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S912XEG128W1MAL

NXP USA Inc. S912XEG128W1MAL

Part Number:
S912XEG128W1MAL
Manufacturer:
NXP USA Inc.
Ventron No:
4543507-S912XEG128W1MAL
Description:
IC MCU 16BIT 128KB FLASH 112LQFP
ECAD Model:
Datasheet:
S912XEG128W1MAL

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Specifications
NXP USA Inc. S912XEG128W1MAL technical specifications, attributes, parameters and parts with similar specifications to NXP USA Inc. S912XEG128W1MAL.
  • Factory Lead Time
    16 Weeks
  • Mounting Type
    Surface Mount
  • Package / Case
    112-LQFP
  • Surface Mount
    YES
  • Operating Temperature
    -40°C~125°C TA
  • Packaging
    Tray
  • Series
    HCS12X
  • Published
    1996
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    112
  • HTS Code
    8542.31.00.01
  • Subcategory
    Microcontrollers
  • Technology
    CMOS
  • Terminal Position
    QUAD
  • Terminal Form
    GULL WING
  • Supply Voltage
    1.8V
  • Terminal Pitch
    0.65mm
  • JESD-30 Code
    S-PQFP-G112
  • Qualification Status
    Not Qualified
  • Supply Voltage-Max (Vsup)
    1.98V
  • Power Supplies
    3.3/5V
  • Supply Voltage-Min (Vsup)
    1.72V
  • Oscillator Type
    External
  • Number of I/O
    91
  • Speed
    50MHz
  • RAM Size
    12K x 8
  • Voltage - Supply (Vcc/Vdd)
    1.72V~5.5V
  • uPs/uCs/Peripheral ICs Type
    MICROCONTROLLER, RISC
  • Peripherals
    LVD, POR, PWM, WDT
  • Clock Frequency
    40MHz
  • Program Memory Type
    FLASH
  • Core Size
    16-Bit
  • Program Memory Size
    128KB 128K x 8
  • Connectivity
    CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
  • Supply Current-Max
    100mA
  • Bit Size
    16
  • Data Converter
    A/D 16x12b
  • Has ADC
    YES
  • DMA Channels
    YES
  • PWM Channels
    YES
  • ROM (words)
    131072
  • EEPROM Size
    2K x 8
  • CPU Family
    CPU12
  • Screening Level
    AEC-Q100
  • RAM (bytes)
    12288
  • Length
    20mm
  • Width
    20mm
  • RoHS Status
    ROHS3 Compliant
Description
S912XEG128W1MAL Overview
The package is 112-LQFP-shaped. There are 91 I/Os. In the case of the IC chip, the type of mounting is Surface Mount. Microcontroller is based on the 16-Bit core architecture. The type of program memory it uses is FLASH. Temperatures in the range of -40°C~125°C TA are operated by this Microcontroller. It is part of the HCS12X series of electrical components. Having a size of 128KB 128K x 8, Microcontroller has a program memory of X bytes. This device belongs to the MICROCONTROLLER, RISC uPs/uCs/Peripheral ICs category. IC Chip 112 has 112 terminations. 16-bits are used for its size. IC Chip has 1.8V volt supply outputs. With YES DMA channels, Microcontroller chip can handle large data transfers. Devices work in YES PWM channels. There is an embedded the CPU12 CPU family inside the device, which makes it a powerful device. As far as its frequency goes, it operates according to a 40MHz clock.

S912XEG128W1MAL Features
112-LQFP package
Mounting type of Surface Mount
Microcontrollers subcategory


S912XEG128W1MAL Applications
There are a lot of NXP USA Inc.
S912XEG128W1MAL Microcontroller applications.


