MC56F8367VPYE

NXP USA Inc. MC56F8367VPYE

Part Number:
MC56F8367VPYE
Manufacturer:
NXP USA Inc.
Ventron No:
3642376-MC56F8367VPYE
Description:
IC MCU 16BIT 512KB FLASH 160LQFP
ECAD Model:
Datasheet:
MC56F8367VPYE

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Specifications
NXP USA Inc. MC56F8367VPYE technical specifications, attributes, parameters and parts with similar specifications to NXP USA Inc. MC56F8367VPYE.
  • Factory Lead Time
    10 Weeks
  • Mounting Type
    Surface Mount
  • Package / Case
    160-LQFP
  • Surface Mount
    YES
  • Operating Temperature
    -40°C~105°C TA
  • Packaging
    Tray
  • Published
    1998
  • Series
    56F8xxx
  • JESD-609 Code
    e3
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    160
  • ECCN Code
    3A991.A.2
  • Terminal Finish
    Matte Tin (Sn)
  • Additional Feature
    ALSO REQUIRES 3.3V SUPPLY
  • HTS Code
    8542.31.00.01
  • Subcategory
    Microcontrollers
  • Technology
    CMOS
  • Terminal Position
    QUAD
  • Terminal Form
    GULL WING
  • Peak Reflow Temperature (Cel)
    260
  • Supply Voltage
    2.5V
  • Terminal Pitch
    0.5mm
  • Reflow Temperature-Max (s)
    40
  • Base Part Number
    MC56F8367
  • JESD-30 Code
    S-PQFP-G160
  • Qualification Status
    Not Qualified
  • Supply Voltage-Max (Vsup)
    2.75V
  • Power Supplies
    2.53.3V
  • Supply Voltage-Min (Vsup)
    2.25V
  • Oscillator Type
    External
  • Number of I/O
    76
  • Speed
    60MHz
  • RAM Size
    18K x 16
  • Voltage - Supply (Vcc/Vdd)
    2.25V~3.6V
  • uPs/uCs/Peripheral ICs Type
    DIGITAL SIGNAL PROCESSOR, OTHER
  • Core Processor
    56800E
  • Peripherals
    POR, PWM, Temp Sensor, WDT
  • Clock Frequency
    120MHz
  • Program Memory Type
    FLASH
  • Core Size
    16-Bit
  • Program Memory Size
    512KB 256K x 16
  • Connectivity
    CANbus, EBI/EMI, SCI, SPI
  • Bit Size
    16
  • Data Converter
    A/D 16x12b
  • Address Bus Width
    24
  • ROM (words)
    524288
  • Boundary Scan
    YES
  • Low Power Mode
    YES
  • External Data Bus Width
    16
  • Format
    FIXED POINT
  • Barrel Shifter
    YES
  • Internal Bus Architecture
    MULTIPLE
  • Height Seated (Max)
    1.6mm
  • Length
    24mm
  • Width
    24mm
  • RoHS Status
    ROHS3 Compliant
Description
MC56F8367VPYE                         Description
NXP USA Inc. is the brand of this part, which falls under the Embedded - Microcontrollers category. This particular chip was published in 1998 and is currently active. It utilizes CMOS technology and has a QUAD terminal position with a 0.5mm terminal pitch. Its qualification status is not yet qualified, and it requires power supplies of 2.53.3V. The RAM size is 18K x 16 and it has a clock frequency of 120MHz. Additionally, it offers connectivity options such as CANbus, EBI/EMI, SCI, and SPI.
? Up to 60 MIPS at 60MHz core frequency ? DSP and MCU functionality in a unified, C-efficient architecture ? Access up to 4MB of off-chip program and 32MB of data memory ? Chip Select Logic for glueless interface to ROM and SRAM ? 512KB of Program Flash ? 4KB of Program RAM ? 32KB of Data Flash ? 32KB of Data RAM ? 32KB Boot Flash ? Up to two 6-channel PWM modules ? Four 4-channel, 12-bit ADCs Core ? Efficient 16-bit 56800E family controller engine with dual Harvard architecture ? Up to 60 Million Instructions Per Second (MIPS) at 60MHz core frequency ? Single-cycle 16 × 16-bit parallel Multiplier-Accumulator (MAC) ? Four 36-bit accumulators, including extension bits ? Arithmetic and logic multi-bit shifter ? Parallel instruction set with unique DSP addressing modes ? Hardware DO and REP loops ? Three internal address buses and one external address bus ? Four internal data buses and one external data bus ? Instruction set supports both DSP and controller functions ? Controller-style addressing modes and instructions for compact code ? Efficient C compiler and local variable support ? Software subroutine and interrupt stack with depth limited only by memory ? JTAG/EOnCE debug programming interface   MC56F8367VPYE                            Applications Mobile applications, Internet of Things - Wearable devices: smartwatches
MC56F8367VPYE More Descriptions
56F8xx Series 18 KB RAM 512 kB Flash 60 MHz 16-Bit Microcontroller - LQFP-160
MCU 16-bit MC56F83xx CISC 512KB Flash 3.3V 160-Pin LQFP Tray
Product Range:mc56F83Xx Series; Core Frequency:60Mhz; Flash Memory Size:576Kb; No. Of I/o S:76I/o S; Embedded Interface Type:can, Sci, Spi; Core Supply Voltage:2.5V; Dsc Case Style:lqfp; No. Of Pins:160Pins; Supply Voltage Min:3V Rohs Compliant: Yes
IC, DSC, 16BIT, 60MHZ, LQFP-160; Series:MC56F83xx; Core Frequency:60MHz; Core Supply Voltage:2.5V; Digital IC Case Style:LQFP; No. of Pins:160; Embedded Interface Type:CAN, SCI, SPI; No. of I/O's:76; Supply Voltage Range:2.25V to 2.75V; Flash Memory Size:512KB; Operating Temperature Range:-40°C to 105°C; MSL:MSL 3 - 168 hours; SVHC:No SVHC (18-Jun-2012); Clock Frequency:60MHz; Controller Family/Series:56F8x67; EEPROM Memory Size:32KB; IC Generic Number:56F8367; Interface Type:CAN, SCI, SPI; Logic Function Number:8367VPYE; Memory Size:512KB; Memory Type:FLASH; Microprocessor/Controller Features:Temperature Sensor, 2 CAN modules, 2 SCIs, 2 SPIs; No. of ADC Inputs:16; No. of Bits:16; No. of I/O's:76; No. of PWM Channels:12; No. of Timers:4; Operating Temperature Max:105°C; Operating Temperature Min:-40°C; Oscillator Type:Crystal; Package / Case:LQFP; Qualified Segment:COMMERCIAL, INDUSTRIAL; RAM Memory Size:32KB; Supply Voltage Max:3.6V; Supply Voltage Min:3V; Termination Type:SMD
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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