MC9S08AC32CFGE

NXP USA Inc. MC9S08AC32CFGE

Part Number:
MC9S08AC32CFGE
Manufacturer:
NXP USA Inc.
Ventron No:
3643012-MC9S08AC32CFGE
Description:
IC MCU 8BIT 32KB FLASH 44LQFP
ECAD Model:
Datasheet:
MC9S08AC32CFGE

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Specifications
NXP USA Inc. MC9S08AC32CFGE technical specifications, attributes, parameters and parts with similar specifications to NXP USA Inc. MC9S08AC32CFGE.
  • Factory Lead Time
    10 Weeks
  • Mounting Type
    Surface Mount
  • Package / Case
    44-LQFP
  • Surface Mount
    YES
  • Operating Temperature
    -40°C~85°C TA
  • Packaging
    Tray
  • Published
    2008
  • Series
    S08
  • JESD-609 Code
    e3
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    44
  • ECCN Code
    3A991.A.2
  • Terminal Finish
    Matte Tin (Sn)
  • HTS Code
    8542.31.00.01
  • Subcategory
    Microcontrollers
  • Technology
    CMOS
  • Terminal Position
    QUAD
  • Terminal Form
    GULL WING
  • Peak Reflow Temperature (Cel)
    260
  • Supply Voltage
    5V
  • Terminal Pitch
    0.8mm
  • Reflow Temperature-Max (s)
    40
  • Base Part Number
    MC9S08AC32
  • JESD-30 Code
    S-PQFP-G44
  • Qualification Status
    Not Qualified
  • Supply Voltage-Max (Vsup)
    5.5V
  • Power Supplies
    3/5V
  • Supply Voltage-Min (Vsup)
    2.7V
  • Oscillator Type
    Internal
  • Number of I/O
    34
  • Speed
    40MHz
  • RAM Size
    2K x 8
  • Voltage - Supply (Vcc/Vdd)
    2.7V~5.5V
  • uPs/uCs/Peripheral ICs Type
    MICROCONTROLLER
  • Peripherals
    LVD, POR, PWM, WDT
  • Clock Frequency
    16MHz
  • Program Memory Type
    FLASH
  • Core Size
    8-Bit
  • Program Memory Size
    32KB 32K x 8
  • Connectivity
    I2C, SCI, SPI
  • Bit Size
    8
  • Data Converter
    A/D 8x10b
  • Has ADC
    YES
  • DMA Channels
    NO
  • PWM Channels
    YES
  • DAC Channels
    NO
  • ROM (words)
    32768
  • Height Seated (Max)
    1.6mm
  • Length
    10mm
  • Width
    10mm
  • RoHS Status
    ROHS3 Compliant
Description
MC9S08AC32CFGE Overview
The Embedded - Microcontrollers chip from NXP USA Inc., known as the MC9S08AC32, falls under the Embedded - Microcontrollers category. It has a Moisture Sensitivity Level of 3 (168 Hours) and an ECCN Code of 3A991.A.2. The Peak Reflow Temperature is 260 degrees Celsius and the Base Part Number is MC9S08AC32. This chip has a 2K x 8 RAM size and a voltage supply range of 2.7V~5.5V. Its peripherals include LVD, POR, PWM, and WDT, and it has a FLASH program memory type and an 8-bit core size. The maximum seated height is 1.6mm.

MC9S08AC32CFGE Features
44-LQFP package
Mounting type of Surface Mount
Microcontrollers subcategory

MC9S08AC32CFGE Applications
There are a lot of NXP USA Inc. MC9S08AC32CFGE Microcontroller applications.

Firewalls
Home appliances
Speed meter
Torpedo guidance
Automatic control
Security systems
Binding machines
Tape drives
Toasters
Gas monitoring systems
MC9S08AC32CFGE More Descriptions
MCU 8-bit S08 S08 CISC 32KB Flash 3.3V/5V Automotive 44-Pin LQFP Tray
S08Ac 8-Bit Mcu, S08 Core, 32Kb Flash, 40Mhz, Qfp 44 Rohs Compliant: Yes
IC, MCU, 8-BIT, 32K FLASH, 8K RAM; Controller Family/Series:HCS08; Core Size:8bit; No. of I/O's:34; Program Memory Size:32 KB; RAM Memory Size:2KB; CPU Speed:40MHz; Oscillator Type:External, Internal; No. of Timers:3; Peripherals:ADC; No. of PWM Channels:10; Digital IC Case Style:LQFP; Supply Voltage Range:2.7V to 5.5V; Operating Temperature Range:-40°C to 85°C; No. of Pins:44; SVHC:No SVHC (20-Jun-2011); Base Number:HCS08; Clock Frequency:40MHz; Flash Memory Size:32KB; Interface:I2C, SCI, SPI; Interface:I2C, SPI, SCI; Interface Type:I2C, SCI, SPI; Memory Size:32 Kb; Memory Type:Flash; Microprocessor/Controller Features:COP, CRC, POR; No. of ADC Inputs:8; No. of Bits:8; No. of External Interrupts:6; No. of I/O's:34; Number of bits In Timer:16; Number of bits in ADC:10; Operating Temperature Max:85°C; Operating Temperature Min:-40°C; Package / Case:LQFP; Program Memory Size:32KB; Serial Comms:2 SCI, SPI, I2C; Supply Voltage Max:5.5V; Supply Voltage Min:2.7V; Termination Type:SMD
Device Core = HCS08 / Data Bus Width Bit = 8 / Instruction Set Architecture = CISC / Family Name = S08AC / Clock Frequency Max. MHz = 40 / Program Memory Type = Flash / Program Memory Size KB = 32 / RAM Memory Size KB = 2 / Interfaces = I²C / Interfaces = SCI / Interfaces = SPI / ADC Channels = 8 / ADC Resolution Bit = 10 / Number of Programmable I/Os = 34 / Number of Timers/Counters = 3 / Comparators = 2 / Supply Voltage Min. V = 2.7 / Supply Voltage Max. V = 5.5 / Operating Temperature Min. °C = -40 / Operating Temperature Max. °C = 85 / Package Type = LQFP / Pins = 44 / Mounting Type = SMD / MSL = Level-3 / Packaging = Tray / Length mm = 10 / Width mm = 10 / Height mm = 1.4 / Reflow Temperature Max. °C = 260
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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