IDT, Integrated Device Technology Inc 72T7295L4-4BBG

Name: 72T7295L4-4BBG
Brand: IDT, Integrated Device Technology Inc
SKU: 3210297-72T7295L4-4BBG
Availability: InStock
Rating: 5 (1 reviews)

Part Number:: 72T7295L4-4BBG

Manufacturer:: IDT, Integrated Device Technology Inc

Ventron No:: 3210297-72T7295L4-4BBG

Description:: IC FIFO 32768X72 4-4NS 324-BGA

ECAD Model:

Datasheet:: 72T7295L4-4BBG

Specifications

IDT, Integrated Device Technology Inc 72T7295L4-4BBG technical specifications, attributes, parameters and parts with similar specifications to IDT, Integrated Device Technology Inc 72T7295L4-4BBG.

Factory Lead Time
7 Weeks
Contact Plating
Copper, Silver, Tin
Mount
Surface Mount
Package / Case
BGA
Number of Pins
324
Published
2009
JESD-609 Code
e1
Pbfree Code
yes
Part Status
Active
Moisture Sensitivity Level (MSL)
3
Number of Terminations
324
ECCN Code
EAR99
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
Max Operating Temperature
70°C
Min Operating Temperature
0°C
Additional Feature
ASYNCHRONOUS OPERATION ALSO POSSIBLE
HTS Code
8542.32.00.71
Subcategory
FIFOs
Technology
CMOS
Terminal Position
BOTTOM
Terminal Form
BALL
Peak Reflow Temperature (Cel)
260
Number of Functions
1
Supply Voltage
2.5V
Terminal Pitch
1mm
Reflow Temperature-Max (s)
30
Pin Count
324
Qualification Status
Not Qualified
Operating Supply Voltage
2.5V
Temperature Grade
COMMERCIAL
Max Supply Voltage
2.625V
Min Supply Voltage
2.375V
Element Configuration
Dual
Operating Mode
SYNCHRONOUS
Max Supply Current
130mA
Frequency (Max)
225MHz
Access Time
3.4 ns
Organization
32KX72
Standby Current-Max
0.02A
Memory Density
2359296 bit
Parallel/Serial
PARALLEL
Memory IC Type
OTHER FIFO
Bus Directional
Unidirectional
Retransmit Capability
Yes
Output Enable
YES
Cycle Time
4.44 ns
Height Seated (Max)
1.97mm
Length
19mm
Width
19mm
Thickness
1.76mm
RoHS Status
RoHS Compliant
Lead Free
Lead Free

Description

72T7295L4-4BBG Overview
The JESD-609 Code e1 is an actively available product with a total of 324 terminations. It has a maximum operating temperature of 70°C and a terminal position of BOTTOM. With a pin count of 324 and a temperature grade of COMMERCIAL, this product is designed to meet the demands of various commercial applications. It operates in a parallel configuration and has unidirectional bus directional capability. Additionally, the product features an output enable function, providing users with the flexibility to enable or disable the output as needed. With these specifications, the JESD-609 Code e1 is a reliable and efficient choice for a wide range of electronic systems.

72T7295L4-4BBG Features
FIFOs category
Frequency at most

72T7295L4-4BBG Applications
There are a lot of Integrated Device Technology (IDT) 72T7295L4-4BBG FIFOs Memory applications.

Cameras
Network bridges
Multi-stage synchronizer
Laser Receiver System
Networking
Desktop Computers
Down-Hole Energy Drilling
Network switching/routing
HDD
Analog-to-digital converters

72T7295L4-4BBG More Descriptions

IC FIFO ASYNC/SYNC 32KX72 324BGA
IC FIFO 32768X72 4-4NS 324-BGA
32K x 72 TeraSync FIFO, 2.5V

Product Comparison

The three parts on the right have similar specifications to 72T7295L4-4BBG.

