
SmartFusion2 SoC FPGA, ARM Cortex-M3, 6KLEs
M2S005-Fgg484 484 Pbga 23X23X2.44Mm Tray Rohs Compliant: Yes |Microchip M2S005-FGG484
IC SOC CORTEX-M3 166MHZ 400VFBGA
The three parts on the right have similar specifications to M2S005-FGG484.
-
ImagePart NumberManufacturerFactory Lead TimeLifecycle StatusPackage / CaseNumber of PinsSupplier Device PackageOperating TemperaturePackagingPublishedSeriesPart StatusMoisture Sensitivity Level (MSL)Max Operating TemperatureMin Operating TemperatureFrequencyBase Part NumberOperating Supply VoltageInterfaceMemory SizeNumber of I/OSpeedRAM SizeCore ProcessorPeripheralsConnectivityArchitectureNumber of Logic Elements/CellsCore ArchitectureNumber of Logic Blocks (LABs)Primary AttributesFlash SizeLengthWidthRoHS StatusSurface MountJESD-609 CodeNumber of TerminationsTerminal FinishHTS CodeSubcategoryTechnologyTerminal PositionTerminal FormPeak Reflow Temperature (Cel)Supply VoltageTerminal PitchReflow Temperature-Max (s)JESD-30 CodeNumber of OutputsQualification StatusSupply Voltage-Max (Vsup)Power SuppliesSupply Voltage-Min (Vsup)Number of InputsProgrammable Logic TypeNumber of Logic CellsHeight Seated (Max)Pbfree CodeReach Compliance CodeView Compare
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M2S005-FGG48411 WeeksIN PRODUCTION (Last Updated: 1 month ago)484-BGA484484-FPBGA (23x23)0°C~85°C TJTray2009SmartFusion®2Active3 (168 Hours)85°C0°C166MHzM2S0051.2VCAN, Ethernet, I2C, SPI, UART, USART, USB23.9kB209166MHz64KBARM® Cortex®-M3DDRCANbus, Ethernet, I2C, SPI, UART/USART, USBMCU, FPGA6060ARM505FPGA - 5K Logic Modules128KB23mm23mmRoHS Compliant--------------------------
-
10 WeeksIN PRODUCTION (Last Updated: 1 month ago)676-BGA--0°C~85°C TJTray-SmartFusion®2Active3 (168 Hours)-------387166MHz64KBARM® Cortex®-M3DDR, PCIe, SERDESCANbus, Ethernet, I2C, SPI, UART/USART, USBMCU, FPGA---FPGA - 60K Logic Modules256KB27mm27mmRoHS CompliantYESe3676MATTE TIN8542.39.00.01Field Programmable Gate ArraysCMOSBOTTOMBALLNOT SPECIFIED1.2V1mmNOT SPECIFIEDS-PBGA-B676387Not Qualified1.26V1.2V1.14V387FIELD PROGRAMMABLE GATE ARRAY565202.44mm--
-
-OBSOLETE (Last Updated: 3 weeks ago)144-LQFP---40°C~100°C TJTray2015SmartFusion®2Obsolete3 (168 Hours)-------84166MHz64KBARM® Cortex®-M3DDRCANbus, Ethernet, I2C, SPI, UART/USART, USBMCU, FPGA---FPGA - 5K Logic Modules128KB20mm20mmNon-RoHS CompliantYESe0144Tin/Lead (Sn/Pb)8542.39.00.01--QUADGULL WINGNOT SPECIFIED1.2V0.5mmNOT SPECIFIEDS-PQFP-G144--1.26V-1.14V-FIELD PROGRAMMABLE GATE ARRAY-1.6mmnonot_compliant
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10 WeeksIN PRODUCTION (Last Updated: 1 month ago)484-BGA-484-FPBGA (23x23)-40°C~100°C TJTray2009SmartFusion®2Active3 (168 Hours)100°C-40°C166MHzM2S025T-CAN, Ethernet, I2C, SPI, UART, USART, USB-267166MHz64KBARM® Cortex®-M3DDR, PCIe, SERDESCANbus, Ethernet, I2C, SPI, UART/USART, USBMCU, FPGA-ARM-FPGA - 25K Logic Modules256KB--RoHS Compliant-------------------------
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