Instrument control
Toys
Robots
Radio
Television
Heater/Fan
Calculator
Kindle
Christmas lights
3D printers
S912XEG128W1MAL More Descriptions
16-bit MCU, S12X core, 128KB Flash, 50MHz, -40/ 105degC, Automotive Qualified, QFP 112
16-bit Microcontrollers - MCU S912XEG128W1MAL/LQFP112///TRAY MULTIPLE DP BAKEABL
16-bit Microcontrollers - MCU BL Auto Micro Processors
128KB 1.72V~5.5V Other series 12KB 50MHz FLASH 91 LQFP-112(20x20) Microcontroller Units (MCUs/MPUs/SOCs) ROHS
IC MCU 16BIT 128KB FLASH 112LQFP
Product Comparison
The three parts on the right have similar specifications to S912XEG128W1MAL.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Mounting Type
    Package / Case
    Surface Mount
    Operating Temperature
    Packaging
    Series
    Published
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    HTS Code
    Subcategory
    Technology
    Terminal Position
    Terminal Form
    Supply Voltage
    Terminal Pitch
    JESD-30 Code
    Qualification Status
    Supply Voltage-Max (Vsup)
    Power Supplies
    Supply Voltage-Min (Vsup)
    Oscillator Type
    Number of I/O
    Speed
    RAM Size
    Voltage - Supply (Vcc/Vdd)
    uPs/uCs/Peripheral ICs Type
    Peripherals
    Clock Frequency
    Program Memory Type
    Core Size
    Program Memory Size
    Connectivity
    Supply Current-Max
    Bit Size
    Data Converter
    Has ADC
    DMA Channels
    PWM Channels
    ROM (words)
    EEPROM Size
    CPU Family
    Screening Level
    RAM (bytes)
    Length
    Width
    RoHS Status
    JESD-609 Code
    ECCN Code
    Terminal Finish
    Peak Reflow Temperature (Cel)
    Time@Peak Reflow Temperature-Max (s)
    Base Part Number
    Core Processor
    View Compare
  • S912XEG128W1MAL
    S912XEG128W1MAL
    NXP USA Inc.
    16 Weeks
    Surface Mount
    112-LQFP
    YES
    -40°C~125°C TA
    Tray
    HCS12X
    1996
    Active
    3 (168 Hours)
    112
    8542.31.00.01
    Microcontrollers
    CMOS
    QUAD
    GULL WING
    1.8V
    0.65mm
    S-PQFP-G112
    Not Qualified
    1.98V
    3.3/5V
    1.72V
    External
    91
    50MHz
    12K x 8
    1.72V~5.5V
    MICROCONTROLLER, RISC
    LVD, POR, PWM, WDT
    40MHz
    FLASH
    16-Bit
    128KB 128K x 8
    CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
    100mA
    16
    A/D 16x12b
    YES
    YES
    YES
    131072
    2K x 8
    CPU12
    AEC-Q100
    12288
    20mm
    20mm
    ROHS3 Compliant
    -
    -
    -
    -
    -
    -
    -
    -
  • S912XEA128J2CAA
    S912XEA128J2CAA
    NXP USA Inc.
    16 Weeks
    Surface Mount
    80-QFP
    YES
    -40°C~85°C TA
    Tray
    HCS12X
    2012
    Active
    3 (168 Hours)
    80
    8542.31.00.01
    Microcontrollers
    CMOS
    QUAD
    GULL WING
    1.8V
    0.65mm
    S-PQFP-G80
    Not Qualified
    1.98V
    3.3/5V
    1.72V
    External
    59
    50MHz
    12K x 8
    1.72V~5.5V
    MICROCONTROLLER, RISC
    LVD, POR, PWM, WDT
    40MHz
    FLASH
    16-Bit
    128KB 128K x 8
    CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
    -
    16
    A/D 8x12b
    YES
    YES
    YES
    131072
    2K x 8
    CPU12
    -
    -
    14mm
    14mm
    ROHS3 Compliant
    e3
    3A991.A.2
    Matte Tin (Sn)
    260
    40
    S912XEA128
    -
    S912XEG128W1MAL vs S912XEA128J2CAA
  • S912DG12AH4CPVE
    S912DG12AH4CPVE
    NXP USA Inc.
    -
    Surface Mount
    112-LQFP
    -
    -40°C~85°C TA
    Bulk
    HC12
    -
    Not For New Designs
    3 (168 Hours)
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    Internal
    69
    8MHz
    8K x 8
    4.5V~5.5V
    -
    POR, PWM, WDT
    -
    FLASH
    16-Bit
    128KB 128K x 8
    CANbus, I2C, SCI, SPI
    -
    -
    A/D 16x8/10b
    -
    -
    -
    -
    2K x 8
    -
    -
    -
    -
    -
    ROHS3 Compliant
    -
    -
    -
    -
    -
    -
    CPU12
    S912XEG128W1MAL vs S912DG12AH4CPVE
  • S912DG12AE0CPVE
    S912DG12AE0CPVE
    NXP USA Inc.
    -
    Surface Mount
    112-LQFP
    -
    -40°C~85°C TA
    Bulk
    HC12
    2013
    Not For New Designs
    3 (168 Hours)
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    Internal
    69
    8MHz
    8K x 8
    4.5V~5.5V
    -
    POR, PWM, WDT
    -
    FLASH
    16-Bit
    128KB 128K x 8
    CANbus, I2C, SCI, SPI
    -
    -
    A/D 16x8/10b
    -
    -
    -
    -
    2K x 8
    -
    -
    -
    -
    -
    ROHS3 Compliant
    -
    -
    -
    -
    -
    -
    CPU12
    S912XEG128W1MAL vs S912DG12AE0CPVE
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS
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