Altera 10AS027H2F34I1SG
- Part Number:
- 10AS027H2F34I1SG
- Manufacturer:
- Altera
- Ventron No:
- 3668793-10AS027H2F34I1SG
- Description:
- IC SOC FPGA 384 I/O 1152FBGA
- Datasheet:
- Arria 10 Device Datasheet
Altera 10AS027H2F34I1SG technical specifications, attributes, parameters and parts with similar specifications to Altera 10AS027H2F34I1SG.
- Package / Case1152-BBGA, FCBGA
- Surface MountYES
- Operating Temperature-40°C~100°C TJ
- PackagingTray
- SeriesArria 10 SX
- Part StatusDiscontinued
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- HTS Code8542.39.00.01
- Terminal PositionBOTTOM
- Terminal FormBALL
- Supply Voltage0.9V
- Terminal Pitch1mm
- JESD-30 CodeS-PBGA-B1152
- Supply Voltage-Max (Vsup)0.93V
- Supply Voltage-Min (Vsup)0.87V
- Number of I/O384
- Speed1.5GHz
- RAM Size256KB
- Core ProcessorDual ARM® Cortex®-A9 MPCore™ with CoreSight™
- PeripheralsDMA, POR, WDT
- ConnectivityEBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- ArchitectureMCU, FPGA
- Programmable Logic TypeFIELD PROGRAMMABLE GATE ARRAY
- Primary AttributesFPGA - 270K Logic Elements
- Height Seated (Max)3.65mm
- Length35mm
- Width35mm
- RoHS StatusRoHS Compliant
This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).
The package or case for this particular product is available in three different options: 1152-BBGA, FCBGA, and Tray packaging. The HTS Code for this package is 8542.39.00.01, indicating its classification as an electronic component. The terminal form for this package is BALL, which is a common form used for surface mount technology. The JESD-30 Code for this package is S-PBGA-B1152, providing a standardized identification code for the package type. In terms of connectivity, this package offers a variety of options such as EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG. This architecture is suitable for both microcontrollers (MCU) and field-programmable gate arrays (FPGA). The dimensions of this package are 35mm in length and 35mm in width, making it compact and versatile. Additionally, this package is RoHS compliant, ensuring its compliance with environmental regulations.
Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
There are a lot of Intel
10AS027H2F34I1SG System On Chip (SoC) applications.
External USB hard disk/SSD
Industrial AC-DC
Published Paper
Industrial
ARM
Deep learning hardware
Smartphone accessories
Cyberphysical system-on-chip
Sports
String inverter
The package or case for this particular product is available in three different options: 1152-BBGA, FCBGA, and Tray packaging. The HTS Code for this package is 8542.39.00.01, indicating its classification as an electronic component. The terminal form for this package is BALL, which is a common form used for surface mount technology. The JESD-30 Code for this package is S-PBGA-B1152, providing a standardized identification code for the package type. In terms of connectivity, this package offers a variety of options such as EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG. This architecture is suitable for both microcontrollers (MCU) and field-programmable gate arrays (FPGA). The dimensions of this package are 35mm in length and 35mm in width, making it compact and versatile. Additionally, this package is RoHS compliant, ensuring its compliance with environmental regulations.
Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
There are a lot of Intel
10AS027H2F34I1SG System On Chip (SoC) applications.
External USB hard disk/SSD
Industrial AC-DC
Published Paper
Industrial
ARM
Deep learning hardware
Smartphone accessories
Cyberphysical system-on-chip
Sports
String inverter
10AS027H2F34I1SG More Descriptions
IC SOC FPGA 384 I/O 1152FBGA Arria 10 SX
IC SOC CORTEX-A9 1.5GHZ 1152FBGA
IC FPGA FCBGA
IC SOC CORTEX-A9 1.5GHZ 1152FBGA
IC FPGA FCBGA
The three parts on the right have similar specifications to 10AS027H2F34I1SG.
