Xilinx Inc. XC17S15AVOG8C

XC17S15AVOG8C Overview
8-SOIC (0.154, 3.90mm Width) is used in this package.External packaging of type Tray.Qualified to perform a variety of tasks within the 0°C~70°C environment.This device can be programmed using OTP.A voltage of 3V~3.6V is applied to it in order to power it.There is a memory device mounted in Surface Mount.The size of data storage is limited to 150kb.Other related parts can be found by searching "XC17S15A".The supply voltage of the device must be 3.3V in order to operate correctly.There are different functions associated with 8 terminations.FPGA is possible to use this memory device wFPGAh a maximum voltage of 3.6V.To supply the device, a minimum voltage of 3V is a must.The memory chip in this picture is called a CONFIGURATION MEMORY memory chip.If reflow soldering is being performed, the temperature should not be higher than 260 when soldering should be reflowed.FPGA has 8 pins.As a result of the SERIAL process, data is transmitted from this memory.In order for a memory chip to function properly, it must be subjected to a voltage of not more than 0.015mA.8 pins are set with the part.Memory is configured as COMMON for memory's I/O.A 3.3V application is recommended before using the part in a circuit to ensure the part runs safely and reliably.

XC17S15AVOG8C Features
Operating temperature: 0°C~70°C.
OTP program capability.
CONFIGURATION MEMORY memory IC.
SERIAL processing.
COMMON I/O equipped.

XC17S15AVOG8C Applications
There are a lot of Xilinx Inc. XC17S15AVOG8C applications of configuration proms for FPGAs.

telecommunications
cell phones
main computer memory
servers
Camcorders
multimedia computers
mainframes
nonvolatile BIOS memory
networks
personal digital assistants