NXP USA Inc. LPC3180FEL320
- Part Number:
- LPC3180FEL320
- Manufacturer:
- NXP USA Inc.
- Ventron No:
- 3668933-LPC3180FEL320
- Description:
- IC MCU 32BIT ROMLESS 320LFBGA
- Datasheet:
- LPC3180FEL320
NXP USA Inc. LPC3180FEL320 technical specifications, attributes, parameters and parts with similar specifications to NXP USA Inc. LPC3180FEL320.
- MountSurface Mount
- Number of Pins320
- PackagingBulk
- JESD-609 Codee1
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Number of Terminations320
- TerminationSMD/SMT
- Terminal FinishTin/Silver/Copper (Sn/Ag/Cu)
- Max Operating Temperature85°C
- Min Operating Temperature-40°C
- Additional FeatureALSO REQUIRES 1.8V OR 3.3V SUPPLY
- TechnologyCMOS
- Terminal PositionBOTTOM
- Terminal FormBALL
- Peak Reflow Temperature (Cel)260
- Supply Voltage1.2V
- Terminal Pitch0.5mm
- Frequency208MHz
- Time@Peak Reflow Temperature-Max (s)30
- Pin Count320
- Qualification StatusNot Qualified
- Temperature GradeINDUSTRIAL
- InterfaceEBI/EMI, I2C, MMC, SPI, UART, USART, USB
- Max Supply Voltage3.3V
- Min Supply Voltage900mV
- Oscillator TypeExternal
- Number of I/O55
- RAM Size64kB
- Memory TypeROMless
- uPs/uCs/Peripheral ICs TypeMICROCONTROLLER, RISC
- PeripheralsDMA, PWM, WDT
- Bit Size32
- Access Time208 μs
- Has ADCYES
- DMA ChannelsYES
- DAC ChannelsNO
- Core ArchitectureARM
- ROM ProgrammabilityFLASH
- Number of PWM Channels2
- Length13mm
- Height Seated (Max)1.3mm
- Width13mm
- REACH SVHCNo SVHC
- RoHS StatusRoHS Compliant
- Lead FreeLead Free
LPC3180FEL320 Description
LPC3180FEL320 is a type of ARM9-based microcontroller provided by NXP Semiconductors / Freescale. Based on the NXP’s state-of-the-art 90-nanometer technology and an ARM926EJ-S CPU core, it is specifically designed for embedded applications where high performance and low power dissipation are essential. Power optimization can be achieved through process and technology development (Intrinsic Power), and architectural means (Managed Power).
LPC3180FEL320 Features
Power optimization
Multiple serial interfaces
An ARM926EJ-S CPU core
Operating at over 200 MHz CPU frequency
State-of-the-art 90 nanometer technology
LPC3180FEL320 Applications
Embedded applications requiring high performance combined with low power dissipation
LPC3180FEL320 is a type of ARM9-based microcontroller provided by NXP Semiconductors / Freescale. Based on the NXP’s state-of-the-art 90-nanometer technology and an ARM926EJ-S CPU core, it is specifically designed for embedded applications where high performance and low power dissipation are essential. Power optimization can be achieved through process and technology development (Intrinsic Power), and architectural means (Managed Power).
LPC3180FEL320 Features
Power optimization
Multiple serial interfaces
An ARM926EJ-S CPU core
Operating at over 200 MHz CPU frequency
State-of-the-art 90 nanometer technology
LPC3180FEL320 Applications
Embedded applications requiring high performance combined with low power dissipation
LPC3180FEL320 More Descriptions
16/32-bit ARM microcontroller; hardware floating-point coprocessor, USB On-The-Go, and SDRAM memory interface
IC ARM9 MCU 208MHZ 320-LFBGA
IC MCU 32BIT ROMLESS 320LFBGA
OEMs, CMs ONLY (NO BROKERS)
MCU, 32BIT, ARM9, 208MHZ, LFBGA-320; Product Range: LPC Family LPC3000 Series Microcontrollers; Architecture: ARM9; No. of Bits: 32bit; CPU Speed: 208MHz; Program Memory Size: -; RAM Memory Size: 64KB; No. of Pins: 320Pins; MCU Case Style: LFBGA; No. of I/O's: 55I/O's; Embedded Interface Type: I2C, SPI, UART; Supply Voltage Min: 1.7V; Supply Voltage Max: 1.95V; MCU Family: LPC; MCU Series: LPC3000; RoHS Phthalates Compliant: Yes; MSL: -; SVHC: No SVHC (27-Jun-2018); Clock Frequency: 20MHz; Controller Family/Series: LPC31xx; Logic Function Number: 3180; MPU Core Size: 32bit; No. of ADC Inputs: 3; No. of PWM Channels: 2; No. of Timers: 1; Operating Temperature Max: 85°C; Operating Temperature Min: -40°C; Operating Temperature Range: -40°C to 85°C; Oscillator Type: External; Peripherals: ADC, DMA, RTC; Supply Voltage Range: 1.7V to 1.95V, 2.7V to 3.3V; Termination Type: Surface Mount Device
IC ARM9 MCU 208MHZ 320-LFBGA
IC MCU 32BIT ROMLESS 320LFBGA
OEMs, CMs ONLY (NO BROKERS)
MCU, 32BIT, ARM9, 208MHZ, LFBGA-320; Product Range: LPC Family LPC3000 Series Microcontrollers; Architecture: ARM9; No. of Bits: 32bit; CPU Speed: 208MHz; Program Memory Size: -; RAM Memory Size: 64KB; No. of Pins: 320Pins; MCU Case Style: LFBGA; No. of I/O's: 55I/O's; Embedded Interface Type: I2C, SPI, UART; Supply Voltage Min: 1.7V; Supply Voltage Max: 1.95V; MCU Family: LPC; MCU Series: LPC3000; RoHS Phthalates Compliant: Yes; MSL: -; SVHC: No SVHC (27-Jun-2018); Clock Frequency: 20MHz; Controller Family/Series: LPC31xx; Logic Function Number: 3180; MPU Core Size: 32bit; No. of ADC Inputs: 3; No. of PWM Channels: 2; No. of Timers: 1; Operating Temperature Max: 85°C; Operating Temperature Min: -40°C; Operating Temperature Range: -40°C to 85°C; Oscillator Type: External; Peripherals: ADC, DMA, RTC; Supply Voltage Range: 1.7V to 1.95V, 2.7V to 3.3V; Termination Type: Surface Mount Device
The three parts on the right have similar specifications to LPC3180FEL320.
