M2S005-1VFG256

Microsemi Corporation M2S005-1VFG256

Part Number:
M2S005-1VFG256
Manufacturer:
Microsemi Corporation
Ventron No:
4544099-M2S005-1VFG256
Description:
IC FPGA SOC 5K LUTS
ECAD Model:
Datasheet:
SmartFusion2 Pin Descriptions

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Specifications
Microsemi Corporation M2S005-1VFG256 technical specifications, attributes, parameters and parts with similar specifications to Microsemi Corporation M2S005-1VFG256.
  • Factory Lead Time
    10 Weeks
  • Lifecycle Status
    IN PRODUCTION (Last Updated: 3 weeks ago)
  • Package / Case
    256-LBGA
  • Surface Mount
    YES
  • Operating Temperature
    0°C~85°C TJ
  • Packaging
    Tray
  • Published
    2015
  • Series
    SmartFusion®2
  • JESD-609 Code
    e3
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    256
  • Terminal Finish
    MATTE TIN
  • Additional Feature
    LG-MIN, WD-MIN
  • HTS Code
    8542.39.00.01
  • Subcategory
    Field Programmable Gate Arrays
  • Technology
    CMOS
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Supply Voltage
    1.2V
  • Terminal Pitch
    0.8mm
  • Reflow Temperature-Max (s)
    NOT SPECIFIED
  • JESD-30 Code
    S-PBGA-B256
  • Number of Outputs
    161
  • Qualification Status
    Not Qualified
  • Supply Voltage-Max (Vsup)
    1.26V
  • Power Supplies
    1.2V
  • Supply Voltage-Min (Vsup)
    1.14V
  • Number of I/O
    161
  • Speed
    166MHz
  • RAM Size
    64KB
  • Core Processor
    ARM® Cortex®-M3
  • Peripherals
    DDR
  • Connectivity
    CANbus, Ethernet, I2C, SPI, UART/USART, USB
  • Architecture
    MCU, FPGA
  • Number of Inputs
    161
  • Programmable Logic Type
    FIELD PROGRAMMABLE GATE ARRAY
  • Primary Attributes
    FPGA - 5K Logic Modules
  • Number of Logic Cells
    6060
  • Flash Size
    128KB
  • Height Seated (Max)
    1.56mm
  • Length
    14mm
  • Width
    14mm
  • RoHS Status
    RoHS Compliant
Description
This SoC is built on ARM? Cortex?-M3 core processor(s).
The additional feature of this product is LG-MIN, WD-MIN, and the HTS code is 8542.39.00.01. The terminal form is BALL and the terminal pitch is 0.8mm. The reflow temperature-max (s) is not specified and the JESD-30 code is S-PBGA-B256. The speed of this product is 166MHz and it includes peripherals such as DDR. The architecture of this product is a combination of MCU and FPGA. It also features a programmable logic type, specifically a FIELD PROGRAMMABLE GATE ARRAY. These specifications make this product versatile and suitable for a variety of applications. With its high speed and programmable logic, it is an ideal choice for those in need of a reliable and adaptable product.

ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
128KB extended flash.
LG-MIN, WD-MIN

There are a lot of Microsemi Corporation
M2S005-1VFG256 System On Chip (SoC) applications.

