Xilinx Inc. XC17256ELPC20C
- Part Number:
- XC17256ELPC20C
- Manufacturer:
- Xilinx Inc.
- Ventron No:
- 3730595-XC17256ELPC20C
- Description:
- IC PROM SER C-TEMP 256K 20-PLCC
- Datasheet:
- XC17256ELPC20C
Xilinx Inc. XC17256ELPC20C technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC17256ELPC20C.
- Mounting TypeSurface Mount
- Package / Case20-LCC (J-Lead)
- Surface MountYES
- Number of Pins20
- Operating Temperature0°C~70°C
- PackagingTube
- Published2000
- JESD-609 Codee0
- Part StatusObsolete
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Number of Terminations20
- ECCN CodeEAR99
- Terminal FinishTin/Lead (Sn85Pb15)
- Additional FeatureUSED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS
- HTS Code8542.32.00.61
- TechnologyCMOS
- Voltage - Supply3V~3.6V
- Terminal PositionQUAD
- Terminal FormJ BEND
- Peak Reflow Temperature (Cel)225
- Number of Functions1
- Supply Voltage3.3V
- Terminal Pitch1.27mm
- Reach Compliance Codenot_compliant
- Reflow Temperature-Max (s)30
- Base Part NumberXC17256EL
- Pin Count20
- Qualification StatusNot Qualified
- Supply Voltage-Max (Vsup)3.6V
- Power Supplies3.3V
- Supply Voltage-Min (Vsup)3V
- Programmable TypeOTP
- Memory Size256Kb
- Operating ModeSYNCHRONOUS
- Clock Frequency15MHz
- Supply Current-Max0.005mA
- Organization256KX1
- Output Characteristics3-STATE
- Memory Width1
- Standby Current-Max0.00005A
- Memory Density262144 bit
- Parallel/SerialSERIAL
- I/O TypeCOMMON
- Memory IC TypeCONFIGURATION MEMORY
- Height Seated (Max)4.572mm
- Length8.9662mm
- Width8.9662mm
- RoHS StatusNon-RoHS Compliant
- Lead FreeContains Lead
XC17256ELPC20C Overview
There is a neat 20-LCC (J-Lead) package that is used in this program.Packing on the outside is Tube.0°C~70°C license holder.OTP allows for programmability.A voltage of 3V~3.6V is applied to it.Surface Mount is the mounting position of this memory device.Data storage is limited to 256Kb bytes.To find other similar parts, search for "XC17256EL".The supply voltage should be 3.3V.20 terminations with different functions.3.6V is the maximum voltage that can be used with this memory device.3V is the minimum voltage required to supply the device.FPGA is a CONFIGURATION MEMORY memory chip that we are talking about here.If you're reflow soldering, you shouldn't go above 225.20 pins are present.This memory transmit data in the SERIAL process way.Memory chips can operate at a voltage no higher than 0.005mA.20 pins are set with the part.Using a 15MHz frequency, this memory IC can work at high speeds.The I/O configuration of the memory is COMMON.The use of 3.3V power supplies is recommended.For better service, USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS is included.
XC17256ELPC20C Features
Operating temperature: 0°C~70°C.
OTP program capability.
CONFIGURATION MEMORY memory IC.
SERIAL processing.
COMMON I/O equipped.
XC17256ELPC20C Applications
There are a lot of Xilinx Inc. XC17256ELPC20C applications of configuration proms for FPGAs.
mainframes
cell phones
nonvolatile BIOS memory
networking
data buffer
main computer memory
printers
hard disk drive (HDD)
graphics card
telecommunications
There is a neat 20-LCC (J-Lead) package that is used in this program.Packing on the outside is Tube.0°C~70°C license holder.OTP allows for programmability.A voltage of 3V~3.6V is applied to it.Surface Mount is the mounting position of this memory device.Data storage is limited to 256Kb bytes.To find other similar parts, search for "XC17256EL".The supply voltage should be 3.3V.20 terminations with different functions.3.6V is the maximum voltage that can be used with this memory device.3V is the minimum voltage required to supply the device.FPGA is a CONFIGURATION MEMORY memory chip that we are talking about here.If you're reflow soldering, you shouldn't go above 225.20 pins are present.This memory transmit data in the SERIAL process way.Memory chips can operate at a voltage no higher than 0.005mA.20 pins are set with the part.Using a 15MHz frequency, this memory IC can work at high speeds.The I/O configuration of the memory is COMMON.The use of 3.3V power supplies is recommended.For better service, USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS is included.
XC17256ELPC20C Features
Operating temperature: 0°C~70°C.
OTP program capability.
CONFIGURATION MEMORY memory IC.
SERIAL processing.
COMMON I/O equipped.
XC17256ELPC20C Applications
There are a lot of Xilinx Inc. XC17256ELPC20C applications of configuration proms for FPGAs.
mainframes
cell phones
nonvolatile BIOS memory
networking
data buffer
main computer memory
printers
hard disk drive (HDD)
graphics card
telecommunications
XC17256ELPC20C More Descriptions
Configuration Memory, 256KX1, Serial, CMOS, PDIP8
PROM Serial 256K-bit 3.3V 20-Pin PLCC
IC PROM SER C-TEMP 256K 20-PLCC
PROM Serial 256K-bit 3.3V 20-Pin PLCC
IC PROM SER C-TEMP 256K 20-PLCC
The three parts on the right have similar specifications to XC17256ELPC20C.
