Microsemi Corporation M2S005-1FG484
- Part Number:
- M2S005-1FG484
- Manufacturer:
- Microsemi Corporation
- Ventron No:
- 3827995-M2S005-1FG484
- Description:
- IC FPGA SOC 5K LUTS 484FBGA
- ECAD Model:
-
- Datasheet:
- SmartFusion2 Pin Descriptions
Microsemi Corporation M2S005-1FG484 technical specifications, attributes, parameters and parts with similar specifications to Microsemi Corporation M2S005-1FG484.
- Factory Lead Time8 Weeks
- Lifecycle StatusIN PRODUCTION (Last Updated: 3 weeks ago)
- Package / Case484-BGA
- Supplier Device Package484-FPBGA (23x23)
- Operating Temperature0°C~85°C TJ
- PackagingTray
- Published2009
- SeriesSmartFusion®2
- Part StatusActive
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Max Operating Temperature85°C
- Min Operating Temperature0°C
- Frequency166MHz
- Base Part NumberM2S005
- InterfaceCAN, Ethernet, I2C, SPI, UART, USART, USB
- Number of I/O209
- Speed166MHz
- RAM Size64KB
- Core ProcessorARM® Cortex®-M3
- PeripheralsDDR
- ConnectivityCANbus, Ethernet, I2C, SPI, UART/USART, USB
- ArchitectureMCU, FPGA
- Core ArchitectureARM
- Primary AttributesFPGA - 5K Logic Modules
- Flash Size128KB
- RoHS StatusNon-RoHS Compliant
This SoC is built on ARM? Cortex?-M3 core processor(s).
The package or case for this device is 484-BGA, while the supplier device package is 484-FPBGA with dimensions of 23x23. It is designed to operate in a temperature range of 0°C to 85°C, with a maximum operating temperature of 85°C. The device is packaged in a tray, and has a moisture sensitivity level of 3, which means it can withstand 168 hours of exposure to moisture. It has a frequency of 166MHz and supports multiple interfaces such as CAN, Ethernet, I2C, SPI, UART, USART, and USB. The device also has a RAM size of 64KB and its primary attribute is being an FPGA with 5K logic modules.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
128KB extended flash.
Core Architecture: ARM
There are a lot of Microsemi Corporation
M2S005-1FG484 System On Chip (SoC) applications.
Optical drive
Industrial transport
Fitness
Medical
Multiprocessor system-on-chips (MPSoCs)
Communication network-on-Chip (cNoC)
Transmitters
Automated sorting equipment
DC-input BLDC motor drive
Mouse
The package or case for this device is 484-BGA, while the supplier device package is 484-FPBGA with dimensions of 23x23. It is designed to operate in a temperature range of 0°C to 85°C, with a maximum operating temperature of 85°C. The device is packaged in a tray, and has a moisture sensitivity level of 3, which means it can withstand 168 hours of exposure to moisture. It has a frequency of 166MHz and supports multiple interfaces such as CAN, Ethernet, I2C, SPI, UART, USART, and USB. The device also has a RAM size of 64KB and its primary attribute is being an FPGA with 5K logic modules.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
128KB extended flash.
Core Architecture: ARM
There are a lot of Microsemi Corporation
M2S005-1FG484 System On Chip (SoC) applications.
Optical drive
Industrial transport
Fitness
Medical
Multiprocessor system-on-chips (MPSoCs)
Communication network-on-Chip (cNoC)
Transmitters
Automated sorting equipment
DC-input BLDC motor drive
Mouse
M2S005-1FG484 More Descriptions
FPGA SmartFusion2 Family 4956 Cells 65nm (CMOS) Technology 1.2V 484-Pin FBGA
M2S005-1Fg484 484 Pbga 23X23X2.44Mm Tray Rohs Compliant: Yes |Microchip M2S005-1FG484
SmartFusion2 SoC FPGA, ARM Cortex-M3, 6KLEs
IC SOC CORTEX-M3 166MHZ 400VFBGA
M2S005-1Fg484 484 Pbga 23X23X2.44Mm Tray Rohs Compliant: Yes |Microchip M2S005-1FG484
SmartFusion2 SoC FPGA, ARM Cortex-M3, 6KLEs
IC SOC CORTEX-M3 166MHZ 400VFBGA
The three parts on the right have similar specifications to M2S005-1FG484.
