Xilinx Inc. XC17S200AVOG8C
- Part Number:
- XC17S200AVOG8C
- Manufacturer:
- Xilinx Inc.
- Ventron No:
- 3729364-XC17S200AVOG8C
- Description:
- IC PROM SERIAL 200K 8-SOIC
- Datasheet:
- XC17S200AVOG8C
Xilinx Inc. XC17S200AVOG8C technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC17S200AVOG8C.
- Mounting TypeSurface Mount
- Package / Case8-SOIC (0.154, 3.90mm Width)
- Surface MountYES
- Number of Pins8
- Operating Temperature0°C~70°C
- PackagingTray
- Published1999
- JESD-609 Codee3
- Pbfree Codeyes
- Part StatusObsolete
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Number of Terminations8
- ECCN CodeEAR99
- Terminal FinishMatte Tin (Sn)
- TechnologyCMOS
- Voltage - Supply3V~3.6V
- Terminal PositionDUAL
- Terminal FormGULL WING
- Peak Reflow Temperature (Cel)260
- Number of Functions1
- Supply Voltage3.3V
- Terminal Pitch1.27mm
- Reflow Temperature-Max (s)30
- Base Part NumberXC17S200A
- Pin Count8
- Operating Supply Voltage3.3V
- Supply Voltage-Max (Vsup)3.6V
- Supply Voltage-Min (Vsup)3V
- Programmable TypeOTP
- Memory Size2Mb
- Supply Current-Max0.015mA
- Output Characteristics3-STATE
- Memory Width1
- Standby Current-Max0.001A
- Parallel/SerialSERIAL
- I/O TypeCOMMON
- Memory IC TypeCONFIGURATION MEMORY
- Height Seated (Max)1.2mm
- Length4.9mm
- Width3.9mm
- Radiation HardeningNo
- RoHS StatusRoHS Compliant
XC17S200AVOG8C Overview
The package uses a neat 8-SOIC (0.154, 3.90mm Width) interface.Tray external packaging.Licensed to operate in 0°C~70°C.Using OTP, you can program it.There is a voltage of 3V~3.6V applied to the device.The memory device is mounted in Surface Mount.The size of data storage is limited to 2Mb.Other related parts can be found by searching "XC17S200A".3.3V is the required supply voltage.Different types of 8 terminations are available with different functions.FPGA is possible to use this memory device wFPGAh a maximum voltage of 3.6V.FPGA is imperative that the voltage of the device supply is at least 3V if the device is to work properly.This is a CONFIGURATION MEMORY memory chip.If reflow soldering is being performed, the temperature should not be higher than 260 when soldering should be reflowed.Pins on it are 8-shaped.SERIAL-process memory transmits data.For the memory chip to operate, it requires a voltage not exceeding 0.015mA.There is a set of 8 pins included with the part.There is a configuration of COMMON for the memory's I/O.Using 3.3V on the part before use will help the part run safely and reliably in a circuit.
XC17S200AVOG8C Features
Operating temperature: 0°C~70°C.
OTP program capability.
CONFIGURATION MEMORY memory IC.
SERIAL processing.
COMMON I/O equipped.
XC17S200AVOG8C Applications
There are a lot of Xilinx Inc. XC17S200AVOG8C applications of configuration proms for FPGAs.
personal digital assistants
eDRAM
DVD disk buffer
servers
networking
workstations,
hard disk drive (HDD)
eSRAM
networks
personal computers
The package uses a neat 8-SOIC (0.154, 3.90mm Width) interface.Tray external packaging.Licensed to operate in 0°C~70°C.Using OTP, you can program it.There is a voltage of 3V~3.6V applied to the device.The memory device is mounted in Surface Mount.The size of data storage is limited to 2Mb.Other related parts can be found by searching "XC17S200A".3.3V is the required supply voltage.Different types of 8 terminations are available with different functions.FPGA is possible to use this memory device wFPGAh a maximum voltage of 3.6V.FPGA is imperative that the voltage of the device supply is at least 3V if the device is to work properly.This is a CONFIGURATION MEMORY memory chip.If reflow soldering is being performed, the temperature should not be higher than 260 when soldering should be reflowed.Pins on it are 8-shaped.SERIAL-process memory transmits data.For the memory chip to operate, it requires a voltage not exceeding 0.015mA.There is a set of 8 pins included with the part.There is a configuration of COMMON for the memory's I/O.Using 3.3V on the part before use will help the part run safely and reliably in a circuit.
