Micron Technology Inc. EDF8164A3MA-JD-F-D

Name: EDF8164A3MA-JD-F-D
Brand: Micron Technology Inc.
SKU: 3255470-EDF8164A3MA-JD-F-D
Availability: InStock
Rating: 5 (1 reviews)

Part Number:: EDF8164A3MA-JD-F-D

Manufacturer:: Micron Technology Inc.

Ventron No:: 3255470-EDF8164A3MA-JD-F-D

Description:: IC SDRAM 8GBIT 933MHZ FBGA

ECAD Model:

Datasheet:: EDF8164A3MA-JD-F-D

Specifications

Micron Technology Inc. EDF8164A3MA-JD-F-D technical specifications, attributes, parameters and parts with similar specifications to Micron Technology Inc. EDF8164A3MA-JD-F-D.

Factory Lead Time
26 Weeks
Mounting Type
Surface Mount
Package / Case
FBGA
Surface Mount
YES
Supplier Device Package
253-FBGA (11x11)
Operating Temperature
-30°C~85°C TC
Packaging
Tray
Part Status
Obsolete
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
253
ECCN Code
EAR99
Additional Feature
AUTO/SELF REFRESH; IT ALSO REQUIRES 1.8V NOM
Technology
SDRAM - Mobile LPDDR3
Voltage - Supply
1.14V~1.95V
Terminal Position
BOTTOM
Number of Functions
1
Supply Voltage
1.2V
Terminal Pitch
0.5mm
JESD-30 Code
S-PBGA-B253
Supply Voltage-Max (Vsup)
1.3V
Supply Voltage-Min (Vsup)
1.14V
Memory Size
8Gb 128M x 64
Number of Ports
1
Memory Type
Volatile
Operating Mode
SYNCHRONOUS
Clock Frequency
933MHz
Memory Format
DRAM
Memory Interface
Parallel
Organization
128MX64
Memory Width
64
Memory Density
8589934592 bit
Access Mode
SINGLE BANK PAGE BURST
Height Seated (Max)
0.85mm
Length
11mm
Width
11mm
RoHS Status
ROHS3 Compliant

Description

EDF8164A3MA-JD-F-D Overview
The Surface Mount Mounting Type is a popular choice for electronic components due to its compact size and ease of installation. However, it is important to consider the operating temperature range when using this type of mounting. In this case, the Operating Temperature for this particular component is -30°C~85°C TC, making it suitable for a wide range of environments. Despite its versatility, it is worth noting that the Part Status of this component is Obsolete, meaning it is no longer in production. Additionally, it has a Moisture Sensitivity Level (MSL) of 3 (168 Hours), indicating that it can withstand exposure to moisture for up to 168 hours. The ECCN Code for this component is EAR99, indicating that it does not require an export license. This component falls under the Technology category of SDRAM - Mobile LPDDR3, which is a type of memory commonly used in mobile devices. The Supply Voltage-Max (Vsup) for this component is 1.3V, and it has a Memory Size of 8Gb 128M x 64. Lastly, it operates in SYNCHRONOUS mode and has a Length of 11mm.

EDF8164A3MA-JD-F-D Features
Package / Case: FBGA
Additional Feature:AUTO/SELF REFRESH; IT ALSO REQUIRES 1.8V NOM

EDF8164A3MA-JD-F-D Applications
There are a lot of Micron Technology Inc.
EDF8164A3MA-JD-F-D Memory applications.

personal computers
servers
supercomputers
telecommunications
workstations,
DVD disk buffer
data buffer
nonvolatile BIOS memory
Camcorders
embedded logic

EDF8164A3MA-JD-F-D More Descriptions

DRAM Chip Mobile LPDDR3 SDRAM 8G-Bit 128Mx64 1.2V 253-Pin VFBGA Tray
LPDDR3 128MX64 PLASTIC GREEN VFBGA 1.2V
IC DRAM 8G PARALLEL 933MHZ FBGA
IC DRAM 8GBIT PARALLEL 253FBGA
IC SDRAM 512MBIT 200MHZ 60FBGA
16 Gb Dual Channel 2E0F Mobil SDRAM

Product Comparison

The three parts on the right have similar specifications to EDF8164A3MA-JD-F-D.

Image

Part Number

Manufacturer

Factory Lead Time

Mounting Type

Package / Case

Surface Mount

Supplier Device Package

Operating Temperature

Packaging

Part Status

Moisture Sensitivity Level (MSL)

Number of Terminations

ECCN Code

Additional Feature

Technology

Voltage - Supply

Terminal Position

Number of Functions

Supply Voltage

Terminal Pitch

JESD-30 Code

Supply Voltage-Max (Vsup)

Supply Voltage-Min (Vsup)

Memory Size

Number of Ports

Memory Type

Operating Mode

Clock Frequency

Memory Format

Memory Interface

Organization

Memory Width

Memory Density

Access Mode

Height Seated (Max)

Length

Width

RoHS Status

View Compare
EDF8164A3MA-JD-F-D

Micron Technology Inc.

26 Weeks

Surface Mount

FBGA

YES

253-FBGA (11x11)

-30°C~85°C TC

Tray

Obsolete

3 (168 Hours)

253

EAR99

AUTO/SELF REFRESH; IT ALSO REQUIRES 1.8V NOM

SDRAM - Mobile LPDDR3

1.14V~1.95V

BOTTOM

1

1.2V

0.5mm

S-PBGA-B253

1.3V

1.14V

8Gb 128M x 64

1

Volatile

SYNCHRONOUS

933MHz

DRAM

Parallel

128MX64

64

8589934592 bit

SINGLE BANK PAGE BURST

0.85mm

11mm

11mm

ROHS3 Compliant

-
EDF8164A3MC-GD-F-R TR

Micron Technology Inc.

-

-

-

-

-

-30°C~85°C TC

Tape & Reel (TR)

Obsolete

1 (Unlimited)

-

-

-

SDRAM - Mobile LPDDR3

1.14V~1.95V

-

-

-

-

-

-

-

8Gb 128M x 64

-

Volatile

-

800MHz

DRAM

Parallel

-

-

-

-

-

-

-

-

EDF8164A3MA-JD-F-D vs EDF8164A3MC-GD-F-R TR
EDF8164A3MC-GD-F-R

Micron Technology Inc.

-

-

-

-

-

-30°C~85°C TC

Tape & Reel (TR)

Obsolete

1 (Unlimited)

-

-

-

SDRAM - Mobile LPDDR3

1.14V~1.95V

-

-

-

-

-

-

-

8Gb 128M x 64

-

Volatile

-

800MHz

DRAM

Parallel

-

-

-

-

-

-

-

-

EDF8164A3MA-JD-F-D vs EDF8164A3MC-GD-F-R
EDF8164A3PM-GD-F-D

Micron Technology Inc.

-

-

FBGA

-

-

-30°C~85°C TC

Tray

Obsolete

3 (168 Hours)

-

-

-

SDRAM - Mobile LPDDR3

1.14V~1.95V

-

-

-

-

-

-

-

8Gb 128M x 64

-

Volatile

-

800MHz

DRAM

Parallel

-

-

-

-

-

-

-

ROHS3 Compliant

EDF8164A3MA-JD-F-D vs EDF8164A3PM-GD-F-D