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ImagePart NumberManufacturerFactory Lead TimeLifecycle StatusPackage / CaseSupplier Device PackageOperating TemperaturePackagingPublishedSeriesPart StatusMoisture Sensitivity Level (MSL)Max Operating TemperatureMin Operating TemperatureFrequencyBase Part NumberInterfaceNumber of I/OSpeedRAM SizeCore ProcessorPeripheralsConnectivityArchitectureCore ArchitecturePrimary AttributesFlash SizeRoHS StatusSurface MountJESD-609 CodeNumber of TerminationsTerminal FinishHTS CodeSubcategoryTechnologyTerminal PositionTerminal FormPeak Reflow Temperature (Cel)Supply VoltageTerminal PitchReflow Temperature-Max (s)JESD-30 CodeNumber of OutputsQualification StatusSupply Voltage-Max (Vsup)Power SuppliesSupply Voltage-Min (Vsup)Number of InputsProgrammable Logic TypeNumber of Logic CellsHeight Seated (Max)LengthWidthView Compare
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M2S005-1FG4848 WeeksIN PRODUCTION (Last Updated: 3 weeks ago)484-BGA484-FPBGA (23x23)0°C~85°C TJTray2009SmartFusion®2Active3 (168 Hours)85°C0°C166MHzM2S005CAN, Ethernet, I2C, SPI, UART, USART, USB209166MHz64KBARM® Cortex®-M3DDRCANbus, Ethernet, I2C, SPI, UART/USART, USBMCU, FPGAARMFPGA - 5K Logic Modules128KBNon-RoHS Compliant-------------------------- -
8 WeeksIN PRODUCTION (Last Updated: 2 weeks ago)896-BGA--40°C~100°C TJTray-SmartFusion®2Active3 (168 Hours)-----377166MHz64KBARM® Cortex®-M3DDR, PCIe, SERDESCANbus, Ethernet, I2C, SPI, UART/USART, USBMCU, FPGA-FPGA - 50K Logic Modules256KBRoHS CompliantYESe3896MATTE TIN8542.39.00.01Field Programmable Gate ArraysCMOSBOTTOMBALLNOT SPECIFIED1.2V1mmNOT SPECIFIEDS-PBGA-B896377Not Qualified1.26V1.2V1.14V377FIELD PROGRAMMABLE GATE ARRAY563402.44mm31mm31mm
-
--484-BGA484-FPBGA (23x23)-40°C~100°C TJTray-SmartFusion®2Obsolete3 (168 Hours)100°C-40°C166MHzM2S090SCAN, Ethernet, I2C, SPI, UART, USART, USB267166MHz64KBARM® Cortex®-M3DDR, PCIe, SERDESCANbus, Ethernet, I2C, SPI, UART/USART, USBMCU, FPGAARMFPGA - 90K Logic Modules512KBRoHS Compliant-------------------------
-
8 WeeksIN PRODUCTION (Last Updated: 1 month ago)484-BGA484-FPBGA (23x23)0°C~85°C TJTray2009SmartFusion®2Active3 (168 Hours)85°C0°C166MHzM2S025CAN, Ethernet, I2C, SPI, UART, USART, USB267166MHz64KBARM® Cortex®-M3DDR, PCIe, SERDESCANbus, Ethernet, I2C, SPI, UART/USART, USBMCU, FPGAARMFPGA - 25K Logic Modules256KBNon-RoHS Compliant-------------------------
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