Micron Technology Inc. MT52L256M64D2PP-107 WT:B

Name: MT52L256M64D2PP-107 WT:B
Brand: Micron Technology Inc.
SKU: 7373900-MT52L256M64D2PP-107 WT:B
Availability: InStock
Rating: 5 (1 reviews)

Part Number:: MT52L256M64D2PP-107 WT:B

Manufacturer:: Micron Technology Inc.

Ventron No:: 7373900-MT52L256M64D2PP-107 WT:B

Description:: Memory IC 12mm mm

ECAD Model:

Datasheet:: MT52L256M64D2PP-107 WT:B

Specifications

Micron Technology Inc. MT52L256M64D2PP-107 WT:B technical specifications, attributes, parameters and parts with similar specifications to Micron Technology Inc. MT52L256M64D2PP-107 WT:B.

Mounting Type
Surface Mount
Package / Case
253-VFBGA
Surface Mount
YES
Operating Temperature
-30°C~85°C TC
Packaging
Tray
Part Status
Active
Number of Terminations
216
Additional Feature
AUTO/SELF REFRESH; IT ALSO REQUIRES 1.8V NOM
Technology
SDRAM - Mobile LPDDR3
Voltage - Supply
1.2V
Terminal Position
BOTTOM
Terminal Form
BALL
Number of Functions
1
Supply Voltage
1.2V
Terminal Pitch
0.4mm
Reach Compliance Code
compliant
JESD-30 Code
S-PBGA-B216
Supply Voltage-Max (Vsup)
1.3V
Supply Voltage-Min (Vsup)
1.14V
Memory Size
16Gb 256M x 64
Number of Ports
1
Memory Type
Volatile
Operating Mode
SYNCHRONOUS
Clock Frequency
933MHz
Memory Format
DRAM
Organization
256MX64
Memory Width
64
Memory Density
17179869184 bit
Access Mode
SINGLE BANK PAGE BURST
Length
12mm
Height Seated (Max)
0.8mm
Width
12mm

Description

MT52L256M64D2PP-107 WT:B Overview
There is a memory type Volatile for this type of device. The case comes in the Tray style. The file is embedded in a 253-VFBGA case. This chip has an 16Gb 256M x 64 size of memory on it, so a lot of data can be stored on it. Memory data is stored in DRAM-format, which is common in mainstream devices. -30°C~85°C TC is an extended operating temperature range, making this device ideal for demanding applications. A supply voltage of 1.2V can be applied to it. There is a recommended mounting type of Surface Mount for it. The chip contains 216 terminations. As many as 1 functions are supported for comprehensive working. An 1.2V supply is required for this ic memory chip to operate properly. During the rotation of the clock, the ic memory chip is set as 933MHz. Although it has all the merits this chip has, it is also equipped with AUTO/SELF REFRESH; IT ALSO REQUIRES 1.8V NOM to give a performance boost to the system. Each memory address is accessed by one of 1 ports on this chip.

MT52L256M64D2PP-107 WT:B Features
Package / Case: 253-VFBGA
Additional Feature:AUTO/SELF REFRESH; IT ALSO REQUIRES 1.8V NOM

MT52L256M64D2PP-107 WT:B Applications
There are a lot of Micron Technology Inc.
MT52L256M64D2PP-107 WT:B Memory applications.

personal computers
servers
supercomputers
telecommunications
workstations,
DVD disk buffer
data buffer
nonvolatile BIOS memory
Camcorders
embedded logic

MT52L256M64D2PP-107 WT:B More Descriptions

DRAM Chip Mobile LPDDR3 SDRAM 16G-Bit 256Mx64 1.2V 253-Pin VFBGA
IC DRAM 16GBIT 933MHZ 253VFBGA
DRAM, 256M X 64BIT, -30 TO 85DEG C; DRAM Type:LPDDR3; Memory Configuration:256M x 64bit; Clock Frequency Max:933MHz; IC Case / Package:VFBGA; No. of Pins:253Pins; Supply Voltage Nom:1.2V; IC Mounting:Surface Mount; Product Range:- RoHS Compliant: Yes

Product Comparison

The three parts on the right have similar specifications to MT52L256M64D2PP-107 WT:B.

Image

Part Number

Manufacturer

Mounting Type

Package / Case

Surface Mount

Operating Temperature

Packaging

Part Status

Number of Terminations

Additional Feature

Technology

Voltage - Supply

Terminal Position

Terminal Form

Number of Functions

Supply Voltage

Terminal Pitch

Reach Compliance Code

JESD-30 Code

Supply Voltage-Max (Vsup)

Supply Voltage-Min (Vsup)

Memory Size

Number of Ports

Memory Type

Operating Mode

Clock Frequency

Memory Format

Organization

Memory Width

Memory Density

Access Mode

Length

Height Seated (Max)

Width

ECCN Code

Peak Reflow Temperature (Cel)

Time@Peak Reflow Temperature-Max (s)

RoHS Status

View Compare
MT52L256M64D2PP-107 WT:B

Micron Technology Inc.

Surface Mount

253-VFBGA

YES

-30°C~85°C TC

Tray

Active

216

AUTO/SELF REFRESH; IT ALSO REQUIRES 1.8V NOM

SDRAM - Mobile LPDDR3

1.2V

BOTTOM

BALL

1

1.2V

0.4mm

compliant

S-PBGA-B216

1.3V

1.14V

16Gb 256M x 64

1

Volatile

SYNCHRONOUS

933MHz

DRAM

256MX64

64

17179869184 bit

SINGLE BANK PAGE BURST

12mm

0.8mm

12mm

-

-

-

-

-
MT52L256M64D2LZ-107 WT:B

Micron Technology Inc.

Surface Mount

216-WFBGA

YES

-30°C~85°C TC

Tray

Active

216

AUTO/SELF REFRESH; IT ALSO REQUIRES 1.8V NOM

SDRAM - Mobile LPDDR3

1.2V

BOTTOM

BALL

1

1.2V

0.4mm

compliant

S-PBGA-B216

1.3V

1.14V

16Gb 256M x 64

1

Volatile

SYNCHRONOUS

933MHz

DRAM

256MX64

64

17179869184 bit

SINGLE BANK PAGE BURST

12mm

0.8mm

12mm

EAR99

NOT SPECIFIED

NOT SPECIFIED

RoHS Compliant

MT52L256M64D2PP-107 WT:B vs MT52L256M64D2LZ-107 WT:B
MT52L256M64D2FT-107 WT:B

Micron Technology Inc.

-

-

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-

Box

Active

-

-

-

-

-

-

-

-

-

-

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-

-

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MT52L256M64D2PP-107 WT:B vs MT52L256M64D2FT-107 WT:B
MT52L512M32D2PU-107 WT:B

Micron Technology Inc.

Surface Mount

-

-

-30°C~85°C TC

Tray

Active

-

-

SDRAM - Mobile LPDDR3

1.2V

-

-

-

-

-

-

-

-

-

16Gb 512M x 32

-

Volatile

-

933MHz

DRAM

-

-

-

-

-

-

-

-

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MT52L256M64D2PP-107 WT:B vs MT52L512M32D2PU-107 WT:B