Image

Part Number

Manufacturer

Factory Lead Time

Contact Plating

Mount

Package / Case

Number of Pins

Published

JESD-609 Code

Pbfree Code

Part Status

Moisture Sensitivity Level (MSL)

Number of Terminations

ECCN Code

Terminal Finish

Max Operating Temperature

Min Operating Temperature

Additional Feature

HTS Code

Subcategory

Technology

Terminal Position

Terminal Form

Peak Reflow Temperature (Cel)

Number of Functions

Supply Voltage

Terminal Pitch

Reflow Temperature-Max (s)

Pin Count

Qualification Status

Operating Supply Voltage

Temperature Grade

Max Supply Voltage

Min Supply Voltage

Element Configuration

Operating Mode

Max Supply Current

Frequency (Max)

Access Time

Organization

Standby Current-Max

Memory Density

Parallel/Serial

Memory IC Type

Bus Directional

Retransmit Capability

Output Enable

Cycle Time

Height Seated (Max)

Length

Width

Thickness

RoHS Status

Lead Free

Mounting Type

Operating Temperature

Packaging

Series

Voltage - Supply

Base Part Number

Function

Current - Supply (Max)

Memory Size

Data Rate

FWFT Support

Expansion Type

Frequency

Nominal Supply Current

Density

Sync/Async

Word Size

Weight

Number of Circuits

Data Bus Width

View Compare
72T7295L4-4BBG

IDT, Integrated Device Technology Inc

7 Weeks

Copper, Silver, Tin

Surface Mount

BGA

324

2009

e1

yes

Active

3

324

EAR99

Tin/Silver/Copper (Sn/Ag/Cu)

70°C

0°C

ASYNCHRONOUS OPERATION ALSO POSSIBLE

8542.32.00.71

FIFOs

CMOS

BOTTOM

BALL

260

1

2.5V

1mm

30

324

Not Qualified

2.5V

COMMERCIAL

2.625V

2.375V

Dual

SYNCHRONOUS

130mA

225MHz

3.4 ns

32KX72

0.02A

2359296 bit

PARALLEL

OTHER FIFO

Unidirectional

Yes

YES

4.44 ns

1.97mm

19mm

19mm

1.76mm

RoHS Compliant

Lead Free

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-
72T7285L4-4BB

IDT, Integrated Device Technology Inc

12 Weeks

-

-

324-BGA

-

-

-

-

Active

3 (168 Hours)

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

8ns, 3.4ns

-

-

-

-

-

Uni-Directional

-

-

-

-

-

-

-

Non-RoHS Compliant

-

Surface Mount

0°C~70°C

Tray

72T

2.375V~2.625V

72T7285

Asynchronous, Synchronous

130mA

1.125M 16K x 72

100MHz, 225MHz

Yes

Depth, Width

-

-

-

-

-

-

-

-

72T7295L4-4BBG vs 72T7285L4-4BB
72T7295L4-4BB

IDT, Integrated Device Technology Inc

7 Weeks

Lead, Tin

Surface Mount

BGA

324

2009

e0

no

Active

3

324

EAR99

Tin/Lead (Sn63Pb37)

70°C

0°C

-

8542.32.00.71

FIFOs

CMOS

BOTTOM

BALL

225

1

2.5V

1mm

20

324

Not Qualified

2.5V

COMMERCIAL

2.625V

2.375V

Dual

-

130mA

225MHz

3.4 ns

32KX72

0.05A

-

PARALLEL

OTHER FIFO

Unidirectional

Yes

YES

4.44 ns

1.97mm

19mm

19mm

1.76mm

RoHS Compliant

Contains Lead

-

-

Bulk

-

-

-

-

-

-

-

-

-

225MHz

130mA

2.3 Mb

Synchronous

72b

-

-

-

72T7295L4-4BBG vs 72T7295L4-4BB
72T72105L5BBGI

IDT, Integrated Device Technology Inc

7 Weeks

Copper, Silver, Tin

Surface Mount

BGA

324

2009

e1

yes

-

3

324

EAR99

Tin/Silver/Copper (Sn/Ag/Cu)

85°C

0°C

ASYNCHRONOUS OPERATION ALSO POSSIBLE

-

FIFOs

CMOS

BOTTOM

BALL

260

1

2.5V

-

30

324

Not Qualified

2.5V

INDUSTRIAL

2.625V

2.375V

-

SYNCHRONOUS

130mA

200MHz

3.6 ns

64KX72

0.02A

-

PARALLEL

OTHER FIFO

Unidirectional

Yes

YES

5 ns

-

19mm

19mm

1.76mm

RoHS Compliant

Lead Free

-

-

-

-

-

-

-

-

512kB

-

-

-

-

-

-

-

-

1.713814g

1

72b

72T7295L4-4BBG vs 72T72105L5BBGI