MC9S08QG8CDTE

NXP USA Inc. MC9S08QG8CDTE

Part Number:
MC9S08QG8CDTE
Manufacturer:
NXP USA Inc.
Ventron No:
3136022-MC9S08QG8CDTE
Description:
IC MCU 8BIT 8KB FLASH 16TSSOP
ECAD Model:
Datasheet:
MC9S08QG8CDTE

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Specifications
NXP USA Inc. MC9S08QG8CDTE technical specifications, attributes, parameters and parts with similar specifications to NXP USA Inc. MC9S08QG8CDTE.
  • Factory Lead Time
    10 Weeks
  • Mounting Type
    Surface Mount
  • Package / Case
    16-TSSOP (0.173, 4.40mm Width)
  • Surface Mount
    YES
  • Operating Temperature
    -40°C~85°C TA
  • Packaging
    Tube
  • Published
    2005
  • Series
    S08
  • JESD-609 Code
    e3
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    16
  • ECCN Code
    3A991.A.2
  • Terminal Finish
    Matte Tin (Sn)
  • HTS Code
    8542.31.00.01
  • Subcategory
    Microcontrollers
  • Technology
    CMOS
  • Terminal Position
    DUAL
  • Terminal Form
    GULL WING
  • Peak Reflow Temperature (Cel)
    260
  • Supply Voltage
    3V
  • Terminal Pitch
    0.65mm
  • Reflow Temperature-Max (s)
    40
  • Base Part Number
    MC9S08QG8
  • JESD-30 Code
    R-PDSO-G16
  • Qualification Status
    Not Qualified
  • Supply Voltage-Max (Vsup)
    3.6V
  • Power Supplies
    1.8/3.6V
  • Supply Voltage-Min (Vsup)
    1.8V
  • Oscillator Type
    Internal
  • Number of I/O
    12
  • Speed
    20MHz
  • RAM Size
    512 x 8
  • Voltage - Supply (Vcc/Vdd)
    1.8V~3.6V
  • uPs/uCs/Peripheral ICs Type
    MICROCONTROLLER
  • Peripherals
    LVD, POR, PWM, WDT
  • Clock Frequency
    20MHz
  • Program Memory Type
    FLASH
  • Core Size
    8-Bit
  • Program Memory Size
    8KB 8K x 8
  • Connectivity
    I2C, SCI, SPI
  • Bit Size
    8
  • Data Converter
    A/D 8x10b
  • Has ADC
    YES
  • DMA Channels
    NO
  • PWM Channels
    YES
  • DAC Channels
    NO
  • ROM (words)
    8192
  • Height Seated (Max)
    1.2mm
  • Length
    5mm
  • Width
    4.4mm
  • RoHS Status
    ROHS3 Compliant
Description
MC9S08QG8CDTE Description
This particular component is manufactured by NXP USA Inc. and falls under the category of Embedded - Microcontrollers. It is a type of chip that is used in embedded systems. The technology used in this chip is CMOS. Currently, it is not qualified for use. The recommended voltage supply range for this chip is between 1.8V to 3.6V. The program memory type is FLASH, which allows for data to be written and erased multiple times. The core size of this chip is 8-bits, meaning it can process 8 bits of data at a time. It has connectivity options such as I2C, SCI, and SPI. The bit size of this chip is 8, indicating its processing capabilities. It does not have any DMA channels, which are used for direct memory access. However, it does have PWM channels, which allow for precise control of power output. The ROM size of this chip is 8192 words, which is the amount of data it can store in its read-only memory.

MC9S08QG8CDTE Features
Single-wire background debug interface
On-chip, in-circuit emulation (ICE) with real-time bus capture
Low-voltage detection with reset or interrupt
Illegal opcode detection with reset
Illegal address detection with reset
FLASH block protect
FLASH read/program/erase over full operating voltage and temperature
MC9S08QG8 — 8 Kbytes FLASH, 512 bytes RAM
MC9S08QG4 — 4 Kbytes FLASH, 256 bytes RAM


MC9S08QG8CDTE Applications
Power Management
Consumer Electronics
Portable Devices
Industrial

MC9S08QG8CDTE More Descriptions
MCU 8-bit S08 S08 CISC 8KB Flash 2.5V/3.3V Automotive 16-Pin TSSOP Rail
HCS08 Series 4 KB Flash 512 B RAM 20 MHz 8-Bit Microcontroller - TSSOP-16
Product Range:S08 Microcontrollers; Operating Frequency Max:20MHz; Program Memory Size:8KB; No. of Pins:16Pins; IC Case / Package:TSSOP; No. of I/O s:14I/O s; Interfaces:I2C, SCI, SPI; RAM Memory Size:512Byte; Supply Voltage Min:1.8VRoHS Compliant: Yes
Device Core = HCS08 / Data Bus Width Bit = 8 / Instruction Set Architecture = CISC / Family Name = S08QG / Clock Frequency Max. MHz = 20 / Program Memory Type = Flash / Program Memory Size KB = 8 / RAM Memory Size B = 512 / Interfaces = I²C / Interfaces = SCI / Interfaces = SPI / ADC Channels = 8 / ADC Resolution Bit = 10 / Number of Programmable I/Os = 12 / Number of Timers/Counters = 2 / Comparators = 3 / Supply Voltage Min. V = 1.8 / Supply Voltage Max. V = 3.6 / Operating Temperature Min. °C = -40 / Operating Temperature Max. °C = 85 / Package Type = TSSOP / Pins = 16 / Mounting Type = SMD / MSL = Level-3 / Packaging = Tube / Length mm = 5 / Width mm = 4.4 / Height mm = 1.05 / Reflow Temperature Max. °C = 260
8BIT MCU 8K FLASH, 9S08, TSSOP16; Controller Family/Series:HCS08; Core Size:8bit; No. of I/O's:14; Program Memory Size:8 KB; RAM Memory Size:512Byte; CPU Speed:20MHz; Oscillator Type:External, Internal; No. of Timers:2; Peripherals:ADC, Comparator, PWM, Timer; Embedded Interface Type:I2C, SCI, SPI; No. of PWM Channels:2; Digital IC Case Style:TSSOP; Supply Voltage Range:1.8V to 3.6V; Operating Temperature Range:-40°C to 85°C; No. of Pins:16; MSL:MSL 3 - 168 hours; SVHC:No SVHC (18-Jun-2012); Clock Frequency:10MHz; Flash Memory Size:8KB; IC Generic Number:9S08; Interface:I2C, SCI, SPI; Interface:I2C, SCI, SPI; Interface Type:I2C, SCI, SPI; Logic Function Number:08; Memory Size:8; Memory Type:FLASH; Microprocessor/Controller Features:I²C, SCI, SPI, COP, POR, MTIM, Comparator; No. of ADC Inputs:8; No. of Bits:8; No. of External Interrupts:8; No. of I/O's:12; Number of bits In Timer:16; Number of bits in ADC:10; Operating Temperature Max:85°C; Operating Temperature Min:-40°C; Package / Case:TSSOP
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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