NXP USA Inc. MC56F8023VLC

MC56F8023VLC Description
The surface mount technology (SMT) used in electronic packaging has become increasingly popular in recent years. One example of this is the packaging type known as "tray," which is commonly used for integrated circuits. This type of packaging falls under the Harmonized Tariff Schedule (HTS) code 8542.31.00.01. Another important aspect of electronic packaging is the Joint Electron Device Engineering Council (JESD) code, which identifies specific package types. In this case, the JESD-30 code for the package is S-PQFP-G32. The oscillator type for this package is internal, and the core processor is the 56800E. The peripherals included in this package are POR (power-on reset), PWM (pulse width modulation), and WDT (watchdog timer). The program memory size for this package is 32KB 16K x 16, and it does not have any DMA (direct memory access) channels. However, it does have PWM channels, making it suitable for applications that require precise control of pulse width modulation. Overall, this package offers a comprehensive set of features for electronic devices that require high performance and efficient packaging.

MC56F8023VLC Features
4 KB of RAM
32 KB of Flash memory
Integrated peripherals: One 6-channel PWM module Two 12-bit up to 4-channels ADC Two internal 12-bit DAC Up to three PIT QSCI QSPI I2C Up to 35 GPIO
DSP and MCU functionality in a unified, C-efficient architecture with up to 32 MIPS at 32 MHz core


MC56F8023VLC Applications
Automotive 
Enterprise systems 
Personal electronics