IDT, Integrated Device Technology Inc 72T3645L6-7BB

Name: 72T3645L6-7BB
Brand: IDT, Integrated Device Technology Inc
SKU: 3833994-72T3645L6-7BB
Availability: InStock
Rating: 5 (1 reviews)

Part Number:: 72T3645L6-7BB

Manufacturer:: IDT, Integrated Device Technology Inc

Ventron No:: 3833994-72T3645L6-7BB

Description:: IC FIFO 1024X36 6-7NS 208-BGA

ECAD Model:

Datasheet:: 72T3645L6-7BB

Specifications

IDT, Integrated Device Technology Inc 72T3645L6-7BB technical specifications, attributes, parameters and parts with similar specifications to IDT, Integrated Device Technology Inc 72T3645L6-7BB.

Contact Plating
Lead, Tin
Mount
Surface Mount
Package / Case
BGA
Number of Pins
208
Weight
830.300833mg
Published
2009
JESD-609 Code
e0
Pbfree Code
no
Part Status
Discontinued
Moisture Sensitivity Level (MSL)
3
Number of Terminations
208
ECCN Code
EAR99
Terminal Finish
Tin/Lead (Sn63Pb37)
Max Operating Temperature
70°C
Min Operating Temperature
0°C
HTS Code
8542.32.00.71
Subcategory
FIFOs
Technology
CMOS
Terminal Position
BOTTOM
Terminal Form
BALL
Peak Reflow Temperature (Cel)
225
Number of Functions
1
Supply Voltage
2.5V
Terminal Pitch
1mm
Reflow Temperature-Max (s)
20
Pin Count
208
Qualification Status
Not Qualified
Operating Supply Voltage
2.5V
Temperature Grade
COMMERCIAL
Max Supply Voltage
2.625V
Min Supply Voltage
2.375V
Element Configuration
Dual
Nominal Supply Current
70mA
Max Supply Current
70mA
Frequency (Max)
150MHz
Access Time
3.8 ns
Organization
1KX36
Density
36 kb
Standby Current-Max
0.01A
Parallel/Serial
PARALLEL
Sync/Async
Asynchronous
Word Size
36b
Memory IC Type
OTHER FIFO
Bus Directional
Unidirectional
Retransmit Capability
Yes
Output Enable
YES
Cycle Time
6.7 ns
Height Seated (Max)
1.97mm
Length
17mm
Width
17mm
Thickness
1.76mm
RoHS Status
RoHS Compliant
Lead Free
Contains Lead

Description

72T3645L6-7BB Overview
The Logic - FIFOs Memory chip, produced by IDT, Integrated Device Technology Inc., has a Word Size of 36b and operates with a Min Supply Voltage of 2.375V and a Nominal Supply Current of 70mA. It has a Terminal Finish of Tin/Lead (Sn63Pb37) and a Terminal Position of BOTTOM. The chip has a Max Operating Temperature of 70°C and a Min Operating Temperature of 0°C. Its HTS Code is 8542.32.00.71 and its Bus Directional is Unidirectional. The Max Supply Current is also 70mA.

72T3645L6-7BB Features
FIFOs category
Frequency at most

72T3645L6-7BB Applications
There are a lot of Integrated Device Technology (IDT) 72T3645L6-7BB FIFOs Memory applications.

Battery Charger
Queues for communication systems
Cameras
One assembly
Product traceability
Multi-stage synchronizer
Magnetic memories
Computers
Multimedia
Smart Meter

72T3645L6-7BB More Descriptions

FIFO Mem Async/Sync Dual Depth/Width Uni-Dir 1K x 36 208-Pin BGA
IC FIFO 1024X36 6-7NS 208-BGA
1K x 36 TeraSync FIFO, 2.5V

Product Comparison

The three parts on the right have similar specifications to 72T3645L6-7BB.

