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Part Number: |
A2F060M3E-FG256M |
A2F060M3E-FGG256I |
Manufacturer: |
Microsemi Corporation |
Microsemi Corporation |
Description: |
IC FPGA 60K GATES 128KB 256FBGA |
IC FPGA 60K GATES 128KB 256FBGA |
Quantity Available: |
Available |
Available |
Datasheets: |
Military Grade SmartFusion (cSoC)
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SmartFusion cSoC Datasheet
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Package / Case |
256-LBGA |
256-LBGA |
Number of Pins |
256 |
256 |
Supplier Device Package |
256-FPBGA (17x17) |
256-FPBGA (17x17) |
Operating Temperature |
-55°C~125°C TJ |
-40°C~100°C TJ |
Packaging |
Tray |
Tray |
Series |
SmartFusion® |
SmartFusion® |
Part Status |
Obsolete |
Obsolete |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
3 (168 Hours) |
Max Operating Temperature |
125°C |
100°C |
Min Operating Temperature |
-55°C |
-40°C |
Frequency |
80MHz |
80MHz |
Base Part Number |
A2F060M3E |
A2F060M3E |
Interface |
EBI/EMI, I2C, SPI, UART, USART |
EBI/EMI, I2C, SPI, UART, USART |
Number of I/O |
MCU - 26, FPGA - 66 |
MCU - 26, FPGA - 66 |
Speed |
80MHz |
80MHz |
RAM Size |
16KB |
16KB |
Core Processor |
ARM® Cortex®-M3 |
ARM® Cortex®-M3 |
Peripherals |
DMA, POR, WDT |
DMA, POR, WDT |
Connectivity |
EBI/EMI, I2C, SPI, UART/USART |
EBI/EMI, I2C, SPI, UART/USART |
Architecture |
MCU, FPGA |
MCU, FPGA |
Core Architecture |
ARM |
ARM |
Primary Attributes |
ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops |
ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops |
Flash Size |
128KB |
128KB |
RoHS Status |
Non-RoHS Compliant |
RoHS Compliant |
Factory Lead Time |
- |
12 Weeks |
Published |
- |
2015 |
Operating Supply Voltage |
- |
1.5V |
Max Supply Voltage |
- |
1.575V |
Min Supply Voltage |
- |
1.425V |
Memory Size |
- |
4.5kB |
Operating Supply Current |
- |
3mA |
Data Rate |
- |
400 kbps |
Number of Logic Elements/Cells |
- |
660 |
Number of Gates |
- |
60000 |
Max Frequency |
- |
100MHz |
Submit RFQ: |
Submit |
Submit |