Micron Technology Inc. MT53B768M32D4NQ-062 WT:B
- Part Number:
- MT53B768M32D4NQ-062 WT:B
- Manufacturer:
- Micron Technology Inc.
- Ventron No:
- 7373993-MT53B768M32D4NQ-062 WT:B
- Description:
- Memory IC
- ECAD Model:
-
- Datasheet:
- MT53B768M32D4NQ-062 WT:B
Micron Technology Inc. MT53B768M32D4NQ-062 WT:B technical specifications, attributes, parameters and parts with similar specifications to Micron Technology Inc. MT53B768M32D4NQ-062 WT:B.
- Mounting TypeSurface Mount
- Package / Case200-VFBGA
- Operating Temperature-30°C~85°C TC
- PackagingTray
- Part StatusNot For New Designs
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- TechnologySDRAM - Mobile LPDDR4
- Voltage - Supply1.1V
- Memory Size24Gb 768M x 32
- Memory TypeVolatile
- Clock Frequency1600MHz
- Memory FormatDRAM
- RoHS StatusROHS3 Compliant
MT53B768M32D4NQ-062 WT:B Overview
Its memory type can be classified as Volatile. It comes in a Tray. It is available in 200-VFBGA case. The memory size of the chip is 24Gb 768M x 32 Mb. This device utilizes a DRAM format memory which is of mainstream design. With an extended designed operating temperature of -30°C~85°C TC, this device is capable of lots of demanding applications. It is supplied votage within 1.1V. Its recommended mounting type is Surface Mount. The memory has a clock frequency rotation within 1600MHz.
MT53B768M32D4NQ-062 WT:B Features
Package / Case: 200-VFBGA
MT53B768M32D4NQ-062 WT:B Applications
There are a lot of Micron Technology Inc.
MT53B768M32D4NQ-062 WT:B Memory applications.
Cache memory
cell phones
eSRAM
mainframes
multimedia computers
networking
personal computers
servers
supercomputers
telecommunications
Its memory type can be classified as Volatile. It comes in a Tray. It is available in 200-VFBGA case. The memory size of the chip is 24Gb 768M x 32 Mb. This device utilizes a DRAM format memory which is of mainstream design. With an extended designed operating temperature of -30°C~85°C TC, this device is capable of lots of demanding applications. It is supplied votage within 1.1V. Its recommended mounting type is Surface Mount. The memory has a clock frequency rotation within 1600MHz.
MT53B768M32D4NQ-062 WT:B Features
Package / Case: 200-VFBGA
MT53B768M32D4NQ-062 WT:B Applications
There are a lot of Micron Technology Inc.
MT53B768M32D4NQ-062 WT:B Memory applications.
Cache memory
cell phones
eSRAM
mainframes
multimedia computers
networking
personal computers
servers
supercomputers
telecommunications
MT53B768M32D4NQ-062 WT:B More Descriptions
SLC NAND Flash Parallel 1.8V 4Gbit 512M x 8Bit 63-Pin VFBGA
Z0AM LPDDR4 24G 768MX32 FBGA QDP
IC DRAM 24GBIT 1600MHZ 200VFBGA
MICMT53B768M32D4NQ-062 WT:B LPDDR4 24G 7
Z0AM LPDDR4 24G 768MX32 FBGA QDP
IC DRAM 24GBIT 1600MHZ 200VFBGA
MICMT53B768M32D4NQ-062 WT:B LPDDR4 24G 7
The three parts on the right have similar specifications to MT53B768M32D4NQ-062 WT:B.
-
ImagePart NumberManufacturerMounting TypePackage / CaseOperating TemperaturePackagingPart StatusMoisture Sensitivity Level (MSL)TechnologyVoltage - SupplyMemory SizeMemory TypeClock FrequencyMemory FormatRoHS StatusFactory Lead TimeSupplier Device PackageView Compare
-
MT53B768M32D4NQ-062 WT:BSurface Mount200-VFBGA-30°C~85°C TCTrayNot For New Designs3 (168 Hours)SDRAM - Mobile LPDDR41.1V24Gb 768M x 32Volatile1600MHzDRAMROHS3 Compliant--- -
Surface Mount200-WFBGA-40°C~125°C TATape & Reel (TR)Obsolete3 (168 Hours)SDRAM - Mobile LPDDR41.1V8Gb 256M x 32Volatile1.6GHzDRAMROHS3 Compliant6 Weeks200-WFBGA (10x14.5)
-
Surface Mount200-WFBGA-40°C~95°C TCTrayActive-SDRAM - Mobile LPDDR41.1V16Gb 512M x 32Volatile1600MHzDRAM---
-
Surface Mount200-WFBGA-30°C~85°C TCTape & Reel (TR)Active3 (168 Hours)SDRAM - Mobile LPDDR41.1V16Gb 512M x 32Volatile1866MHzDRAMROHS3 Compliant--
-
Automotive, AEC-Q100 Memory IC Automotive, AEC-Q100 Series
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