-
ImagePart NumberManufacturerMounting TypePackage / CaseSurface MountNumber of PinsOperating TemperaturePackagingPublishedJESD-609 CodePart StatusMoisture Sensitivity Level (MSL)Number of TerminationsECCN CodeTerminal FinishAdditional FeatureHTS CodeTechnologyVoltage - SupplyTerminal PositionTerminal FormPeak Reflow Temperature (Cel)Number of FunctionsSupply VoltageTerminal PitchReach Compliance CodeReflow Temperature-Max (s)Base Part NumberPin CountQualification StatusSupply Voltage-Max (Vsup)Power SuppliesSupply Voltage-Min (Vsup)Programmable TypeMemory SizeOperating ModeClock FrequencySupply Current-MaxOrganizationOutput CharacteristicsMemory WidthStandby Current-MaxMemory DensityParallel/SerialI/O TypeMemory IC TypeHeight Seated (Max)LengthWidthRoHS StatusLead FreeView Compare
-
XC17256ELPC20CSurface Mount20-LCC (J-Lead)YES200°C~70°CTube2000e0Obsolete3 (168 Hours)20EAR99Tin/Lead (Sn85Pb15)USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS8542.32.00.61CMOS3V~3.6VQUADJ BEND22513.3V1.27mmnot_compliant30XC17256EL20Not Qualified3.6V3.3V3VOTP256KbSYNCHRONOUS15MHz0.005mA256KX13-STATE10.00005A262144 bitSERIALCOMMONCONFIGURATION MEMORY4.572mm8.9662mm8.9662mmNon-RoHS CompliantContains Lead-
-
Through Hole8-DIP (0.300, 7.62mm)NO8-40°C~85°CTube2000e0ObsoleteNot Applicable8EAR99-USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS-CMOS3V~3.6VDUAL-22513.3V2.54mmnot_compliant30XC17128EL8Not Qualified3.6V3.3V3VOTP128kbSYNCHRONOUS15MHz0.005mA-3-STATE10.00005A131072 bitSERIALCOMMONCONFIGURATION MEMORY4.5974mm9.3599mm7.62mmNon-RoHS CompliantContains Lead
-
Surface Mount8-SOIC (0.154, 3.90mm Width)YES8-40°C~85°CTube2000e0Obsolete1 (Unlimited)8EAR99-USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS-CMOS4.5V~5.5VDUALGULL WING22515V1.27mmnot_compliant30XC17128E8Not Qualified5.5V5V4.5VOTP128kbSYNCHRONOUS15MHz0.01mA-3-STATE10.00005A131072 bitSERIALCOMMONCONFIGURATION MEMORY-4.9276mm3.937mmNon-RoHS CompliantContains Lead
-
Through Hole8-DIP (0.300, 7.62mm)NO8-40°C~85°CTube2000e0ObsoleteNot Applicable8EAR99-USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS-CMOS4.5V~5.5VDUAL-22515V2.54mmnot_compliant30XC17128E8Not Qualified5.5V5V4.5VOTP128kbSYNCHRONOUS15MHz0.01mA-3-STATE10.00005A131072 bitSERIALCOMMONCONFIGURATION MEMORY4.5974mm9.3599mm7.62mmNon-RoHS CompliantContains Lead
Popular Search Part Number
Related Keywords
Search Tags
Latest News
-
19 February 2024
SS14 Schottky Power Diode Function, Applications, Working Principle and Features
Ⅰ. What is a Schottky diode?Ⅱ. SS14 overviewⅢ. Common brands of SS14 diodeⅣ. Typical performance characteristics of SS14 diodeⅤ. The function of SS14 diodeⅥ. What are the applications... -
20 February 2024
LM358DR2G Operational Amplifier Symbol, Features, Applications and More
Ⅰ. Introduction to LM358DR2GⅡ. Technical parameters of LM358DR2GⅢ. Features of LM358DR2GⅣ. Symbol, footprint and pin configuration of LM358DR2GⅤ. Where is LM358DR2G used?Ⅵ. Circuit description of LM358DR2GⅦ. The difference... -
20 February 2024
MB6S Rectifier Bridge Specifications, Working Principle and Features
Ⅰ. Overview of MB6SⅡ. Specifications of MB6SⅢ. Working principle of MB6SⅣ. Circuit schematic diagram of MB6SⅤ. What are the features of MB6S?Ⅵ. Absolute maximum ratings of MB6SⅦ. How... -
21 February 2024
EPCS16SI8N Manufacturer, Market Trend, Application Fields and More
Ⅰ. Overview of EPCS16SI8NⅡ. Manufacturer of EPCS16SI8NⅢ. Specifications of EPCS16SI8NⅣ. Dimensions and package of EPCS16SI8NⅤ. Functional description of EPCS16SI8NⅥ. Application fields of EPCS16SI8NⅦ. Market trend of EPCS16SI8NⅧ. How...
Help you to save your cost and time.
Reliable package for your goods.
Fast Reliable Delivery to save time.
Quality premium after-sale service.