Alliance Memory, Inc. AS4C256M8D2-25BIN

Name: AS4C256M8D2-25BIN
Brand: Alliance Memory, Inc.
SKU: 7373097-AS4C256M8D2-25BIN
Availability: InStock
Rating: 5 (1 reviews)

Part Number:: AS4C256M8D2-25BIN

Manufacturer:: Alliance Memory, Inc.

Ventron No:: 7373097-AS4C256M8D2-25BIN

Description:: Memory IC 13mm mm

ECAD Model:

Datasheet:: AS4C256M8D2-25BIN

Specifications

Alliance Memory, Inc. AS4C256M8D2-25BIN technical specifications, attributes, parameters and parts with similar specifications to Alliance Memory, Inc. AS4C256M8D2-25BIN.

Factory Lead Time
8 Weeks
Mounting Type
Surface Mount
Package / Case
60-TFBGA
Surface Mount
YES
Operating Temperature
-40°C~95°C TC
Packaging
Tray
Published
2014
Pbfree Code
yes
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
60
Additional Feature
AUTO/SELF REFRESH
Technology
SDRAM - DDR2
Voltage - Supply
1.7V~1.9V
Terminal Position
BOTTOM
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Number of Functions
1
Supply Voltage
1.8V
Terminal Pitch
0.8mm
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
JESD-30 Code
R-PBGA-B60
Supply Voltage-Max (Vsup)
1.9V
Supply Voltage-Min (Vsup)
1.7V
Memory Size
2Gb 256M x 8
Number of Ports
1
Memory Type
Volatile
Operating Mode
SYNCHRONOUS
Clock Frequency
400MHz
Access Time
57.5ns
Memory Format
DRAM
Memory Interface
Parallel
Organization
256MX8
Memory Width
8
Write Cycle Time - Word, Page
15ns
Memory Density
2147483648 bit
Length
13mm
Height Seated (Max)
1.2mm
Width
10.5mm
RoHS Status
ROHS3 Compliant

Description

AS4C256M8D2-25BIN Overview
In this case, the memory type of the device can be classified as Volatile. Case Tray is available. An embedded 60-TFBGA case surrounds memory ics. It is estimated that the memory size on the chip is 2Gb 256M x 8. As with most mainstream devices, this one uses DRAM-format memory. Due to its wide temperature range of -40°C~95°C TC, this device is well suited to a wide range of applications that require high performance. With 1.7V~1.9V as the supply voltage, it is capable of handling memory ics. It is recommended to mount it in the Surface Mount mounting type. It is planted on the chip with 60 terminations. It supports up to 1 functions for comprehensive operation. There is a requirement for 1.8V to be supplied to this ic memory chip in order to operate. In order to operate effectively, the memory rotates at a clock frequency within a range of 400MHz. This chip is not only loaded with advantages, but it also comes with AUTO/SELF REFRESH, which boosts the performance of your system. Several ports on this chip are used to access one memory address for reading and writing.

AS4C256M8D2-25BIN Features
Package / Case: 60-TFBGA
Additional Feature:AUTO/SELF REFRESH

AS4C256M8D2-25BIN Applications
There are a lot of Alliance Memory, Inc.
AS4C256M8D2-25BIN Memory applications.

networking
personal computers
servers
supercomputers
telecommunications
workstations,
DVD disk buffer
data buffer
nonvolatile BIOS memory
Camcorders

AS4C256M8D2-25BIN More Descriptions

R-PBGA-B60 Surface Mount Tray 256MX8 ic memory 400MHz 57.5ns 10.5mm 2147483648bit
DDR2 2G 256M x 8 1.8v 60-Ball BGA 400MHz Industrial Temp
DRAM Chip DDR2 SDRAM 2Gbit 256M x 8 60-Pin FBGA Tray
DRAM 2Gb, 1.8V, 400Mhz 256M x 8 DDR2

Product Comparison

The three parts on the right have similar specifications to AS4C256M8D2-25BIN.

Image

Part Number

Manufacturer

Factory Lead Time

Mounting Type

Package / Case

Surface Mount

Operating Temperature

Packaging

Published

Pbfree Code

Part Status

Moisture Sensitivity Level (MSL)

Number of Terminations

Additional Feature

Technology

Voltage - Supply

Terminal Position

Peak Reflow Temperature (Cel)

Number of Functions

Supply Voltage

Terminal Pitch

Time@Peak Reflow Temperature-Max (s)

JESD-30 Code

Supply Voltage-Max (Vsup)

Supply Voltage-Min (Vsup)

Memory Size

Number of Ports

Memory Type

Operating Mode

Clock Frequency

Access Time

Memory Format

Memory Interface

Organization

Memory Width

Write Cycle Time - Word, Page

Memory Density

Length

Height Seated (Max)

Width

RoHS Status

Series

View Compare
AS4C256M8D2-25BIN

Alliance Memory, Inc.

8 Weeks

Surface Mount

60-TFBGA

YES

-40°C~95°C TC

Tray

2014

yes

Active

3 (168 Hours)

60

AUTO/SELF REFRESH

SDRAM - DDR2

1.7V~1.9V

BOTTOM

NOT SPECIFIED

1

1.8V

0.8mm

NOT SPECIFIED

R-PBGA-B60

1.9V

1.7V

2Gb 256M x 8

1

Volatile

SYNCHRONOUS

400MHz

57.5ns

DRAM

Parallel

256MX8

8

15ns

2147483648 bit

13mm

1.2mm

10.5mm

ROHS3 Compliant

-

-
AS4C32M16D2A-25BANTR

Alliance Memory, Inc.

8 Weeks

Surface Mount

84-TFBGA

-

-40°C~105°C TC

Tape & Reel (TR)

2014

-

Active

3 (168 Hours)

-

-

SDRAM - DDR2

1.7V~1.9V

-

NOT SPECIFIED

-

-

-

NOT SPECIFIED

-

-

-

512Mb 32M x 16

-

Volatile

-

400MHz

400ps

DRAM

Parallel

-

-

15ns

-

-

-

-

Non-RoHS Compliant

-

AS4C256M8D2-25BIN vs AS4C32M16D2A-25BANTR
AS4C32M16MD1A-5BCNTR

Alliance Memory, Inc.

8 Weeks

Surface Mount

60-VFBGA

-

-30°C~85°C TJ

Tape & Reel (TR)

2015

-

Active

3 (168 Hours)

-

-

SDRAM - Mobile LPDDR

1.7V~1.9V

-

NOT SPECIFIED

-

-

-

NOT SPECIFIED

-

-

-

512Mb 32M x 16

-

Volatile

-

200MHz

700ps

DRAM

Parallel

-

-

15ns

-

-

-

-

ROHS3 Compliant

-

AS4C256M8D2-25BIN vs AS4C32M16MD1A-5BCNTR
AS4C256M16D3B-12BANTR

Alliance Memory, Inc.

8 Weeks

Surface Mount

96-TFBGA

-

-40°C~105°C TC

Tape & Reel (TR)

-

-

Active

3 (168 Hours)

-

-

SDRAM - DDR3

1.425V~1.575V

-

NOT SPECIFIED

-

-

-

NOT SPECIFIED

-

-

-

4Gb 256M x 16

-

Volatile

-

800MHz

20ns

DRAM

Parallel

-

-

15ns

-

-

-

-

ROHS3 Compliant

Automotive, AEC-Q100

AS4C256M8D2-25BIN vs AS4C256M16D3B-12BANTR