MT53E256M32D2DS-053 AAT:B

Micron Technology Inc. MT53E256M32D2DS-053 AAT:B

Part Number:
MT53E256M32D2DS-053 AAT:B
Manufacturer:
Micron Technology Inc.
Ventron No:
7374469-MT53E256M32D2DS-053 AAT:B
Description:
Memory IC
ECAD Model:
Datasheet:
MT53E256M32D2DS-053 AAT:B

Quick Request Quote

Please send RFQ , We will respond immediately.

Part Number
Quantity
Company
E-mail
Phone
Comments
Specifications
Micron Technology Inc. MT53E256M32D2DS-053 AAT:B technical specifications, attributes, parameters and parts with similar specifications to Micron Technology Inc. MT53E256M32D2DS-053 AAT:B.
  • Factory Lead Time
    11 Weeks
  • Mounting Type
    Surface Mount
  • Package / Case
    200-WFBGA
  • Surface Mount
    YES
  • Operating Temperature
    -40°C~105°C
  • Packaging
    Tray
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Technology
    SDRAM - Mobile LPDDR4
  • Voltage - Supply
    0.6V 1.1V
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Number of Functions
    1
  • Time@Peak Reflow Temperature-Max (s)
    NOT SPECIFIED
  • JESD-30 Code
    X-PBGA-B
  • Memory Size
    8Gb 256M x 32
  • Number of Ports
    1
  • Memory Type
    Volatile
  • Operating Mode
    SYNCHRONOUS
  • Clock Frequency
    1.866GHz
  • Memory Format
    DRAM
  • Organization
    256MX32
  • Memory Width
    32
  • Memory Density
    8589934592 bit
  • RoHS Status
    ROHS3 Compliant
Description
MT53E256M32D2DS-053 AAT:B Overview
A Volatile-type memory can be classified as the memory type of this device. In addition, memory ics is available in a Tray case as well. Embedded in the 200-WFBGA case, memory ics is a single file. On the chip, there is an 8Gb 256M x 32 memory, which is the size of the chip's memory. There is a DRAM-format memory used in this device, which is the memory format used by mainstream devices. Featuring an extended operating temperature range of -40°C~105°C, this device allows it to be used in a variety of demanding applications. The device is capable of handling a supply voltage of 0.6V 1.1V volts. The recommended mounting type for memory ics is Surface Mount. The comprehensive working procedure of this part involves 1 functions. A clock frequency rotation within 1.866GHz is used for the ic memory chip to rotate data. 1 ports allow read/write access to one memory address in this chip.

MT53E256M32D2DS-053 AAT:B Features
Package / Case: 200-WFBGA


MT53E256M32D2DS-053 AAT:B Applications
There are a lot of Micron Technology Inc.
MT53E256M32D2DS-053 AAT:B Memory applications.


supercomputers
telecommunications
workstations,
DVD disk buffer
data buffer
nonvolatile BIOS memory
Camcorders
embedded logic
eDRAM
graphics card
MT53E256M32D2DS-053 AAT:B More Descriptions
Active BALL BOTTOM Volatile ic memory -40C~105C 0.6V 1.1V 8589934592bit 1.866GHz
DRAM Chip Mobile LPDDR4 SDRAM 8G-Bit 256M x 32 1.8V 200-Pin WFBGA
LPDDR4 DRAM, 128MX32, CMOS, PBGA200
DRAM DRAM LPDDR4 256MX32 WFBGA AAT
IC DRAM 8GBIT 1.866GHZ 200WFBGA
DRAM, 256M X 32BIT, -40 TO 105DEG C;
Dram, 256M X 32Bit, -40 To 105Deg C; Dram Type:Lpddr4; Dram Density:8Gbit; Dram Memory Configuration:256M X 32Bit; Clock Frequency:1.866Ghz; Memory Case Style:Wfbga; No. Of Pins:200Pins; Supply Voltage Nom:1.1V; Access Time:535Ps Rohs Compliant: Yes |Micron MT53E256M32D2DS-053 AAT:B
Product Comparison
The three parts on the right have similar specifications to MT53E256M32D2DS-053 AAT:B.
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

Latest News

  • cost

    Help you to save your cost and time.

  • package

    Reliable package for your goods.

  • fast

    Fast Reliable Delivery to save time.

  • service

    Quality premium after-sale service.