Infineon Technologies XC2764X40F66LAAKXUMA1
- Part Number:
- XC2764X40F66LAAKXUMA1
- Manufacturer:
- Infineon Technologies
- Ventron No:
- 8565866-XC2764X40F66LAAKXUMA1
- Description:
- 320KB 320K x 8 FLASH C166SV2 16/32-Bit Microcontroller XC27x4X Series 100-LQFP Exposed Pad
- Datasheet:
- XC2764X40F66LAAKXUMA1
Infineon Technologies XC2764X40F66LAAKXUMA1 technical specifications, attributes, parameters and parts with similar specifications to Infineon Technologies XC2764X40F66LAAKXUMA1.
- Mounting TypeSurface Mount
- Package / Case100-LQFP Exposed Pad
- Supplier Device PackagePG-LQFP-100-8
- Operating Temperature-40°C~125°C TA
- PackagingTape & Reel (TR)
- SeriesXC27x4X
- Part StatusObsolete
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Oscillator TypeInternal
- Number of I/O76
- Speed66MHz
- RAM Size34K x 8
- Voltage - Supply (Vcc/Vdd)3V~5.5V
- Core ProcessorC166SV2
- PeripheralsI2S, POR, PWM, WDT
- Program Memory TypeFLASH
- Core Size16/32-Bit
- Program Memory Size320KB 320K x 8
- ConnectivityCANbus, EBI/EMI, I2C, LINbus, SPI, SSC, UART/USART, USI
- Data ConverterA/D 16x10b
XC2764X40F66LAAKXUMA1 Overview
The package is 100-LQFP Exposed Pad-shaped. There are 76 I/Os. In the case of the IC chip, the type of mounting is Surface Mount. Microcontroller is based on the 16/32-Bit core architecture. The type of program memory it uses is FLASH. Temperatures in the range of -40°C~125°C TA are operated by this Microcontroller. It is part of the XC27x4X series of electrical components. Having a size of 320KB 320K x 8, Microcontroller has a program memory of X bytes. A C166SV2 Core Processor is at the core of this Microcontroller.
XC2764X40F66LAAKXUMA1 Features
100-LQFP Exposed Pad package
Mounting type of Surface Mount
XC2764X40F66LAAKXUMA1 Applications
There are a lot of Infineon Technologies
XC2764X40F66LAAKXUMA1 Microcontroller applications.
Instrument control
Toys
Robots
Radio
Television
Heater/Fan
Calculator
Kindle
Christmas lights
3D printers
The package is 100-LQFP Exposed Pad-shaped. There are 76 I/Os. In the case of the IC chip, the type of mounting is Surface Mount. Microcontroller is based on the 16/32-Bit core architecture. The type of program memory it uses is FLASH. Temperatures in the range of -40°C~125°C TA are operated by this Microcontroller. It is part of the XC27x4X series of electrical components. Having a size of 320KB 320K x 8, Microcontroller has a program memory of X bytes. A C166SV2 Core Processor is at the core of this Microcontroller.
XC2764X40F66LAAKXUMA1 Features
100-LQFP Exposed Pad package
Mounting type of Surface Mount
XC2764X40F66LAAKXUMA1 Applications
There are a lot of Infineon Technologies
XC2764X40F66LAAKXUMA1 Microcontroller applications.
Instrument control
Toys
Robots
Radio
Television
Heater/Fan
Calculator
Kindle
Christmas lights
3D printers
The three parts on the right have similar specifications to XC2764X40F66LAAKXUMA1.
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ImagePart NumberManufacturerMounting TypePackage / CaseSupplier Device PackageOperating TemperaturePackagingSeriesPart StatusMoisture Sensitivity Level (MSL)Oscillator TypeNumber of I/OSpeedRAM SizeVoltage - Supply (Vcc/Vdd)Core ProcessorPeripheralsProgram Memory TypeCore SizeProgram Memory SizeConnectivityData ConverterFactory Lead TimeSurface MountNumber of PinsPublishedPbfree CodeNumber of TerminationsECCN CodeAdditional FeatureMax Power DissipationTechnologyTerminal PositionTerminal FormPeak Reflow Temperature (Cel)Supply VoltageFrequencyTime@Peak Reflow Temperature-Max (s)Supply Voltage-Min (Vsup)InterfaceMemory SizeuPs/uCs/Peripheral ICs TypeBit SizeWatchdog TimerHas ADCDMA ChannelsPWM ChannelsHalogen FreeDAC ChannelsNumber of Timers/CountersAddress Bus WidthROM (words)On Chip Program ROM WidthExternal Data Bus WidthLengthHeight Seated (Max)WidthRoHS StatusLead FreeMountJESD-609 CodeTerminal FinishBase Part NumberSupply Voltage-Max (Vsup)View Compare
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XC2764X40F66LAAKXUMA1Surface Mount100-LQFP Exposed PadPG-LQFP-100-8-40°C~125°C TATape & Reel (TR)XC27x4XObsolete3 (168 Hours)Internal7666MHz34K x 83V~5.5VC166SV2I2S, POR, PWM, WDTFLASH16/32-Bit320KB 320K x 8CANbus, EBI/EMI, I2C, LINbus, SPI, SSC, UART/USART, USIA/D 16x10b-------------------------------------------
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Surface Mount144-LQFP Exposed Pad--40°C~125°C TATape & Reel (TR)XC27x5XNot For New Designs3 (168 Hours)Internal116-50K x 83V~5.5VC166SV2I2S, POR, PWM, WDTFLASH16/32-Bit832KB 832K x 8CANbus, EBI/EMI, I2C, LINbus, SPI, SSC, UART/USART, USIA/D 24x10b26 WeeksYES1442011yes1443A991.A.2SRAM PROVIDE ADDITIONALLY 8KBYTES SBRAM AND 2KBYTES DPRAM1WCMOSQUADGULL WINGNOT SPECIFIED3.3V80MHzNOT SPECIFIED3VCAN, EBI/EMI, I2C, LIN, SPI, UART, USART832kBMICROCONTROLLER32YesYESNOYESHalogen FreeNO52478643281620mm1.6mm20mmROHS3 CompliantLead Free-----
-
Surface Mount144-LQFP Exposed Pad--40°C~125°C TATape & Reel (TR)XC27x6XNot For New Designs3 (168 Hours)Internal116-51K x 83V~5.5VC166SV2I2S, POR, PWM, WDTFLASH16/32-Bit768KB 768K x 8CANbus, EBI/EMI, I2C, LINbus, SPI, SSC, UART/USART, USIA/D 24x10b26 Weeks-1442001-1443A991.A.2-1WCMOSQUADGULL WING2601.5V66MHzNOT SPECIFIED1.4VCAN, EBI/EMI, I2C, I2S, LIN, SPI, UART, USART768kBMICROCONTROLLER, RISC32YesYESNOYESHalogen FreeNO524--1620mm1.6mm20mmROHS3 CompliantLead FreeSurface Mounte3Tin (Sn)SA*XC2786X1.6V
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-LQFP--40°C~125°C TATape & Reel (TR)XC27x8XObsolete3 (168 Hours)Internal118-90K x 83V~5.5VC166SV2I2S, POR, PWM, WDTFLASH16/32-Bit1.06MB 1.06M x 8CANbus, EBI/EMI, FlexRay, I2C, LINbus, SPI, UART/USARTA/D 24x12b26 Weeks-1442012-----CMOS--260-128MHzNOT SPECIFIED-CAN, I2C, I2S, LIN, SPI, UART1.1MBMICROCONTROLLER-Yes---Halogen Free-5-------RoHS CompliantLead FreeSurface Mount----
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