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NAND512R3A2DZA6E

Micron Technology Inc. NAND512R3A2DZA6E

Part Number:
NAND512R3A2DZA6E
Manufacturer:
Micron Technology Inc.
Ventron No:
3243670-NAND512R3A2DZA6E
Description:
IC FLASH 512MBIT 63VFBGA
ECAD Model:
Datasheet:
NAND512R3A2DZA6E

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Specifications
Micron Technology Inc. NAND512R3A2DZA6E technical specifications, attributes, parameters and parts with similar specifications to Micron Technology Inc. NAND512R3A2DZA6E.
  • Mount
    Surface Mount
  • Mounting Type
    Surface Mount
  • Package / Case
    63-TFBGA
  • Number of Pins
    63
  • Operating Temperature
    -40°C~85°C TA
  • Packaging
    Tray
  • JESD-609 Code
    e1
  • Part Status
    Obsolete
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    63
  • Terminal Finish
    Tin/Silver/Copper (Sn/Ag/Cu)
  • Technology
    FLASH - NAND
  • Voltage - Supply
    1.7V~1.95V
  • Terminal Position
    BOTTOM
  • Peak Reflow Temperature (Cel)
    260
  • Number of Functions
    1
  • Supply Voltage
    1.8V
  • Terminal Pitch
    0.8mm
  • Time@Peak Reflow Temperature-Max (s)
    30
  • Base Part Number
    NAND512-A
  • Pin Count
    63
  • Operating Supply Voltage
    1.8V
  • Supply Voltage-Max (Vsup)
    1.95V
  • Supply Voltage-Min (Vsup)
    1.7V
  • Memory Size
    512Mb 64M x 8
  • Nominal Supply Current
    15mA
  • Memory Type
    Non-Volatile
  • Memory Format
    FLASH
  • Memory Interface
    Parallel
  • Organization
    64MX8
  • Memory Width
    8
  • Write Cycle Time - Word, Page
    50ns
  • Address Bus Width
    26b
  • Density
    512 Mb
  • Standby Current-Max
    0.00005A
  • Access Time (Max)
    15000 ns
  • Sync/Async
    Asynchronous
  • Word Size
    8b
  • Data Polling
    NO
  • Toggle Bit
    NO
  • Command User Interface
    YES
  • Number of Sectors/Size
    4K
  • Sector Size
    16K
  • Page Size
    512B
  • Ready/Busy
    YES
  • Height Seated (Max)
    1.05mm
  • Length
    11mm
  • Radiation Hardening
    No
  • RoHS Status
    ROHS3 Compliant
Description
NAND512R3A2DZA6E Overview
Surface mount technology has become a widely used method of mounting electronic components onto circuit boards. This type of mounting, known as surface mount, offers many advantages such as smaller size, lighter weight, and increased reliability. The operating temperature for these surface mount components is typically between -40°C to 85°C, ensuring that they can withstand extreme conditions. With 63 terminations, these components offer a high level of connectivity. The maximum supply voltage, or Vsup, is 1.95V, making them suitable for low power applications. These surface mount components have a word size of 8 bits and do not support data polling. The page size is 512B and the length of the component is 11mm. However, they are not radiation hardened, so they may not be suitable for use in environments with high levels of radiation.

NAND512R3A2DZA6E Features
Package / Case: 63-TFBGA
63 Pins
Operating Supply Voltage:1.8V


NAND512R3A2DZA6E Applications
There are a lot of Micron Technology Inc.
NAND512R3A2DZA6E Memory applications.


