IDT, Integrated Device Technology Inc 72T3695L5BBI

Name: 72T3695L5BBI
Brand: IDT, Integrated Device Technology Inc
SKU: 3705468-72T3695L5BBI
Availability: InStock
Rating: 5 (1 reviews)

Part Number:: 72T3695L5BBI

Manufacturer:: IDT, Integrated Device Technology Inc

Ventron No:: 3705468-72T3695L5BBI

Description:: IC FIFO 32768X36 5NS 208BGA

ECAD Model:

Datasheet:: 72T3695L5BBI

Specifications

IDT, Integrated Device Technology Inc 72T3695L5BBI technical specifications, attributes, parameters and parts with similar specifications to IDT, Integrated Device Technology Inc 72T3695L5BBI.

Contact Plating
Lead, Tin
Mount
Surface Mount
Package / Case
BGA
Number of Pins
208
Published
2009
JESD-609 Code
e0
Pbfree Code
no
Part Status
Discontinued
Moisture Sensitivity Level (MSL)
3
Number of Terminations
208
ECCN Code
EAR99
Terminal Finish
Tin/Lead (Sn63Pb37)
Max Operating Temperature
85°C
Min Operating Temperature
-40°C
HTS Code
8542.32.00.71
Subcategory
FIFOs
Technology
CMOS
Terminal Position
BOTTOM
Terminal Form
BALL
Peak Reflow Temperature (Cel)
225
Number of Functions
1
Supply Voltage
2.5V
Terminal Pitch
1mm
Reflow Temperature-Max (s)
20
Pin Count
208
Qualification Status
Not Qualified
Operating Supply Voltage
2.5V
Temperature Grade
INDUSTRIAL
Max Supply Voltage
2.625V
Min Supply Voltage
2.375V
Element Configuration
Dual
Nominal Supply Current
70mA
Max Supply Current
70mA
Frequency (Max)
200MHz
Access Time
3.6 ns
Organization
32KX36
Density
1.1 Mb
Standby Current-Max
0.01A
Parallel/Serial
PARALLEL
Sync/Async
Asynchronous
Word Size
36b
Memory IC Type
OTHER FIFO
Bus Directional
Unidirectional
Retransmit Capability
Yes
Output Enable
YES
Cycle Time
5 ns
Height Seated (Max)
1.97mm
Length
17mm
Width
17mm
Thickness
1.76mm
RoHS Status
RoHS Compliant
Lead Free
Contains Lead

Description

72T3695L5BBI Overview
IDT, Integrated Device Technology Inc., offers a Logic - FIFOs Memory chip in the Logic - FIFOs Memory category. This chip has an ECCN code of EAR99 and a minimum operating temperature of -40°C. It operates at a supply voltage of 2.5V and has a maximum reflow temperature of 20 seconds. With a maximum frequency of 200MHz, it can be used in both synchronous and asynchronous applications. The chip has a word size of 36 bits and a maximum seated height of 1.97mm. Its thickness is 1.76mm and it is RoHS compliant.

72T3695L5BBI Features
FIFOs category
Frequency at most

72T3695L5BBI Applications
There are a lot of Integrated Device Technology (IDT) 72T3695L5BBI FIFOs Memory applications.

General Data Collection Applications at Low-Temperatures
Communications Systems
HDD
Measurement Equipment
Emulators
Magnetic memories
Test site
Portable Information Devices
Consumer Systems
Microprogramming

72T3695L5BBI More Descriptions

FIFO Mem Async/Sync Dual Depth/Width Uni-Dir 32K x 36 208-Pin BGA
IC FIFO 32768X36 5NS 208BGA
32K x 36 TeraSync FIFO, 2.5V
FIFO 2.5V 32KX36 TERASYNCH F

Product Comparison

The three parts on the right have similar specifications to 72T3695L5BBI.