-
ImagePart NumberManufacturerPackage / CaseSurface MountOperating TemperaturePackagingSeriesPart StatusMoisture Sensitivity Level (MSL)HTS CodeTerminal PositionTerminal FormSupply VoltageTerminal PitchJESD-30 CodeSupply Voltage-Max (Vsup)Supply Voltage-Min (Vsup)Number of I/OSpeedRAM SizeCore ProcessorPeripheralsConnectivityArchitectureProgrammable Logic TypePrimary AttributesHeight Seated (Max)LengthWidthRoHS StatusNumber of TerminationsSubcategoryTechnologyPeak Reflow Temperature (Cel)Reflow Temperature-Max (s)Number of OutputsQualification StatusPower SuppliesNumber of InputsNumber of Logic CellsView Compare
-
10AS027H2F34I1SG1152-BBGA, FCBGAYES-40°C~100°C TJTrayArria 10 SXDiscontinued3 (168 Hours)8542.39.00.01BOTTOMBALL0.9V1mmS-PBGA-B11520.93V0.87V3841.5GHz256KBDual ARM® Cortex®-A9 MPCore™ with CoreSight™DMA, POR, WDTEBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAFIELD PROGRAMMABLE GATE ARRAYFPGA - 270K Logic Elements3.65mm35mm35mmRoHS Compliant-----------
-
672-BBGA, FCBGA-0°C~100°C TJTrayArria 10 SXActive3 (168 Hours)--------2401.5GHz256KBDual ARM® Cortex®-A9 MPCore™ with CoreSight™DMA, POR, WDTEBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGA-FPGA - 160K Logic Elements---RoHS Compliant----------
-
672-BBGA, FCBGAYES-40°C~100°C TJTrayArria 10 SXActive3 (168 Hours)8542.39.00.01BOTTOMBALL0.9V1mmS-PBGA-B6720.93V0.87V2401.5GHz256KBDual ARM® Cortex®-A9 MPCore™ with CoreSight™DMA, POR, WDTEBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAFIELD PROGRAMMABLE GATE ARRAYFPGA - 160K Logic Elements3.25mm27mm27mmRoHS Compliant672Field Programmable Gate ArraysCMOSNOT SPECIFIEDNOT SPECIFIED240Not Qualified0.9V240160000
-
780-BBGA, FCBGAYES0°C~100°C TJTrayArria 10 SXDiscontinued3 (168 Hours)8542.39.00.01BOTTOMBALL0.9V1mmS-PBGA-B7800.93V0.87V2881.5GHz256KBDual ARM® Cortex®-A9 MPCore™ with CoreSight™DMA, POR, WDTEBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAFIELD PROGRAMMABLE GATE ARRAYFPGA - 160K Logic Elements3.35mm29mm29mmRoHS Compliant780Field Programmable Gate ArraysCMOSNOT SPECIFIEDNOT SPECIFIED288Not Qualified0.9V288160000
Popular Search Part Number
Related Keywords
Search Tags
Latest News
-
12 December 2023
TM1650 LED Driver IC Features, Working Principle, Applications, Usage and More
Ⅰ. Overview of TM1650Ⅱ. Symbol, footprint and pin configuration of TM1650Ⅲ. Features of TM1650 LED driverⅣ. Technical parameters of TM1650 LED driverⅤ. How does the TM1650 LED driver... -
13 December 2023
74HC00 Pin Configuration, Replacements, Applications and Other Details
Ⅰ. Overview of 74HC00Ⅱ. Pin configuration and functions of 74HC00Ⅲ. What are the features of 74HC00?Ⅳ. Technical parameters of 74HC00Ⅴ. Working principle of 74HC00Ⅵ. Absolute maximum ratings of... -
13 December 2023
2N2222A NPN Transistor Features, Technical Parameters, Working Principle, Applications and Usage
Ⅰ. Overview of 2N2222A transistorⅡ. Symbol, footprint and pin configuration of 2N2222A transistorⅢ. What are the features of 2N2222A transistor?Ⅳ. Technical parameters of 2N2222A transistorⅤ. How does the... -
14 December 2023
AT24C256 EEPROM Features, Functions, Working Principle, Applications and AT24C256 vs 24LC256
Ⅰ. What is programmable read-only memory?Ⅱ. Overview of AT24C256 EEPROMⅢ. Pin configuration of AT24C256 EEPROMⅣ. What are the features of AT24C256 EEPROM?Ⅴ. Functions of AT24C256 EEPROMⅥ. Working principle...
Help you to save your cost and time.
Reliable package for your goods.
Fast Reliable Delivery to save time.
Quality premium after-sale service.