Special Issue Information
Three phase UPS
Networked sensors
Wireless networking
Mobile computing
Industrial
High-end PLC
Optical drive
Smartphone accessories
sequence controllers
M2S005-1VFG256 More Descriptions
Field Programmable Gate Array, 6060-Cell, CMOS, PBGA256
SmartFusion2 SoC FPGA, ARM Cortex-M3, 6KLEs
IC SOC CORTEX-M3 166MHZ 256FBGA
FPGA, 166MHZ, VFPBGA-256; No. of Logic Cells:-; IC Case / Package:VFPBGA; No. of Pins:256Pins; No.of User I/Os:209I/O s; Product Range:SmartFusion2 SoC M2S005; MSL:MSL 3 - 168 hours; Clock Management:PLL; FPGA Family:SmartFusion2 SoCRoHS Compliant: Yes
Product Comparison
The three parts on the right have similar specifications to M2S005-1VFG256.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Lifecycle Status
    Package / Case
    Surface Mount
    Operating Temperature
    Packaging
    Published
    Series
    JESD-609 Code
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    Terminal Finish
    Additional Feature
    HTS Code
    Subcategory
    Technology
    Terminal Position
    Terminal Form
    Peak Reflow Temperature (Cel)
    Supply Voltage
    Terminal Pitch
    Reflow Temperature-Max (s)
    JESD-30 Code
    Number of Outputs
    Qualification Status
    Supply Voltage-Max (Vsup)
    Power Supplies
    Supply Voltage-Min (Vsup)
    Number of I/O
    Speed
    RAM Size
    Core Processor
    Peripherals
    Connectivity
    Architecture
    Number of Inputs
    Programmable Logic Type
    Primary Attributes
    Number of Logic Cells
    Flash Size
    Height Seated (Max)
    Length
    Width
    RoHS Status
    Supplier Device Package
    Max Operating Temperature
    Min Operating Temperature
    Frequency
    Base Part Number
    Interface
    Core Architecture
    View Compare
  • M2S005-1VFG256
    M2S005-1VFG256
    10 Weeks
    IN PRODUCTION (Last Updated: 3 weeks ago)
    256-LBGA
    YES
    0°C~85°C TJ
    Tray
    2015
    SmartFusion®2
    e3
    Active
    3 (168 Hours)
    256
    MATTE TIN
    LG-MIN, WD-MIN
    8542.39.00.01
    Field Programmable Gate Arrays
    CMOS
    BOTTOM
    BALL
    NOT SPECIFIED
    1.2V
    0.8mm
    NOT SPECIFIED
    S-PBGA-B256
    161
    Not Qualified
    1.26V
    1.2V
    1.14V
    161
    166MHz
    64KB
    ARM® Cortex®-M3
    DDR
    CANbus, Ethernet, I2C, SPI, UART/USART, USB
    MCU, FPGA
    161
    FIELD PROGRAMMABLE GATE ARRAY
    FPGA - 5K Logic Modules
    6060
    128KB
    1.56mm
    14mm
    14mm
    RoHS Compliant
    -
    -
    -
    -
    -
    -
    -
    -
  • M2S060T-1FGG676
    10 Weeks
    IN PRODUCTION (Last Updated: 1 month ago)
    676-BGA
    YES
    0°C~85°C TJ
    Tray
    -
    SmartFusion®2
    e3
    Active
    3 (168 Hours)
    676
    MATTE TIN
    -
    8542.39.00.01
    Field Programmable Gate Arrays
    CMOS
    BOTTOM
    BALL
    NOT SPECIFIED
    1.2V
    1mm
    NOT SPECIFIED
    S-PBGA-B676
    387
    Not Qualified
    1.26V
    1.2V
    1.14V
    387
    166MHz
    64KB
    ARM® Cortex®-M3
    DDR, PCIe, SERDES
    CANbus, Ethernet, I2C, SPI, UART/USART, USB
    MCU, FPGA
    387
    FIELD PROGRAMMABLE GATE ARRAY
    FPGA - 60K Logic Modules
    56520
    256KB
    2.44mm
    27mm
    27mm
    RoHS Compliant
    -
    -
    -
    -
    -
    -
    -
  • M2S090S-1FGG484I
    -
    -
    484-BGA
    -
    -40°C~100°C TJ
    Tray
    -
    SmartFusion®2
    -
    Obsolete
    3 (168 Hours)
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    267
    166MHz
    64KB
    ARM® Cortex®-M3
    DDR, PCIe, SERDES
    CANbus, Ethernet, I2C, SPI, UART/USART, USB
    MCU, FPGA
    -
    -
    FPGA - 90K Logic Modules
    -
    512KB
    -
    -
    -
    RoHS Compliant
    484-FPBGA (23x23)
    100°C
    -40°C
    166MHz
    M2S090S
    CAN, Ethernet, I2C, SPI, UART, USART, USB
    ARM
  • M2S025-1FG484
    8 Weeks
    IN PRODUCTION (Last Updated: 1 month ago)
    484-BGA
    -
    0°C~85°C TJ
    Tray
    2009
    SmartFusion®2
    -
    Active
    3 (168 Hours)
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    267
    166MHz
    64KB
    ARM® Cortex®-M3
    DDR, PCIe, SERDES
    CANbus, Ethernet, I2C, SPI, UART/USART, USB
    MCU, FPGA
    -
    -
    FPGA - 25K Logic Modules
    -
    256KB
    -
    -
    -
    Non-RoHS Compliant
    484-FPBGA (23x23)
    85°C
    0°C
    166MHz
    M2S025
    CAN, Ethernet, I2C, SPI, UART, USART, USB
    ARM
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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