Xilinx Inc. XC17S50APD8I
- Part Number:
- XC17S50APD8I
- Manufacturer:
- Xilinx Inc.
- Ventron No:
- 3730618-XC17S50APD8I
- Description:
- IC PROM SER 50000 I-TEMP 8-DIP
- Datasheet:
- XC17S50APD8I
Xilinx Inc. XC17S50APD8I technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC17S50APD8I.
- Mounting TypeThrough Hole
- Package / Case8-DIP (0.300, 7.62mm)
- Surface MountNO
- Number of Pins8
- Operating Temperature-40°C~85°C
- PackagingTube
- Published1999
- JESD-609 Codee0
- Pbfree Codeno
- Part StatusObsolete
- Moisture Sensitivity Level (MSL)Not Applicable
- Number of Terminations8
- ECCN CodeEAR99
- TechnologyCMOS
- Voltage - Supply3V~3.6V
- Terminal PositionDUAL
- Peak Reflow Temperature (Cel)225
- Number of Functions1
- Supply Voltage3.3V
- Terminal Pitch2.54mm
- Reflow Temperature-Max (s)30
- Base Part NumberXC17S50A
- Pin Count8
- Operating Supply Voltage3.3V
- Supply Voltage-Max (Vsup)3.6V
- Supply Voltage-Min (Vsup)3V
- Programmable TypeOTP
- Memory Size500kb
- Supply Current-Max0.015mA
- Organization559200X1
- Output Characteristics3-STATE
- Memory Width1
- Density1 Mb
- Standby Current-Max0.001A
- Parallel/SerialSERIAL
- I/O TypeCOMMON
- Memory IC TypeCONFIGURATION MEMORY
- Height Seated (Max)4.5974mm
- Length9.3599mm
- Width7.62mm
- Radiation HardeningNo
- RoHS StatusNon-RoHS Compliant
- Lead FreeContains Lead
XC17S50APD8I Overview
There is a neat 8-DIP (0.300, 7.62mm) package that is used in this program.Packaging for Tube.Licensed to operate in -40°C~85°C.Using the OTP axis, it can be programmed to do whatever you want.A voltage of 3V~3.6V is applied to it.FPGA is mounted in Through Hole.A maximum of 500kb bytes of data can be stored.Search "XC17S50A" for related parts.3.3V is the voltage it requires as a supply.There are different functions associated with 8 terminations.With 3.6V as the maximum voltage, the memory device can be used.FPGA is essential that a minimum voltage of 3V be supplied to the device in order for FPGA to function.The memory chip in question is a CONFIGURATION MEMORY memory chip.If you're reflow soldering, you shouldn't go above 225.8 pins are present.Through SERIAL-processing, data is transmitted from this memory to the CPU.The memory chip operates at a voltage of no more than 0.015mA.Parts include 8 pins.The memory's I/O is configured as COMMON.Memory is recommended that users apply 3.3V to the part before use in order for Memory to function safely in a circuMemory.
XC17S50APD8I Features
Operating temperature: -40°C~85°C.
OTP program capability.
CONFIGURATION MEMORY memory IC.
SERIAL processing.
COMMON I/O equipped.
XC17S50APD8I Applications
There are a lot of Xilinx Inc. XC17S50APD8I applications of configuration proms for FPGAs.
personal digital assistants
telecommunications
mainframes
Cache memory
personal computers
workstations,
servers
embedded logic
nonvolatile BIOS memory
Camcorders
There is a neat 8-DIP (0.300, 7.62mm) package that is used in this program.Packaging for Tube.Licensed to operate in -40°C~85°C.Using the OTP axis, it can be programmed to do whatever you want.A voltage of 3V~3.6V is applied to it.FPGA is mounted in Through Hole.A maximum of 500kb bytes of data can be stored.Search "XC17S50A" for related parts.3.3V is the voltage it requires as a supply.There are different functions associated with 8 terminations.With 3.6V as the maximum voltage, the memory device can be used.FPGA is essential that a minimum voltage of 3V be supplied to the device in order for FPGA to function.The memory chip in question is a CONFIGURATION MEMORY memory chip.If you're reflow soldering, you shouldn't go above 225.8 pins are present.Through SERIAL-processing, data is transmitted from this memory to the CPU.The memory chip operates at a voltage of no more than 0.015mA.Parts include 8 pins.The memory's I/O is configured as COMMON.Memory is recommended that users apply 3.3V to the part before use in order for Memory to function safely in a circuMemory.
