IDT, Integrated Device Technology Inc 72T72105L5BBGI

72T72105L5BBGI Overview
The packaging or casing of this particular product is known as BGA or ball grid array, which is a type of integrated circuit packaging. It has a total of 324 terminations, which are the points where the external connections are made. These terminations have a terminal finish of Tin/Silver/Copper (Sn/Ag/Cu), which is a combination of three elements that provide excellent conductivity and corrosion resistance. The terminal position is at the bottom of the package, making it easier to mount and connect to other components. With 324 pins, this BGA package has a single function and can operate at a maximum frequency of 200MHz. It uses a parallel connection, meaning data is transmitted simultaneously, and has a thickness of 1.76mm. Most importantly, this product is RoHS compliant, ensuring it meets the standards for environmental safety.

72T72105L5BBGI Features
512kB memory size
FIFOs category
Frequency at most

72T72105L5BBGI Applications
There are a lot of Integrated Device Technology (IDT) 72T72105L5BBGI FIFOs Memory applications.

General Data Collection Applications at Low-Temperatures
Application that requires re-writable nonvolatile parameter memory
Temporary storage elements
Buses
Programmable Logic Controller
Queues for communication systems
Tape controllers
Test site
Analog-to-digital converters
Firmware loaders