Image

Part Number

Manufacturer

Contact Plating

Mount

Package / Case

Number of Pins

Published

JESD-609 Code

Pbfree Code

Part Status

Moisture Sensitivity Level (MSL)

Number of Terminations

ECCN Code

Terminal Finish

Max Operating Temperature

Min Operating Temperature

HTS Code

Subcategory

Technology

Terminal Position

Terminal Form

Peak Reflow Temperature (Cel)

Number of Functions

Supply Voltage

Terminal Pitch

Reflow Temperature-Max (s)

Pin Count

Qualification Status

Operating Supply Voltage

Temperature Grade

Max Supply Voltage

Min Supply Voltage

Element Configuration

Nominal Supply Current

Max Supply Current

Frequency (Max)

Access Time

Organization

Density

Standby Current-Max

Parallel/Serial

Sync/Async

Word Size

Memory IC Type

Bus Directional

Retransmit Capability

Output Enable

Cycle Time

Height Seated (Max)

Length

Width

Thickness

RoHS Status

Lead Free

Weight

Mounting Type

Operating Temperature

Packaging

Series

Voltage - Supply

Base Part Number

Function

Current - Supply (Max)

Memory Size

Data Rate

FWFT Support

Expansion Type

View Compare
72T3695L5BBI

IDT, Integrated Device Technology Inc

Lead, Tin

Surface Mount

BGA

208

2009

e0

no

Discontinued

3

208

EAR99

Tin/Lead (Sn63Pb37)

85°C

-40°C

8542.32.00.71

FIFOs

CMOS

BOTTOM

BALL

225

1

2.5V

1mm

20

208

Not Qualified

2.5V

INDUSTRIAL

2.625V

2.375V

Dual

70mA

70mA

200MHz

3.6 ns

32KX36

1.1 Mb

0.01A

PARALLEL

Asynchronous

36b

OTHER FIFO

Unidirectional

Yes

YES

5 ns

1.97mm

17mm

17mm

1.76mm

RoHS Compliant

Contains Lead

-

-

-

-

-

-

-

-

-

-

-

-

-

-
72T3645L6-7BB

IDT, Integrated Device Technology Inc

Lead, Tin

Surface Mount

BGA

208

2009

e0

no

Discontinued

3

208

EAR99

Tin/Lead (Sn63Pb37)

70°C

0°C

8542.32.00.71

FIFOs

CMOS

BOTTOM

BALL

225

1

2.5V

1mm

20

208

Not Qualified

2.5V

COMMERCIAL

2.625V

2.375V

Dual

70mA

70mA

150MHz

3.8 ns

1KX36

36 kb

0.01A

PARALLEL

Asynchronous

36b

OTHER FIFO

Unidirectional

Yes

YES

6.7 ns

1.97mm

17mm

17mm

1.76mm

RoHS Compliant

Contains Lead

830.300833mg

-

-

-

-

-

-

-

-

-

-

-

-

72T3695L5BBI vs 72T3645L6-7BB
72T3685L5BB

IDT, Integrated Device Technology Inc

-

-

208-BGA

-

-

-

-

Obsolete

3 (168 Hours)

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

10ns, 3.6ns

-

-

-

-

-

-

-

Uni-Directional

-

-

-

-

-

-

-

Non-RoHS Compliant

-

-

Surface Mount

0°C~70°C

Tray

72T

2.375V~2.625V

72T3685

Asynchronous, Synchronous

70mA

576K 16K x 36

83MHz, 200MHz

Yes

Depth, Width

72T3695L5BBI vs 72T3685L5BB
72T3675L5BB

IDT, Integrated Device Technology Inc

-

-

208-BGA

-

-

-

-

Obsolete

3 (168 Hours)

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

10ns, 3.6ns

-

-

-

-

-

-

-

Uni-Directional

-

-

-

-

-

-

-

Non-RoHS Compliant

-

-

Surface Mount

0°C~70°C

Tray

72T

2.375V~2.625V

72T3675

Asynchronous, Synchronous

70mA

288K 8K x 36

83MHz, 200MHz

Yes

Depth, Width

72T3695L5BBI vs 72T3675L5BB