XC17S200AVOG8C Features
Operating temperature: 0°C~70°C.
OTP program capability.
CONFIGURATION MEMORY memory IC.
SERIAL processing.
COMMON I/O equipped.
XC17S200AVOG8C Applications
There are a lot of Xilinx Inc. XC17S200AVOG8C applications of configuration proms for FPGAs.
personal digital assistants
eDRAM
DVD disk buffer
servers
networking
workstations,
hard disk drive (HDD)
eSRAM
networks
personal computers
XC17S200AVOG8C More Descriptions
Configuration Memory, 1335840X1, Serial, CMOS, PQFP44
XC17S200A Matte Tin (Sn) EAR99 Tray ics fpga configuration 3.9mm 0.001A 2Mb 3.3V
PROM Serial 1.6M-bit 3.3V 8-Pin TSOP
Product Description Demo for Development.
XC17S200A Matte Tin (Sn) EAR99 Tray ics fpga configuration 3.9mm 0.001A 2Mb 3.3V
PROM Serial 1.6M-bit 3.3V 8-Pin TSOP
Product Description Demo for Development.
The three parts on the right have similar specifications to XC17S200AVOG8C.
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ImagePart NumberManufacturerMounting TypePackage / CaseSurface MountNumber of PinsOperating TemperaturePackagingPublishedJESD-609 CodePbfree CodePart StatusMoisture Sensitivity Level (MSL)Number of TerminationsECCN CodeTerminal FinishTechnologyVoltage - SupplyTerminal PositionTerminal FormPeak Reflow Temperature (Cel)Number of FunctionsSupply VoltageTerminal PitchReflow Temperature-Max (s)Base Part NumberPin CountOperating Supply VoltageSupply Voltage-Max (Vsup)Supply Voltage-Min (Vsup)Programmable TypeMemory SizeSupply Current-MaxOutput CharacteristicsMemory WidthStandby Current-MaxParallel/SerialI/O TypeMemory IC TypeHeight Seated (Max)LengthWidthRadiation HardeningRoHS StatusAdditional FeaturePower SuppliesVoltageClock FrequencyOrganizationDensityLead FreeReach Compliance CodeQualification StatusOperating ModeMemory DensityView Compare
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XC17S200AVOG8CSurface Mount8-SOIC (0.154, 3.90mm Width)YES80°C~70°CTray1999e3yesObsolete3 (168 Hours)8EAR99Matte Tin (Sn)CMOS3V~3.6VDUALGULL WING26013.3V1.27mm30XC17S200A83.3V3.6V3VOTP2Mb0.015mA3-STATE10.001ASERIALCOMMONCONFIGURATION MEMORY1.2mm4.9mm3.9mmNoRoHS Compliant------------
-
Through Hole8-DIP (0.300, 7.62mm)NO80°C~70°CTube2000e0-ObsoleteNot Applicable8EAR99-CMOS4.75V~5.25VDUAL-22515V2.54mm30XC17256E85V--OTP256Kb0.01mA3-STATE10.00005ASERIALCOMMONCONFIGURATION MEMORY4.5974mm9.3599mm7.62mmNoNon-RoHS CompliantUSED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS5V5V15MHz256KX1256 kbContains Lead----
-
Through Hole8-DIP (0.300, 7.62mm)NO8-40°C~85°CTube2000e0-ObsoleteNot Applicable8EAR99-CMOS3V~3.6VDUAL-22513.3V2.54mm30XC17128EL8-3.6V3VOTP128kb0.005mA3-STATE10.00005ASERIALCOMMONCONFIGURATION MEMORY4.5974mm9.3599mm7.62mm-Non-RoHS CompliantUSED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS3.3V-15MHz--Contains Leadnot_compliantNot QualifiedSYNCHRONOUS131072 bit
-
Surface Mount8-SOIC (0.154, 3.90mm Width)YES8-40°C~85°CTube2000e0-Obsolete1 (Unlimited)8EAR99-CMOS4.5V~5.5VDUALGULL WING22515V1.27mm30XC17128E8-5.5V4.5VOTP128kb0.01mA3-STATE10.00005ASERIALCOMMONCONFIGURATION MEMORY-4.9276mm3.937mm-Non-RoHS CompliantUSED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS5V-15MHz--Contains Leadnot_compliantNot QualifiedSYNCHRONOUS131072 bit
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