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MK50DX256CMC10

NXP USA Inc. MK50DX256CMC10

Part Number:
MK50DX256CMC10
Manufacturer:
NXP USA Inc.
Ventron No:
3645780-MK50DX256CMC10
Description:
IC MCU 32BIT 256KB FLASH 121BGA
ECAD Model:
Datasheet:
MK50DX256CMC10

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Specifications
NXP USA Inc. MK50DX256CMC10 technical specifications, attributes, parameters and parts with similar specifications to NXP USA Inc. MK50DX256CMC10.
  • Factory Lead Time
    13 Weeks
  • Mounting Type
    Surface Mount
  • Package / Case
    121-LFBGA
  • Surface Mount
    YES
  • Operating Temperature
    -40°C~85°C TA
  • Packaging
    Tray
  • Published
    2002
  • Series
    Kinetis K50
  • JESD-609 Code
    e1
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    121
  • ECCN Code
    3A991.A.2
  • Terminal Finish
    TIN SILVER COPPER
  • HTS Code
    8542.31.00.01
  • Subcategory
    Microcontrollers
  • Technology
    CMOS
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    260
  • Supply Voltage
    3.3V
  • Terminal Pitch
    0.65mm
  • Reflow Temperature-Max (s)
    40
  • Base Part Number
    MK50DX256
  • JESD-30 Code
    S-PBGA-B121
  • Qualification Status
    Not Qualified
  • Supply Voltage-Max (Vsup)
    3.6V
  • Power Supplies
    1.8/3.3V
  • Supply Voltage-Min (Vsup)
    1.71V
  • Oscillator Type
    Internal
  • Number of I/O
    78
  • Speed
    100MHz
  • RAM Size
    64K x 8
  • Voltage - Supply (Vcc/Vdd)
    1.71V~3.6V
  • uPs/uCs/Peripheral ICs Type
    MICROCONTROLLER, RISC
  • Core Processor
    ARM® Cortex®-M4
  • Peripherals
    DMA, I2S, LVD, POR, PWM, WDT
  • Clock Frequency
    32MHz
  • Program Memory Type
    FLASH
  • Core Size
    32-Bit
  • Program Memory Size
    256KB 256K x 8
  • Connectivity
    EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
  • Supply Current-Max
    77mA
  • Bit Size
    32
  • Data Converter
    A/D 27x16b; D/A 2x12b
  • Has ADC
    YES
  • DMA Channels
    YES
  • PWM Channels
    YES
  • DAC Channels
    YES
  • ROM (words)
    262144
  • EEPROM Size
    4K x 8
  • CPU Family
    CORTEX-M4
  • Height Seated (Max)
    1.52mm
  • Length
    8mm
  • Width
    8mm
  • RoHS Status
    ROHS3 Compliant
Description
MK50DX256CMC10 Overview
This product features a surface mount design and boasts 121 terminations for optimal connectivity and functionality. With an ECCN Code of 3A991.A.2 and a JESD-30 Code of S-PBGA-B121, this product meets industry standards and regulations. Its RAM size is 64K x 8 and its program memory type is FLASH, providing ample storage and efficient operation. The core size of this product is 32-bit and its bit size is 32, ensuring high performance capabilities. Additionally, it offers the convenience of DMA channels and an EEPROM size of 4K x 8 for data storage. Overall, this product offers a comprehensive and reliable solution for various electronic applications.

MK50DX256CMC10 Features
121-LFBGA package
Mounting type of Surface Mount
Microcontrollers subcategory

MK50DX256CMC10 Applications
There are a lot of NXP USA Inc. MK50DX256CMC10 Microcontroller applications.

