IRF7304TR

Infineon Technologies IRF7304TR

Part Number:
IRF7304TR
Manufacturer:
Infineon Technologies
Ventron No:
2475294-IRF7304TR
Description:
MOSFET 2P-CH 20V 4.3A 8-SOIC
ECAD Model:
Datasheet:
IRF7304

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Specifications
Infineon Technologies IRF7304TR technical specifications, attributes, parameters and parts with similar specifications to Infineon Technologies IRF7304TR.
  • Mounting Type
    Surface Mount
  • Package / Case
    8-SOIC (0.154, 3.90mm Width)
  • Surface Mount
    YES
  • Transistor Element Material
    SILICON
  • Operating Temperature
    -55°C~150°C TJ
  • Packaging
    Tape & Reel (TR)
  • Series
    HEXFET®
  • Published
    1997
  • JESD-609 Code
    e3
  • Part Status
    Obsolete
  • Moisture Sensitivity Level (MSL)
    1 (Unlimited)
  • Number of Terminations
    8
  • ECCN Code
    EAR99
  • Terminal Finish
    Matte Tin (Sn)
  • Additional Feature
    LOGIC LEVEL COMPATIBLE
  • Terminal Form
    GULL WING
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Time@Peak Reflow Temperature-Max (s)
    NOT SPECIFIED
  • JESD-30 Code
    R-PDSO-G8
  • Qualification Status
    Not Qualified
  • Number of Elements
    2
  • Configuration
    SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE
  • Operating Mode
    ENHANCEMENT MODE
  • Power - Max
    2W
  • FET Type
    2 P-Channel (Dual)
  • Rds On (Max) @ Id, Vgs
    90m Ω @ 2.2A, 4.5V
  • Vgs(th) (Max) @ Id
    700mV @ 250μA
  • Input Capacitance (Ciss) (Max) @ Vds
    610pF @ 15V
  • Current - Continuous Drain (Id) @ 25°C
    4.3A
  • Gate Charge (Qg) (Max) @ Vgs
    22nC @ 4.5V
  • Drain to Source Voltage (Vdss)
    20V
  • Drain Current-Max (Abs) (ID)
    3.6A
  • Drain-source On Resistance-Max
    0.09Ohm
  • DS Breakdown Voltage-Min
    20V
  • FET Technology
    METAL-OXIDE SEMICONDUCTOR
  • FET Feature
    Logic Level Gate
  • RoHS Status
    Non-RoHS Compliant
Description
IRF7304TR            Description
  The fifth generation HEXFET of International Rectifier Company adopts advanced technology to achieve the lowest possible on-resistance per silicon area. This advantage, combined with HEXFET Power MOSFET's well-known fast switching speed and rugged device design, provides designers with an extremely efficient device that can be used in a variety of applications. SO-8 has been improved by customizing lead frames to enhance thermal and multi-chip capabilities, making it ideal for a variety of power applications. With these improvements, multiple devices can be used in one application, greatly reducing circuit board space. The package is suitable for gas phase, infrared or wave soldering technology. In typical PCB placement applications, it is possible to consume more than 0.8W.
IRF7304TR                Features
Generation V Technology Ultra Low On-Resistance Dual P-Channel Mosfet Surface Mount  Available in Tape & Reel Dynamic dv/dt Rating Fast Switching   IRF7304TR                  Applications device that can be used in a variety of applications  
 



IRF7304TR More Descriptions
Trans MOSFET P-CH 20V 4.3A 8-Pin SOIC T/R
-20V Dual P-Channel HEXFET Power MOSFET in a SO-8 package
Power Field-Effect Transistor, 3.6A I(D), 20V, 0.09ohm, 2-Element, P-Channel, Silicon, Metal-oxide Semiconductor FET
French Electronic Distributor since 1988
MOSFET; Transistor Type:MOSFET; Transistor Polarity:Dual P Channel; Drain Source Voltage, Vds:-20V; Continuous Drain Current, Id:-4.3A; On Resistance, Rds(on):90mohm; Rds(on) Test Voltage, Vgs:-4.5V; Leaded Process Compatible:No RoHS Compliant: No
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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