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W29N02GVBIAF

Winbond Electronics W29N02GVBIAF

Part Number:
W29N02GVBIAF
Manufacturer:
Winbond Electronics
Ventron No:
3720443-W29N02GVBIAF
Description:
IC FLASH 2GBIT 25NS 63VFBGA
ECAD Model:
Datasheet:
W29N02GVBIAF

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Specifications
Winbond Electronics W29N02GVBIAF technical specifications, attributes, parameters and parts with similar specifications to Winbond Electronics W29N02GVBIAF.
  • Factory Lead Time
    10 Weeks
  • Mounting Type
    Surface Mount
  • Package / Case
    63-VFBGA
  • Surface Mount
    YES
  • Number of Pins
    63
  • Operating Temperature
    -40°C~85°C TA
  • Packaging
    Tray
  • Published
    2016
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    63
  • Technology
    FLASH - NAND (SLC)
  • Voltage - Supply
    2.7V~3.6V
  • Terminal Position
    BOTTOM
  • Number of Functions
    1
  • Supply Voltage
    3V
  • Terminal Pitch
    0.8mm
  • Supply Voltage-Max (Vsup)
    3.6V
  • Supply Voltage-Min (Vsup)
    2.7V
  • Memory Size
    2Gb 256M x 8
  • Memory Type
    Non-Volatile
  • Operating Mode
    ASYNCHRONOUS
  • Memory Format
    FLASH
  • Memory Interface
    Parallel
  • Organization
    256MX8
  • Memory Width
    8
  • Write Cycle Time - Word, Page
    25ns
  • Memory Density
    2147483648 bit
  • Programming Voltage
    3.3V
  • Height Seated (Max)
    1mm
  • Length
    11mm
  • Width
    9mm
  • RoHS Status
    ROHS3 Compliant
Description
W29N02GVBIAF Overview
The package or case for this particular component is a 63-VFBGA, which stands for Very Fine Pitch Ball Grid Array. It is a surface mount package, meaning it can be mounted directly onto a circuit board without the need for any additional hardware. This component has a wide operating temperature range of -40°C to 85°C, making it suitable for use in various environments. Its part status is active, indicating that it is currently in production and readily available for purchase. The supply voltage for this component is 3V, with a minimum supply voltage of 2.7V. It also uses FLASH memory format and has a parallel memory interface with a width of 8. The overall width of this component is 9mm, making it compact and space-saving.

W29N02GVBIAF Features
Package / Case: 63-VFBGA
63 Pins


W29N02GVBIAF Applications
There are a lot of Winbond Electronics
W29N02GVBIAF Memory applications.


multimedia computers
networking
personal computers
servers
supercomputers
telecommunications
workstations,
DVD disk buffer
data buffer
nonvolatile BIOS memory
W29N02GVBIAF More Descriptions
IC FLASH 2GBIT PARALLEL 63VFBGA
Product Comparison
The three parts on the right have similar specifications to W29N02GVBIAF.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Mounting Type
    Package / Case
    Surface Mount
    Number of Pins
    Operating Temperature
    Packaging
    Published
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    Technology
    Voltage - Supply
    Terminal Position
    Number of Functions
    Supply Voltage
    Terminal Pitch
    Supply Voltage-Max (Vsup)
    Supply Voltage-Min (Vsup)
    Memory Size
    Memory Type
    Operating Mode
    Memory Format
    Memory Interface
    Organization
    Memory Width
    Write Cycle Time - Word, Page
    Memory Density
    Programming Voltage
    Height Seated (Max)
    Length
    Width
    RoHS Status
    Peak Reflow Temperature (Cel)
    Reach Compliance Code
    Time@Peak Reflow Temperature-Max (s)
    Pbfree Code
    View Compare
  • W29N02GVBIAF
    W29N02GVBIAF
    Winbond Electronics
    10 Weeks
    Surface Mount
    63-VFBGA
    YES
    63
    -40°C~85°C TA
    Tray
    2016
    Active
    3 (168 Hours)
    63
    FLASH - NAND (SLC)
    2.7V~3.6V
    BOTTOM
    1
    3V
    0.8mm
    3.6V
    2.7V
    2Gb 256M x 8
    Non-Volatile
    ASYNCHRONOUS
    FLASH
    Parallel
    256MX8
    8
    25ns
    2147483648 bit
    3.3V
    1mm
    11mm
    9mm
    ROHS3 Compliant
    -
    -
    -
    -
    -
  • W29N04GVBIAF
    W29N04GVBIAF
    Winbond Electronics
    10 Weeks
    Surface Mount
    63-VFBGA
    -
    63
    -40°C~85°C TA
    Tray
    2016
    Active
    3 (168 Hours)
    -
    FLASH - NAND (SLC)
    2.7V~3.6V
    -
    -
    -
    -
    -
    -
    4Gb 512M x 8
    Non-Volatile
    -
    FLASH
    Parallel
    -
    -
    25ns
    -
    3.3V
    -
    -
    -
    ROHS3 Compliant
    NOT SPECIFIED
    unknown
    NOT SPECIFIED
    -
    W29N02GVBIAF vs W29N04GVBIAF
  • W29N01GVDIAA
    W29N01GVDIAA
    Winbond Electronics
    20 Weeks
    Surface Mount
    48-VFBGA
    YES
    48
    -40°C~85°C TA
    Tray
    2016
    Discontinued
    3 (168 Hours)
    48
    FLASH - NAND (SLC)
    2.7V~3.6V
    BOTTOM
    1
    3.3V
    0.8mm
    3.6V
    2.7V
    1Gb 128M x 8
    Non-Volatile
    ASYNCHRONOUS
    FLASH
    Parallel
    128MX8
    8
    25ns
    1073741824 bit
    3.3V
    1mm
    8mm
    6.5mm
    ROHS3 Compliant
    -
    unknown
    -
    -
    W29N02GVBIAF vs W29N01GVDIAA
  • W29N01HVBINF
    W29N01HVBINF
    Winbond Electronics
    10 Weeks
    Surface Mount
    63-VFBGA
    YES
    63
    -40°C~85°C TA
    Tray
    2016
    Active
    3 (168 Hours)
    63
    FLASH - NAND (SLC)
    2.7V~3.6V
    BOTTOM
    1
    3V
    0.8mm
    3.6V
    2.7V
    1Gb 128M x 8
    Non-Volatile
    ASYNCHRONOUS
    FLASH
    Parallel
    128MX8
    8
    25ns
    1073741824 bit
    3.3V
    1mm
    11mm
    9mm
    ROHS3 Compliant
    -
    -
    -
    yes
    W29N02GVBIAF vs W29N01HVBINF
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS
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