XC17S50APD8I Features
Operating temperature: -40°C~85°C.
OTP program capability.
CONFIGURATION MEMORY memory IC.
SERIAL processing.
COMMON I/O equipped.
XC17S50APD8I Applications
There are a lot of Xilinx Inc. XC17S50APD8I applications of configuration proms for FPGAs.
personal digital assistants
telecommunications
mainframes
Cache memory
personal computers
workstations,
servers
embedded logic
nonvolatile BIOS memory
Camcorders
XC17S50APD8I More Descriptions
XC17S50A EAR99 Tube 559200X1 ics fpga configuration 7.62mm 0.001A 500kb 3.3V
Configuration Memory, 559200X1, Serial, CMOS, PDSO20
559200 X 1 CONFIGURATION MEMORY PDIP8
PROM Serial 1M-bit 3.3V 8-Pin PDIP
Product Description Demo for Development.
IC PROM SER 50000 I-TEMP 8-DIP
Configuration Memory, 559200X1, Serial, CMOS, PDSO20
559200 X 1 CONFIGURATION MEMORY PDIP8
PROM Serial 1M-bit 3.3V 8-Pin PDIP
Product Description Demo for Development.
IC PROM SER 50000 I-TEMP 8-DIP
The three parts on the right have similar specifications to XC17S50APD8I.
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ImagePart NumberManufacturerMounting TypePackage / CaseSurface MountNumber of PinsOperating TemperaturePackagingPublishedJESD-609 CodePbfree CodePart StatusMoisture Sensitivity Level (MSL)Number of TerminationsECCN CodeTechnologyVoltage - SupplyTerminal PositionPeak Reflow Temperature (Cel)Number of FunctionsSupply VoltageTerminal PitchReflow Temperature-Max (s)Base Part NumberPin CountOperating Supply VoltageSupply Voltage-Max (Vsup)Supply Voltage-Min (Vsup)Programmable TypeMemory SizeSupply Current-MaxOrganizationOutput CharacteristicsMemory WidthDensityStandby Current-MaxParallel/SerialI/O TypeMemory IC TypeHeight Seated (Max)LengthWidthRadiation HardeningRoHS StatusLead FreeAdditional FeatureReach Compliance CodeQualification StatusPower SuppliesOperating ModeClock FrequencyTerminal FormMemory DensityView Compare
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XC17S50APD8IThrough Hole8-DIP (0.300, 7.62mm)NO8-40°C~85°CTube1999e0noObsoleteNot Applicable8EAR99CMOS3V~3.6VDUAL22513.3V2.54mm30XC17S50A83.3V3.6V3VOTP500kb0.015mA559200X13-STATE11 Mb0.001ASERIALCOMMONCONFIGURATION MEMORY4.5974mm9.3599mm7.62mmNoNon-RoHS CompliantContains Lead---------
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Through Hole8-DIP (0.300, 7.62mm)NO80°C~70°CTube2000e0noObsoleteNot Applicable8EAR99CMOS3V~3.6VDUAL22513.3V2.54mm30XC1701L8-3.6V3VOTP1Mb0.01mA1MX13-STATE1-0.00005ASERIALCOMMONCONFIGURATION MEMORY4.5974mm9.3599mm7.62mm-Non-RoHS CompliantContains LeadUSED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGASnot_compliantNot Qualified3.3VSYNCHRONOUS15MHz--
-
Surface Mount8-SOIC (0.154, 3.90mm Width)YES8-40°C~85°CTube2000e0-Obsolete1 (Unlimited)8EAR99CMOS4.5V~5.5VDUAL22515V1.27mm30XC17128E8-5.5V4.5VOTP128kb0.01mA-3-STATE1-0.00005ASERIALCOMMONCONFIGURATION MEMORY-4.9276mm3.937mm-Non-RoHS CompliantContains LeadUSED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGASnot_compliantNot Qualified5VSYNCHRONOUS15MHzGULL WING131072 bit
-
Through Hole8-DIP (0.300, 7.62mm)NO8-40°C~85°CTube2000e0-ObsoleteNot Applicable8EAR99CMOS4.5V~5.5VDUAL22515V2.54mm30XC17128E8-5.5V4.5VOTP128kb0.01mA-3-STATE1-0.00005ASERIALCOMMONCONFIGURATION MEMORY4.5974mm9.3599mm7.62mm-Non-RoHS CompliantContains LeadUSED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGASnot_compliantNot Qualified5VSYNCHRONOUS15MHz-131072 bit
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