Alliance Memory, Inc. AS4C256M16D3LB-12BINTR
- Part Number:
- AS4C256M16D3LB-12BINTR
- Manufacturer:
- Alliance Memory, Inc.
- Ventron No:
- 7374547-AS4C256M16D3LB-12BINTR
- Description:
- Memory IC
- Datasheet:
- AS4C256M16D3LB-12BINTR
Alliance Memory, Inc. AS4C256M16D3LB-12BINTR technical specifications, attributes, parameters and parts with similar specifications to Alliance Memory, Inc. AS4C256M16D3LB-12BINTR.
- Factory Lead Time8 Weeks
- Mounting TypeSurface Mount
- Package / Case96-TFBGA
- Operating Temperature-40°C~95°C TC
- PackagingTape & Reel (TR)
- Part StatusActive
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- TechnologySDRAM - DDR3L
- Voltage - Supply1.283V~1.45V
- Memory Size4Gb 256M x 16
- Memory TypeVolatile
- Clock Frequency800MHz
- Access Time20ns
- Memory FormatDRAM
- Memory InterfaceParallel
- Write Cycle Time - Word, Page15ns
- RoHS StatusNon-RoHS Compliant
AS4C256M16D3LB-12BINTR Overview
As far as memory types are concerned, Volatile is considered to be its memory type. In addition, memory ics is available in a Tape & Reel (TR) case as well. In the case of 96-TFBGA, it is embedded within the case. A memory chip with a capacity of 4Gb 256M x 16 is used on this device. There is a mainstream memory format used by this device, which is called DRAM-format memory. This device has an extended operating temperature range of -40°C~95°C TC, so it's perfect for a wide range of demanding applications. It is capable of handling a voltage supply of 1.283V~1.45V. As far as the mounting type is concerned, Surface Mount is recommended. In the memory, there is a clock frequency rotation that ranges 800MHz.
AS4C256M16D3LB-12BINTR Features
Package / Case: 96-TFBGA
AS4C256M16D3LB-12BINTR Applications
There are a lot of Alliance Memory, Inc.
AS4C256M16D3LB-12BINTR Memory applications.
servers
supercomputers
telecommunications
workstations,
DVD disk buffer
data buffer
nonvolatile BIOS memory
Camcorders
embedded logic
eDRAM
As far as memory types are concerned, Volatile is considered to be its memory type. In addition, memory ics is available in a Tape & Reel (TR) case as well. In the case of 96-TFBGA, it is embedded within the case. A memory chip with a capacity of 4Gb 256M x 16 is used on this device. There is a mainstream memory format used by this device, which is called DRAM-format memory. This device has an extended operating temperature range of -40°C~95°C TC, so it's perfect for a wide range of demanding applications. It is capable of handling a voltage supply of 1.283V~1.45V. As far as the mounting type is concerned, Surface Mount is recommended. In the memory, there is a clock frequency rotation that ranges 800MHz.
AS4C256M16D3LB-12BINTR Features
Package / Case: 96-TFBGA
AS4C256M16D3LB-12BINTR Applications
There are a lot of Alliance Memory, Inc.
AS4C256M16D3LB-12BINTR Memory applications.
servers
supercomputers
telecommunications
workstations,
DVD disk buffer
data buffer
nonvolatile BIOS memory
Camcorders
embedded logic
eDRAM
AS4C256M16D3LB-12BINTR More Descriptions
AS4C256M16D3LB Series 4 Gb (256 M x 16) 1.35 V 800 MHz DDR3 SDRAM - FBGA-96
DDR3 4G 256M X 16 1.35V 96-BALL FBGA 800MHZ Industrrial Temp Tape and Reel
DRAM Chip DDR3L SDRAM 4G-Bit 256M X 16 1.35V 96-Pin FPBGA T/R
DRAM 4G, 1.35V, 800Mhz 256M x 16 30nm DDR3
DDR3 SDRAM 4GB (256M X 16) AS4C256M16D3B
DDR3 4G 256M X 16 1.35V 96-BALL FBGA 800MHZ Industrrial Temp Tape and Reel
DRAM Chip DDR3L SDRAM 4G-Bit 256M X 16 1.35V 96-Pin FPBGA T/R
DRAM 4G, 1.35V, 800Mhz 256M x 16 30nm DDR3
DDR3 SDRAM 4GB (256M X 16) AS4C256M16D3B
The three parts on the right have similar specifications to AS4C256M16D3LB-12BINTR.
-
ImagePart NumberManufacturerFactory Lead TimeMounting TypePackage / CaseOperating TemperaturePackagingPart StatusMoisture Sensitivity Level (MSL)TechnologyVoltage - SupplyMemory SizeMemory TypeClock FrequencyAccess TimeMemory FormatMemory InterfaceWrite Cycle Time - Word, PageRoHS StatusPublishedPeak Reflow Temperature (Cel)Time@Peak Reflow Temperature-Max (s)Surface MountPbfree CodeNumber of TerminationsAdditional FeatureTerminal PositionNumber of FunctionsSupply VoltageTerminal PitchJESD-30 CodeSupply Voltage-Max (Vsup)Supply Voltage-Min (Vsup)Number of PortsOperating ModeOrganizationMemory WidthMemory DensityLengthHeight Seated (Max)WidthSeriesView Compare
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AS4C256M16D3LB-12BINTR8 WeeksSurface Mount96-TFBGA-40°C~95°C TCTape & Reel (TR)Active3 (168 Hours)SDRAM - DDR3L1.283V~1.45V4Gb 256M x 16Volatile800MHz20nsDRAMParallel15nsNon-RoHS Compliant------------------------
-
8 WeeksSurface Mount60-VFBGA-30°C~85°C TJTape & Reel (TR)Active3 (168 Hours)SDRAM - Mobile LPDDR1.7V~1.9V512Mb 32M x 16Volatile200MHz700psDRAMParallel15nsROHS3 Compliant2015NOT SPECIFIEDNOT SPECIFIED--------------------
-
8 WeeksSurface Mount60-TFBGA-40°C~95°C TCTrayActive3 (168 Hours)SDRAM - DDR21.7V~1.9V2Gb 256M x 8Volatile400MHz57.5nsDRAMParallel15nsROHS3 Compliant2014NOT SPECIFIEDNOT SPECIFIEDYESyes60AUTO/SELF REFRESHBOTTOM11.8V0.8mmR-PBGA-B601.9V1.7V1SYNCHRONOUS256MX882147483648 bit13mm1.2mm10.5mm-
-
8 WeeksSurface Mount96-TFBGA-40°C~105°C TCTape & Reel (TR)Active3 (168 Hours)SDRAM - DDR31.425V~1.575V4Gb 256M x 16Volatile800MHz20nsDRAMParallel15nsROHS3 Compliant-NOT SPECIFIEDNOT SPECIFIED-------------------Automotive, AEC-Q100
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