PDAs, game consoles
Equipment control
Ipod
Fax machines
Fabric
Current meter
Automatic control
Electromechanical control
DVD\DV\MP3 players
Smart instruments
MK50DX256CMC10 More Descriptions
RISC Microcontroller, 32-Bit, FLASH, CORTEX-M4 CPU, 100MHz, CMOS, PBGA121
Kinetis K 32-bit MCU, ARM Cortex-M4 core, 256KB Flash, 100MHz, Analog Measuremen
Kinetis K50: 100MHz Cortex-M4 Performance MCU, 512KB Flash, 64KB SRAM, Full-Speed USB, 121-MAPBGA
ARM® Cortex®-M4 Kinetis K50 Microcontroller IC 32-Bit 100MHz 256KB (256K x 8) FLASH 121-MAPBGA (8x8)
Product Comparison
The three parts on the right have similar specifications to MK50DX256CMC10.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Mounting Type
    Package / Case
    Surface Mount
    Operating Temperature
    Packaging
    Published
    Series
    JESD-609 Code
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    ECCN Code
    Terminal Finish
    HTS Code
    Subcategory
    Technology
    Terminal Position
    Terminal Form
    Peak Reflow Temperature (Cel)
    Supply Voltage
    Terminal Pitch
    Reflow Temperature-Max (s)
    Base Part Number
    JESD-30 Code
    Qualification Status
    Supply Voltage-Max (Vsup)
    Power Supplies
    Supply Voltage-Min (Vsup)
    Oscillator Type
    Number of I/O
    Speed
    RAM Size
    Voltage - Supply (Vcc/Vdd)
    uPs/uCs/Peripheral ICs Type
    Core Processor
    Peripherals
    Clock Frequency
    Program Memory Type
    Core Size
    Program Memory Size
    Connectivity
    Supply Current-Max
    Bit Size
    Data Converter
    Has ADC
    DMA Channels
    PWM Channels
    DAC Channels
    ROM (words)
    EEPROM Size
    CPU Family
    Height Seated (Max)
    Length
    Width
    RoHS Status
    Time@Peak Reflow Temperature-Max (s)
    View Compare
  • MK50DX256CMC10
    MK50DX256CMC10
    NXP USA Inc.
    13 Weeks
    Surface Mount
    121-LFBGA
    YES
    -40°C~85°C TA
    Tray
    2002
    Kinetis K50
    e1
    Active
    3 (168 Hours)
    121
    3A991.A.2
    TIN SILVER COPPER
    8542.31.00.01
    Microcontrollers
    CMOS
    BOTTOM
    BALL
    260
    3.3V
    0.65mm
    40
    MK50DX256
    S-PBGA-B121
    Not Qualified
    3.6V
    1.8/3.3V
    1.71V
    Internal
    78
    100MHz
    64K x 8
    1.71V~3.6V
    MICROCONTROLLER, RISC
    ARM® Cortex®-M4
    DMA, I2S, LVD, POR, PWM, WDT
    32MHz
    FLASH
    32-Bit
    256KB 256K x 8
    EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
    77mA
    32
    A/D 27x16b; D/A 2x12b
    YES
    YES
    YES
    YES
    262144
    4K x 8
    CORTEX-M4
    1.52mm
    8mm
    8mm
    ROHS3 Compliant
    -
    -
  • MK50DX128CLH7R
    MK50DX128CLH7R
    NXP USA Inc.
    13 Weeks
    Surface Mount
    64-LQFP
    YES
    -40°C~85°C TA
    Tape & Reel (TR)
    2002
    Kinetis K50
    e3
    Active
    3 (168 Hours)
    64
    3A991.A.2
    MATTE TIN
    8542.31.00.01
    Microcontrollers
    CMOS
    QUAD
    GULL WING
    260
    3.3V
    0.5mm
    -
    MK50DX128
    S-PQFP-G64
    Not Qualified
    3.6V
    1.8/3.3V
    1.71V
    Internal
    35
    72MHz
    32K x 8
    1.71V~3.6V
    MICROCONTROLLER
    ARM® Cortex®-M4
    DMA, I2S, LVD, POR, PWM, WDT
    50MHz
    FLASH
    32-Bit
    128KB 128K x 8
    EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG
    34mA
    32
    A/D 22x16b; D/A 1x12b
    YES
    YES
    YES
    YES
    131072
    2K x 8
    CORTEX-M4
    -
    10mm
    10mm
    ROHS3 Compliant
    40
    MK50DX256CMC10 vs MK50DX128CLH7R
  • MK50DN512CMD10R
    MK50DN512CMD10R
    NXP USA Inc.
    13 Weeks
    Surface Mount
    144-LBGA
    YES
    -40°C~85°C TA
    Tape & Reel (TR)
    2011
    Kinetis K50
    e1
    Active
    3 (168 Hours)
    144
    3A991.A.2
    TIN SILVER COPPER
    8542.31.00.01
    Microcontrollers
    CMOS
    BOTTOM
    BALL
    260
    3.3V
    1mm
    -
    MK50DN512
    S-PBGA-B144
    Not Qualified
    3.6V
    1.8/3.3V
    1.71V
    Internal
    96
    100MHz
    128K x 8
    1.71V~3.6V
    MICROCONTROLLER, RISC
    ARM® Cortex®-M4
    DMA, I2S, LVD, POR, PWM, WDT
    32MHz
    FLASH
    32-Bit
    512KB 512K x 8
    EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
    77mA
    32
    A/D 41x16b; D/A 2x12b
    YES
    YES
    YES
    YES
    524288
    -
    CORTEX-M4
    1.7mm
    13mm
    13mm
    ROHS3 Compliant
    40
    MK50DX256CMC10 vs MK50DN512CMD10R
  • MK50DX256ZCLQ10
    MK50DX256ZCLQ10
    NXP USA Inc.
    -
    Surface Mount
    144-LQFP
    YES
    -40°C~85°C TA
    Tray
    2012
    Kinetis K50
    e3
    Not For New Designs
    3 (168 Hours)
    144
    3A991.A.2
    Matte Tin (Sn)
    8542.31.00.01
    -
    CMOS
    QUAD
    GULL WING
    260
    3.3V
    0.5mm
    40
    MK50DX256
    -
    -
    3.6V
    -
    1.71V
    Internal
    96
    100MHz
    64K x 8
    1.71V~3.6V
    MICROCONTROLLER
    ARM® Cortex®-M4
    DMA, I2S, LVD, POR, PWM, WDT
    32MHz
    FLASH
    32-Bit
    256KB 256K x 8
    EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
    -
    32
    A/D 41x16b; D/A 2x12b
    YES
    YES
    YES
    -
    -
    4K x 8
    -
    -
    20mm
    20mm
    ROHS3 Compliant
    -
    MK50DX256CMC10 vs MK50DX256ZCLQ10
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS
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