Xilinx Inc. XCKU060-1FFVA1156C

Name: XCKU060-1FFVA1156C
Brand: Xilinx Inc.
SKU: 3636025-XCKU060-1FFVA1156C
Availability: InStock
Rating: 5 (1 reviews)

Part Number:: XCKU060-1FFVA1156C

Manufacturer:: Xilinx Inc.

Ventron No:: 3636025-XCKU060-1FFVA1156C

Description:: IC FPGA 520 I/O 1156FCBGA

ECAD Model:

Datasheet:: XCKU060-1FFVA1156C

Specifications

Xilinx Inc. XCKU060-1FFVA1156C technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XCKU060-1FFVA1156C.

Factory Lead Time
10 Weeks
Contact Plating
Copper, Silver, Tin
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
1156-BBGA, FCBGA
Operating Temperature
0°C~85°C TJ
Packaging
Tray
Published
2012
Series
Kintex® UltraScale™
JESD-609 Code
e1
Part Status
Active
Moisture Sensitivity Level (MSL)
4 (72 Hours)
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
Subcategory
Field Programmable Gate Arrays
Technology
CMOS
Voltage - Supply
0.922V~0.979V
Terminal Position
BOTTOM
Terminal Form
BALL
Supply Voltage
0.95V
Number of Outputs
520
Power Supplies
0.95V
Number of I/O
520
RAM Size
4.6MB
Number of Inputs
520
Organization
2760 CLBS
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells
725550
Total RAM Bits
38912000
Number of LABs/CLBs
41460
Speed Grade
1
Number of Registers
663360
Number of CLBs
2760
Length
35mm
Width
35mm
Radiation Hardening
No
RoHS Status
ROHS3 Compliant

Description

XCKU060-1FFVA1156C Overview
The manufacturer of this component is Xilinx Inc. It is a type of chip known as Embedded - FPGAs (Field Programmable Gate Array), which falls under the category of Embedded - FPGAs (Field Programmable Gate Array). It is designed to be mounted on the surface of a circuit board. The specific package or case for this chip is 1156-BBGA or FCBGA. It is packaged in a tray for easy handling and storage. This part is currently in active production. The terminal position for this chip is located at the bottom and the terminal form is in the shape of a ball. It requires a power supply of 0.95V. The chip has a RAM size of 4.6MB and a total of 38912000 RAM bits. It is also compliant with the Restriction of Hazardous Substances Directive (RoHS), meaning it is free from certain hazardous materials.

XCKU060-1FFVA1156C Features
520 I/Os
Up to 38912000 RAM bits
663360 registers

XCKU060-1FFVA1156C Applications
There are a lot of Xilinx Inc. XCKU060-1FFVA1156C FPGAs applications.

Defense Applications
Embedded Vision
Data center search engines
Software-defined radio
Wireless Communications
Space Applications
Scientific Instruments
Medical Electronics
Development Boards and Shields for Microcontrollers
Data Center

XCKU060-1FFVA1156C More Descriptions

Kintex UltraScale 580440 Cells 1156-Pin FC-BGA
IC FPGA 520 I/O 1156FCBGA
FPGA, KINTEX ULTRASCALE, 520 I/O, FCBGA; No. of Logic Blocks: 331680; No. of Macrocells: 725550; FPGA Family: Kintex UltraScale; Logic Case Style: FCBGA; No. of Pins: 1156Pins; No. of Speed Grades: -1; Total RAM Bits: 38000Kbit

Product Comparison

The three parts on the right have similar specifications to XCKU060-1FFVA1156C.

Image

Part Number

Manufacturer

Factory Lead Time

Contact Plating

Mount

Mounting Type

Package / Case

Operating Temperature

Packaging

Published

Series

JESD-609 Code

Part Status

Moisture Sensitivity Level (MSL)

Terminal Finish

Subcategory

Technology

Voltage - Supply

Terminal Position

Terminal Form

Supply Voltage

Number of Outputs

Power Supplies

Number of I/O

RAM Size

Number of Inputs

Organization

Programmable Logic Type

Number of Logic Elements/Cells

Total RAM Bits

Number of LABs/CLBs

Speed Grade

Number of Registers

Number of CLBs

Length

Width

Radiation Hardening

RoHS Status

HTS Code

Surface Mount

ECCN Code

Packing Method

Peak Reflow Temperature (Cel)

Terminal Pitch

Reflow Temperature-Max (s)

JESD-30 Code

Qualification Status

Height Seated (Max)

Time@Peak Reflow Temperature-Max (s)

View Compare
XCKU060-1FFVA1156C

Xilinx Inc.

10 Weeks

Copper, Silver, Tin

Surface Mount

Surface Mount

1156-BBGA, FCBGA

0°C~85°C TJ

Tray

2012

Kintex® UltraScale™

e1

Active

4 (72 Hours)

Tin/Silver/Copper (Sn/Ag/Cu)

Field Programmable Gate Arrays

CMOS

0.922V~0.979V

BOTTOM

BALL

0.95V

520

0.95V

520

4.6MB

520

2760 CLBS

FIELD PROGRAMMABLE GATE ARRAY

725550

38912000

41460

1

663360

2760

35mm

35mm

No

ROHS3 Compliant

-

-

-

-

-

-

-

-

-

-

-

-
XCKU5P-L1FFVA676I

Xilinx Inc.

11 Weeks

-

-

Surface Mount

676-BBGA, FCBGA

-40°C~100°C TJ

Tray

-

Kintex® UltraScale ™

-

Active

4 (72 Hours)

-

-

-

0.698V~0.876V

-

-

-

-

-

256

-

-

-

FIELD PROGRAMMABLE GATE ARRAY

474600

41984000

27120

-

-

-

-

-

-

ROHS3 Compliant

8542.39.00.01

-

-

-

-

-

-

-

-

-

-

XCKU060-1FFVA1156C vs XCKU5P-L1FFVA676I
XCKU040-L1FFVA1156I

Xilinx Inc.

10 Weeks

-

-

Surface Mount

1156-BBGA, FCBGA

-40°C~100°C TJ

Bulk

2012

Kintex® UltraScale™

e1

Active

4 (72 Hours)

Tin/Silver/Copper (Sn/Ag/Cu)

Field Programmable Gate Arrays

CMOS

0.880V~0.979V

BOTTOM

BALL

0.9V

520

0.9V

520

2.6MB

520

1920 CLBS

FIELD PROGRAMMABLE GATE ARRAY

530250

21606000

30300

-

-

1920

35mm

35mm

-

ROHS3 Compliant

8542.39.00.01

YES

3A991.D

TRAY

NOT SPECIFIED

1mm

NOT SPECIFIED

S-PBGA-B1156

Not Qualified

3.51mm

-

XCKU060-1FFVA1156C vs XCKU040-L1FFVA1156I
XCKU085-1FLVF1924I

Xilinx Inc.

10 Weeks

-

-

Surface Mount

1924-BBGA, FCBGA

-40°C~100°C TJ

Bulk

2012

Kintex® UltraScale™

-

Active

4 (72 Hours)

-

Field Programmable Gate Arrays

CMOS

0.922V~0.979V

BOTTOM

BALL

0.95V

624

0.95V

624

-

624

4100 CLBS

FIELD PROGRAMMABLE GATE ARRAY

1088325

58265600

62190

-

-

4100

45mm

45mm

-

ROHS3 Compliant

8542.39.00.01

YES

3A001.A.7.B

TRAY

NOT SPECIFIED

1mm

-

S-PBGA-B1924

Not Qualified

4.13mm

NOT SPECIFIED

XCKU060-1FFVA1156C vs XCKU085-1FLVF1924I