Image

Part Number

Manufacturer

Contact Plating

Mount

Package / Case

Number of Pins

Weight

Published

JESD-609 Code

Pbfree Code

Part Status

Moisture Sensitivity Level (MSL)

Number of Terminations

ECCN Code

Terminal Finish

Max Operating Temperature

Min Operating Temperature

HTS Code

Subcategory

Technology

Terminal Position

Terminal Form

Peak Reflow Temperature (Cel)

Number of Functions

Supply Voltage

Terminal Pitch

Reflow Temperature-Max (s)

Pin Count

Qualification Status

Operating Supply Voltage

Temperature Grade

Max Supply Voltage

Min Supply Voltage

Element Configuration

Nominal Supply Current

Max Supply Current

Frequency (Max)

Access Time

Organization

Density

Standby Current-Max

Parallel/Serial

Sync/Async

Word Size

Memory IC Type

Bus Directional

Retransmit Capability

Output Enable

Cycle Time

Height Seated (Max)

Length

Width

Thickness

RoHS Status

Lead Free

Factory Lead Time

Mounting Type

Operating Temperature

Packaging

Series

Voltage - Supply

Base Part Number

Function

Current - Supply (Max)

Memory Size

Data Rate

FWFT Support

Expansion Type

View Compare
72T3645L6-7BB

IDT, Integrated Device Technology Inc

Lead, Tin

Surface Mount

BGA

208

830.300833mg

2009

e0

no

Discontinued

3

208

EAR99

Tin/Lead (Sn63Pb37)

70°C

0°C

8542.32.00.71

FIFOs

CMOS

BOTTOM

BALL

225

1

2.5V

1mm

20

208

Not Qualified

2.5V

COMMERCIAL

2.625V

2.375V

Dual

70mA

70mA

150MHz

3.8 ns

1KX36

36 kb

0.01A

PARALLEL

Asynchronous

36b

OTHER FIFO

Unidirectional

Yes

YES

6.7 ns

1.97mm

17mm

17mm

1.76mm

RoHS Compliant

Contains Lead

-

-

-

-

-

-

-

-

-

-

-

-

-

-
72T36125L4-4BB

IDT, Integrated Device Technology Inc

-

-

240-BGA

-

-

-

-

-

Active

3 (168 Hours)

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

8ns, 3.4ns

-

-

-

-

-

-

-

Uni-Directional

-

-

-

-

-

-

-

Non-RoHS Compliant

-

12 Weeks

Surface Mount

0°C~70°C

Tray

72T

2.375V~2.625V

72T36125

Asynchronous, Synchronous

90mA

9M 256K x 36

100MHz, 225MHz

Yes

Depth, Width

72T3645L6-7BB vs 72T36125L4-4BB
72T3685L5BB

IDT, Integrated Device Technology Inc

-

-

208-BGA

-

-

-

-

-

Obsolete

3 (168 Hours)

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

10ns, 3.6ns

-

-

-

-

-

-

-

Uni-Directional

-

-

-

-

-

-

-

Non-RoHS Compliant

-

-

Surface Mount

0°C~70°C

Tray

72T

2.375V~2.625V

72T3685

Asynchronous, Synchronous

70mA

576K 16K x 36

83MHz, 200MHz

Yes

Depth, Width

72T3645L6-7BB vs 72T3685L5BB
72T3695L5BBI

IDT, Integrated Device Technology Inc

Lead, Tin

Surface Mount

BGA

208

-

2009

e0

no

Discontinued

3

208

EAR99

Tin/Lead (Sn63Pb37)

85°C

-40°C

8542.32.00.71

FIFOs

CMOS

BOTTOM

BALL

225

1

2.5V

1mm

20

208

Not Qualified

2.5V

INDUSTRIAL

2.625V

2.375V

Dual

70mA

70mA

200MHz

3.6 ns

32KX36

1.1 Mb

0.01A

PARALLEL

Asynchronous

36b

OTHER FIFO

Unidirectional

Yes

YES

5 ns

1.97mm

17mm

17mm

1.76mm

RoHS Compliant

Contains Lead

-

-

-

-

-

-

-

-

-

-

-

-

-

72T3645L6-7BB vs 72T3695L5BBI