Micron Technology Inc. NAND08GW3F2AN6E

Name: NAND08GW3F2AN6E
Brand: Micron Technology Inc.
SKU: 3243702-NAND08GW3F2AN6E
Availability: InStock
Rating: 5 (1 reviews)

Part Number:: NAND08GW3F2AN6E

Manufacturer:: Micron Technology Inc.

Ventron No:: 3243702-NAND08GW3F2AN6E

Description:: IC FLASH 8GBIT 48TSOP

ECAD Model:

Datasheet:: NAND(08,16)GW3F2A

Specifications

Micron Technology Inc. NAND08GW3F2AN6E technical specifications, attributes, parameters and parts with similar specifications to Micron Technology Inc. NAND08GW3F2AN6E.

Mounting Type
Surface Mount
Package / Case
48-TFSOP (0.724, 18.40mm Width)
Operating Temperature
-40°C~85°C TA
Packaging
Tray
Published
2009
Part Status
Obsolete
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Technology
FLASH - NAND
Voltage - Supply
2.7V~3.6V
Reach Compliance Code
unknown
Base Part Number
NAND08G
Memory Size
8Gb 1G x 8
Memory Type
Non-Volatile
Memory Format
FLASH
Memory Interface
Parallel
Write Cycle Time - Word, Page
25ns
RoHS Status
ROHS3 Compliant

Description

NAND08GW3F2AN6E Overview
This product features a Surface Mount mounting type, making it suitable for a variety of applications. With an operating temperature range of -40°C to 85°C TA, it can withstand harsh environmental conditions. The packaging for this product is a tray, providing convenient handling and storage. It should be noted that this product is currently marked as obsolete. It has a Moisture Sensitivity Level (MSL) of 3, meaning it can withstand up to 168 hours of exposure to moisture. The technology used in this product is FLASH - NAND, ensuring reliable and efficient performance. While the Reach Compliance Code is unknown, this product is compliant with non-volatile memory type and parallel memory interface. The Write Cycle Time for this product is 25ns for both Word and Page operations.

NAND08GW3F2AN6E Features
Package / Case: 48-TFSOP (0.724, 18.40mm Width)

NAND08GW3F2AN6E Applications
There are a lot of Micron Technology Inc.
NAND08GW3F2AN6E Memory applications.

mainframes
multimedia computers
networking
personal computers
servers
supercomputers
telecommunications
workstations,
DVD disk buffer
data buffer

NAND08GW3F2AN6E More Descriptions

IC FLASH 8GBIT PARALLEL 48TSOP
IC EEPROM 1K SPI 2MHZ 8DIP

Product Comparison

The three parts on the right have similar specifications to NAND08GW3F2AN6E.

Image

Part Number

Manufacturer

Mounting Type

Package / Case

Operating Temperature

Packaging

Published

Part Status

Moisture Sensitivity Level (MSL)

Technology

Voltage - Supply

Reach Compliance Code

Base Part Number

Memory Size

Memory Type

Memory Format

Memory Interface

Write Cycle Time - Word, Page

RoHS Status

Mount

Number of Pins

JESD-609 Code

Number of Terminations

ECCN Code

Terminal Finish

HTS Code

Terminal Position

Peak Reflow Temperature (Cel)

Number of Functions

Supply Voltage

Terminal Pitch

Time@Peak Reflow Temperature-Max (s)

Pin Count

Supply Voltage-Max (Vsup)

Power Supplies

Supply Voltage-Min (Vsup)

Nominal Supply Current

Organization

Memory Width

Address Bus Width

Density

Standby Current-Max

Access Time (Max)

Sync/Async

Word Size

Programming Voltage

Write Cycle Time-Max (tWC)

Data Polling

Toggle Bit

Command User Interface

Number of Sectors/Size

Sector Size

Page Size

Ready/Busy

Height Seated (Max)

Length

Radiation Hardening

REACH SVHC

Pbfree Code

Qualification Status

Operating Supply Voltage

View Compare
NAND08GW3F2AN6E

Micron Technology Inc.

Surface Mount

48-TFSOP (0.724, 18.40mm Width)

-40°C~85°C TA

Tray

2009

Obsolete

3 (168 Hours)

FLASH - NAND

2.7V~3.6V

unknown

NAND08G

8Gb 1G x 8

Non-Volatile

FLASH

Parallel

25ns

ROHS3 Compliant

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-
NAND01GW3B2CN6E

Micron Technology Inc.

Surface Mount

48-TFSOP (0.724, 18.40mm Width)

-40°C~85°C TA

Tray

2008

Obsolete

3 (168 Hours)

FLASH - NAND

2.7V~3.6V

-

NAND01G-A

1Gb 128M x 8

Non-Volatile

FLASH

Parallel

25ns

ROHS3 Compliant

Surface Mount

48

e3

48

3A991.B.1.A

Matte Tin (Sn)

8542.32.00.51

DUAL

260

1

3V

0.5mm

30

48

3.6V

3/3.3V

2.7V

30mA

128MX8

8

28b

1 Gb

0.00005A

25000 ns

Asynchronous

8b

3V

25ms

NO

NO

YES

1K

128K

2kB

YES

1.2mm

18.4mm

No

No SVHC

-

-

-

NAND08GW3F2AN6E vs NAND01GW3B2CN6E
NAND01GW3B2BZA6E

Micron Technology Inc.

Surface Mount

63-TFBGA

-40°C~85°C TA

Tray

2004

Obsolete

3 (168 Hours)

FLASH - NAND

2.7V~3.6V

-

NAND01G-A

1Gb 128M x 8

Non-Volatile

FLASH

Parallel

30ns

ROHS3 Compliant

Surface Mount

63

e1

63

3A991.B.1.A

TIN SILVER COPPER

8542.32.00.51

BOTTOM

260

1

3V

0.8mm

30

63

3.6V

3/3.3V

2.7V

30mA

128MX8

8

28b

1 Gb

0.00005A

20 ns

Asynchronous

8b

3V

-

NO

NO

YES

1K

128K

2Kwords

YES

1.05mm

12mm

-

-

yes

Not Qualified

-

NAND08GW3F2AN6E vs NAND01GW3B2BZA6E
NAND02GR3B2DZA6E

Micron Technology Inc.

Surface Mount

63-TFBGA

-40°C~85°C TA

Tray

2008

Discontinued

3 (168 Hours)

FLASH - NAND

1.7V~1.95V

-

NAND02G

2Gb 256M x 8

Non-Volatile

FLASH

Parallel

45ns

ROHS3 Compliant

Surface Mount

63

e1

63

3A991.B.1.A

TIN SILVER COPPER

8542.32.00.51

BOTTOM

260

1

1.8V

0.8mm

30

63

1.95V

-

1.7V

20mA

256MX8

8

8b

2 Gb

0.00005A

25000 ns

Asynchronous

8b

-

-

NO

NO

YES

2K

128K

2kB

YES

1.05mm

11mm

No

-

-

-

1.8V

NAND08GW3F2AN6E vs NAND02GR3B2DZA6E