Part Number: XCZU2EG-L1SFVA625I vs XCZU5EV-L1FBVB900I

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Part Number: XCZU2EG-L1SFVA625I XCZU5EV-L1FBVB900I
Manufacturer: Xilinx Inc. Xilinx Inc.
Description: IC FPGA 180 I/O 625FCBGA IC FPGA 204 I/O 900FCBGA
Quantity Available: Available Available
Datasheets: - -
Factory Lead Time 11 Weeks 11 Weeks
Package / Case 625-BFBGA, FCBGA 900-BBGA, FCBGA
Surface Mount YES YES
Operating Temperature -40°C~100°C TJ -40°C~100°C TJ
Packaging Tray Tray
Series Zynq® UltraScale ™ MPSoC EG Zynq® UltraScale ™ MPSoC EV
Part Status Active Active
Moisture Sensitivity Level (MSL) 4 (72 Hours) 4 (72 Hours)
Number of Terminations 625 900
Additional Feature ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
HTS Code 8542.31.00.01 8542.31.00.01
Technology CMOS CMOS
Terminal Position BOTTOM BOTTOM
Terminal Form BALL BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED NOT SPECIFIED
Supply Voltage 0.72V 0.72V
Reflow Temperature-Max (s) NOT SPECIFIED NOT SPECIFIED
JESD-30 Code R-PBGA-B625 R-PBGA-B900
Supply Voltage-Max (Vsup) 0.742V 0.742V
Supply Voltage-Min (Vsup) 0.698V 0.698V
Number of I/O 180 204
Speed 500MHz, 600MHz, 1.2GHz 500MHz, 600MHz, 1.2GHz
RAM Size 256KB 256KB
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT MICROPROCESSOR CIRCUIT
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Peripherals DMA, WDT DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA MCU, FPGA
Primary Attributes Zynq®UltraScale ™ FPGA, 103K Logic Cells Zynq®UltraScale ™ FPGA, 256K Logic Cells
RoHS Status ROHS3 Compliant ROHS3 Compliant
Published - 2016
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