NXP USA Inc. MK81FN256VDC15

MK81FN256VDC15            Description
This product is a surface mount device with a mounting type of Surface Mount, making it suitable for surface mounting applications. It was first published in 2014 and has a total of 121 terminations with a terminal form of BALL. The peak reflow temperature for this product is not specified. It is classified under the JESD-30 Code S-PBGA-B121, indicating its package type and size. With a RAM size of 256K x 8 and a 32-bit core size, this product offers efficient and reliable performance. Additionally, it features an ADC, making it suitable for applications that require analog-to-digital conversion. Overall, this product is a high-quality and versatile option for various electronic designs.
Point-of-sale (POS)  Building control  Home automation and security  IoT data concentrators  Portable healthcare  Smart energy gateways  Wearables   MK81FN256VDC15                 Features
 CPU and system cache reduce latency of memory resources, lowering power consumption and improving performance  Separate I/O power domain for up to 14 pins allow operations without the need for external level translators  Flex? I/O peripheral expands MCU capabilities by emulating serial, parallel, or custom interfaces using software drivers provided by the Kinetis SDK  Low-power operation with state retention stop mode down to 5 μA with fast wake-up time and lowest power mode with only 330 nA