multimedia computers
networking
personal computers
servers
supercomputers
telecommunications
workstations,
DVD disk buffer
data buffer
nonvolatile BIOS memory
NAND512R3A2DZA6E More Descriptions
NAND Flash Parallel 1.8V 512Mbit 64M x 8bit 15us 63-Pin VFBGA Tray
IC FLSH 512MBIT PARALLEL 63VFBGA
512M F57slcSP 1.8Vx8 VFBGA63
IC DRAM 8G 1600MHZ
Product Comparison
The three parts on the right have similar specifications to NAND512R3A2DZA6E.
  • Image
    Part Number
    Manufacturer
    Mount
    Mounting Type
    Package / Case
    Number of Pins
    Operating Temperature
    Packaging
    JESD-609 Code
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    Terminal Finish
    Technology
    Voltage - Supply
    Terminal Position
    Peak Reflow Temperature (Cel)
    Number of Functions
    Supply Voltage
    Terminal Pitch
    Time@Peak Reflow Temperature-Max (s)
    Base Part Number
    Pin Count
    Operating Supply Voltage
    Supply Voltage-Max (Vsup)
    Supply Voltage-Min (Vsup)
    Memory Size
    Nominal Supply Current
    Memory Type
    Memory Format
    Memory Interface
    Organization
    Memory Width
    Write Cycle Time - Word, Page
    Address Bus Width
    Density
    Standby Current-Max
    Access Time (Max)
    Sync/Async
    Word Size
    Data Polling
    Toggle Bit
    Command User Interface
    Number of Sectors/Size
    Sector Size
    Page Size
    Ready/Busy
    Height Seated (Max)
    Length
    Radiation Hardening
    RoHS Status
    Published
    ECCN Code
    HTS Code
    Power Supplies
    Programming Voltage
    Write Cycle Time-Max (tWC)
    REACH SVHC
    Pbfree Code
    Qualification Status
    View Compare
  • NAND512R3A2DZA6E
    NAND512R3A2DZA6E
    Micron Technology Inc.
    Surface Mount
    Surface Mount
    63-TFBGA
    63
    -40°C~85°C TA
    Tray
    e1
    Obsolete
    3 (168 Hours)
    63
    Tin/Silver/Copper (Sn/Ag/Cu)
    FLASH - NAND
    1.7V~1.95V
    BOTTOM
    260
    1
    1.8V
    0.8mm
    30
    NAND512-A
    63
    1.8V
    1.95V
    1.7V
    512Mb 64M x 8
    15mA
    Non-Volatile
    FLASH
    Parallel
    64MX8
    8
    50ns
    26b
    512 Mb
    0.00005A
    15000 ns
    Asynchronous
    8b
    NO
    NO
    YES
    4K
    16K
    512B
    YES
    1.05mm
    11mm
    No
    ROHS3 Compliant
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • NAND01GW3B2CN6E
    NAND01GW3B2CN6E
    Micron Technology Inc.
    Surface Mount
    Surface Mount
    48-TFSOP (0.724, 18.40mm Width)
    48
    -40°C~85°C TA
    Tray
    e3
    Obsolete
    3 (168 Hours)
    48
    Matte Tin (Sn)
    FLASH - NAND
    2.7V~3.6V
    DUAL
    260
    1
    3V
    0.5mm
    30
    NAND01G-A
    48
    -
    3.6V
    2.7V
    1Gb 128M x 8
    30mA
    Non-Volatile
    FLASH
    Parallel
    128MX8
    8
    25ns
    28b
    1 Gb
    0.00005A
    25000 ns
    Asynchronous
    8b
    NO
    NO
    YES
    1K
    128K
    2kB
    YES
    1.2mm
    18.4mm
    No
    ROHS3 Compliant
    2008
    3A991.B.1.A
    8542.32.00.51
    3/3.3V
    3V
    25ms
    No SVHC
    -
    -
    NAND512R3A2DZA6E vs NAND01GW3B2CN6E
  • NAND01GW3B2BZA6E
    NAND01GW3B2BZA6E
    Micron Technology Inc.
    Surface Mount
    Surface Mount
    63-TFBGA
    63
    -40°C~85°C TA
    Tray
    e1
    Obsolete
    3 (168 Hours)
    63
    TIN SILVER COPPER
    FLASH - NAND
    2.7V~3.6V
    BOTTOM
    260
    1
    3V
    0.8mm
    30
    NAND01G-A
    63
    -
    3.6V
    2.7V
    1Gb 128M x 8
    30mA
    Non-Volatile
    FLASH
    Parallel
    128MX8
    8
    30ns
    28b
    1 Gb
    0.00005A
    20 ns
    Asynchronous
    8b
    NO
    NO
    YES
    1K
    128K
    2Kwords
    YES
    1.05mm
    12mm
    -
    ROHS3 Compliant
    2004
    3A991.B.1.A
    8542.32.00.51
    3/3.3V
    3V
    -
    -
    yes
    Not Qualified
    NAND512R3A2DZA6E vs NAND01GW3B2BZA6E
  • NAND02GR3B2DZA6E
    NAND02GR3B2DZA6E
    Micron Technology Inc.
    Surface Mount
    Surface Mount
    63-TFBGA
    63
    -40°C~85°C TA
    Tray
    e1
    Discontinued
    3 (168 Hours)
    63
    TIN SILVER COPPER
    FLASH - NAND
    1.7V~1.95V
    BOTTOM
    260
    1
    1.8V
    0.8mm
    30
    NAND02G
    63
    1.8V
    1.95V
    1.7V
    2Gb 256M x 8
    20mA
    Non-Volatile
    FLASH
    Parallel
    256MX8
    8
    45ns
    8b
    2 Gb
    0.00005A
    25000 ns
    Asynchronous
    8b
    NO
    NO
    YES
    2K
    128K
    2kB
    YES
    1.05mm
    11mm
    No
    ROHS3 Compliant
    2008
    3A991.B.1.A
    8542.32.00.51
    -
    -
    -
    -
    -
    -
    NAND512R3A2DZA6E vs NAND02GR3B2DZA6E
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS
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