IDT, Integrated Device Technology Inc 72T3665L6-7BB
- Part Number:
- 72T3665L6-7BB
- Manufacturer:
- IDT, Integrated Device Technology Inc
- Ventron No:
- 3834127-72T3665L6-7BB
- Description:
- IC FIFO 4096X36 6-7NS 208-BGA
- Datasheet:
- 72T3665L6-7BB
IDT, Integrated Device Technology Inc 72T3665L6-7BB technical specifications, attributes, parameters and parts with similar specifications to IDT, Integrated Device Technology Inc 72T3665L6-7BB.
- Mounting TypeSurface Mount
- Package / Case208-BGA
- Operating Temperature0°C~70°C
- PackagingTray
- Series72T
- Part StatusObsolete
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Voltage - Supply2.375V~2.625V
- Base Part Number72T3665
- FunctionAsynchronous, Synchronous
- Current - Supply (Max)70mA
- Memory Size144K 4K x 36
- Access Time12ns, 3.8ns
- Data Rate66MHz, 150MHz
- Bus DirectionalUni-Directional
- FWFT SupportYes
- Expansion TypeDepth, Width
- RoHS StatusNon-RoHS Compliant
72T3665L6-7BB Overview
The package or case for this particular electronic component is a 208-BGA, which stands for ball grid array. It is typically used for surface mount devices and offers a high number of connections for efficient data transfer. The packaging for this component is a tray, which is a type of container used to protect and transport electronic components. The series of this component is 72T, and the base part number is 72T3665. This component has a dual function, as it can operate both asynchronously and synchronously. The maximum supply current for this component is 70mA. Its memory size is 144K 4K x 36, meaning it has a capacity of 144 kilobytes with a word length of 4 kilobytes and a width of 36 bits. The access time for this component is 12ns and 3.8ns, and it has a data rate of 66MHz and 150MHz. Its expansion type is depth and width, making it suitable for applications that require both depth and width expansion.
72T3665L6-7BB Features
144K 4K x 36 memory size
72T series
Best part number of 72T3665
72T3665L6-7BB Applications
There are a lot of Renesas Electronics America Inc. 72T3665L6-7BB FIFOs Memory applications.
Computer networks
Network bridges
Test Equipment
Analog-to-digital converters
Battery Charger
Microprogramming
High-speed disk
Data
SPI Bus Flash Memory Device
Switches
The package or case for this particular electronic component is a 208-BGA, which stands for ball grid array. It is typically used for surface mount devices and offers a high number of connections for efficient data transfer. The packaging for this component is a tray, which is a type of container used to protect and transport electronic components. The series of this component is 72T, and the base part number is 72T3665. This component has a dual function, as it can operate both asynchronously and synchronously. The maximum supply current for this component is 70mA. Its memory size is 144K 4K x 36, meaning it has a capacity of 144 kilobytes with a word length of 4 kilobytes and a width of 36 bits. The access time for this component is 12ns and 3.8ns, and it has a data rate of 66MHz and 150MHz. Its expansion type is depth and width, making it suitable for applications that require both depth and width expansion.
72T3665L6-7BB Features
144K 4K x 36 memory size
72T series
Best part number of 72T3665
72T3665L6-7BB Applications
There are a lot of Renesas Electronics America Inc. 72T3665L6-7BB FIFOs Memory applications.
Computer networks
Network bridges
Test Equipment
Analog-to-digital converters
Battery Charger
Microprogramming
High-speed disk
Data
SPI Bus Flash Memory Device
Switches
72T3665L6-7BB More Descriptions
FIFO Mem Async/Sync Dual Depth/Width Uni-Dir 4K x 36 208-Pin BGA
IC FIFO 4096X36 6-7NS 208-BGA
4K x 36 TeraSync FIFO, 2.5V
IC FIFO 4096X36 6-7NS 208-BGA
4K x 36 TeraSync FIFO, 2.5V
The three parts on the right have similar specifications to 72T3665L6-7BB.
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ImagePart NumberManufacturerMounting TypePackage / CaseOperating TemperaturePackagingSeriesPart StatusMoisture Sensitivity Level (MSL)Voltage - SupplyBase Part NumberFunctionCurrent - Supply (Max)Memory SizeAccess TimeData RateBus DirectionalFWFT SupportExpansion TypeRoHS StatusContact PlatingMountNumber of PinsPublishedJESD-609 CodePbfree CodeNumber of TerminationsECCN CodeTerminal FinishMax Operating TemperatureMin Operating TemperatureHTS CodeSubcategoryTechnologyTerminal PositionTerminal FormPeak Reflow Temperature (Cel)Number of FunctionsSupply VoltageTerminal PitchReflow Temperature-Max (s)Pin CountQualification StatusOperating Supply VoltageTemperature GradeMax Supply VoltageMin Supply VoltageElement ConfigurationNominal Supply CurrentMax Supply CurrentFrequency (Max)OrganizationDensityStandby Current-MaxParallel/SerialSync/AsyncWord SizeMemory IC TypeRetransmit CapabilityOutput EnableCycle TimeHeight Seated (Max)LengthWidthThicknessLead FreeView Compare
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72T3665L6-7BBSurface Mount208-BGA0°C~70°CTray72TObsolete3 (168 Hours)2.375V~2.625V72T3665Asynchronous, Synchronous70mA144K 4K x 3612ns, 3.8ns66MHz, 150MHzUni-DirectionalYesDepth, WidthNon-RoHS Compliant-----------------------------------------------
-
Surface Mount208-BGA0°C~70°CTray72TObsolete3 (168 Hours)2.375V~2.625V72T3685Asynchronous, Synchronous70mA576K 16K x 3610ns, 3.6ns83MHz, 200MHzUni-DirectionalYesDepth, WidthNon-RoHS Compliant----------------------------------------------
-
Surface Mount208-BGA0°C~70°CTray72TObsolete3 (168 Hours)2.375V~2.625V72T3675Asynchronous, Synchronous70mA288K 8K x 3610ns, 3.6ns83MHz, 200MHzUni-DirectionalYesDepth, WidthNon-RoHS Compliant----------------------------------------------
-
-BGA---Discontinued3-----3.6 ns-Unidirectional--RoHS CompliantLead, TinSurface Mount2082009e0no208EAR99Tin/Lead (Sn63Pb37)85°C-40°C8542.32.00.71FIFOsCMOSBOTTOMBALL22512.5V1mm20208Not Qualified2.5VINDUSTRIAL2.625V2.375VDual70mA70mA200MHz32KX361.1 Mb0.01APARALLELAsynchronous36bOTHER FIFOYesYES5 ns1.97mm17mm17mm1.76mmContains Lead
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