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ImagePart NumberManufacturerMountNumber of PinsPackagingJESD-609 CodeMoisture Sensitivity Level (MSL)Number of TerminationsTerminationTerminal FinishMax Operating TemperatureMin Operating TemperatureAdditional FeatureTechnologyTerminal PositionTerminal FormPeak Reflow Temperature (Cel)Supply VoltageTerminal PitchFrequencyTime@Peak Reflow Temperature-Max (s)Pin CountQualification StatusTemperature GradeInterfaceMax Supply VoltageMin Supply VoltageOscillator TypeNumber of I/ORAM SizeMemory TypeuPs/uCs/Peripheral ICs TypePeripheralsBit SizeAccess TimeHas ADCDMA ChannelsDAC ChannelsCore ArchitectureROM ProgrammabilityNumber of PWM ChannelsLengthHeight Seated (Max)WidthREACH SVHCRoHS StatusLead FreeFactory Lead TimeMounting TypePackage / CaseSurface MountOperating TemperatureSeriesPublishedPart StatusSubcategoryBase Part NumberJESD-30 CodeSupply Voltage-Max (Vsup)Power SuppliesSupply Voltage-Min (Vsup)SpeedVoltage - Supply (Vcc/Vdd)Core ProcessorClock FrequencyProgram Memory TypeCore SizeConnectivityData ConverterPWM ChannelsROM (words)HTS CodeReach Compliance CodeSource Url Status Check DateView Compare
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LPC3180FEL320Surface Mount320Bulke13 (168 Hours)320SMD/SMTTin/Silver/Copper (Sn/Ag/Cu)85°C-40°CALSO REQUIRES 1.8V OR 3.3V SUPPLYCMOSBOTTOMBALL2601.2V0.5mm208MHz30320Not QualifiedINDUSTRIALEBI/EMI, I2C, MMC, SPI, UART, USART, USB3.3V900mVExternal5564kBROMlessMICROCONTROLLER, RISCDMA, PWM, WDT32208 μsYESYESNOARMFLASH213mm1.3mm13mmNo SVHCRoHS CompliantLead Free----------------------------
-
--Traye13 (168 Hours)180-Tin/Silver/Copper (Sn/Ag/Cu)---CMOSBOTTOMBALLNOT SPECIFIED1.2V0.8mm-NOT SPECIFIED180Not Qualified----External20192K x 8-MICROCONTROLLER, RISCDMA, I2S, LCD, PWM, WDT32-YESYESNO-FLASH-12mm1.2mm12mm-ROHS3 Compliant-12 WeeksSurface Mount180-TFBGAYES-40°C~85°C TALPC31002009Not For New DesignsMicrocontrollersLPC314*S-PBGA-B1801.3V1.21.8/3.3V1.1V270MHz1.1V~3.6VARM926EJ-S25MHzROMless16/32-BitEBI/EMI, I2C, IrDA, Memory Card, PCM, SPI, UART/USART, USB OTGA/D 4x10bYES0---
-
--Traye13 (168 Hours)296-Tin/Silver/Copper (Sn/Ag/Cu)---CMOSBOTTOMBALL2601.35V0.8mm-40296Not Qualified----Internal51256K x 8-MICROCONTROLLER, RISCDMA, I2S, Motor Control PWM, PWM, WDT32-YESYESNO-FLASH-15mm1.2mm15mm-ROHS3 Compliant--Surface Mount296-TFBGAYES-40°C~85°C TALPC32002008ObsoleteMicrocontrollersLPC32*0S-PBGA-B2961.39V1.33.3V1.31V266MHz0.9V~3.6VARM926EJ-S20MHzROMless16/32-BitEBI/EMI, Ethernet, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTGA/D 3x10bYES163848542.31.00.01unknown2013-06-14 00:00:00
-
--Traye13 (168 Hours)208-Tin/Silver/Copper (Sn/Ag/Cu)---CMOSBOTTOMBALLNOT SPECIFIED1.2V0.65mm-NOT SPECIFIED208Not Qualified----External10192K x 8-MICROCONTROLLER, RISCDMA, I2S, LCD, PWM, WDT32-YESYESYES-FLASH-12mm1.15mm12mm-ROHS3 Compliant--Surface Mount208-TFBGAYES-40°C~85°C TALPC31002009ObsoleteMicrocontrollersLPC315*S-PBGA-B2081.3V1.21.8/3.3V1.1V180MHz1.1V~3.6VARM9®25MHzROMless16/32-BitEBI/EMI, I2C, IrDA, Memory Card, PCM, SPI, UART/USART, USB OTGA/D 3x10bYES0---
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