Winbond Electronics W29N01HVSINA

Name: W29N01HVSINA
Brand: Winbond Electronics
SKU: 3835774-W29N01HVSINA
Availability: InStock
Rating: 5 (1 reviews)

Part Number:: W29N01HVSINA

Manufacturer:: Winbond Electronics

Ventron No:: 3835774-W29N01HVSINA

Description:: IC FLASH 1GBIT 25NS 48TSOP

ECAD Model:

Datasheet:: Migration from W29N01GV to W29N01HV

Specifications

Winbond Electronics W29N01HVSINA technical specifications, attributes, parameters and parts with similar specifications to Winbond Electronics W29N01HVSINA.

Factory Lead Time
10 Weeks
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
48-TFSOP (0.488, 12.40mm Width)
Number of Pins
48
Operating Temperature
-40°C~85°C TA
Packaging
Tray
Published
2016
Pbfree Code
yes
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
48
Technology
FLASH - NAND (SLC)
Voltage - Supply
2.7V~3.6V
Terminal Position
DUAL
Number of Functions
1
Supply Voltage
3V
Terminal Pitch
0.5mm
Operating Supply Voltage
3.3V
Supply Voltage-Max (Vsup)
3.6V
Supply Voltage-Min (Vsup)
2.7V
Memory Size
1Gb 128M x 8
Memory Type
Non-Volatile
Operating Mode
ASYNCHRONOUS
Memory Format
FLASH
Memory Interface
Parallel
Organization
128MX8
Memory Width
8
Write Cycle Time - Word, Page
25ns
Address Bus Width
28b
Density
1 Gb
Page Size
2.1kB
Height Seated (Max)
1.2mm
Length
18.4mm
RoHS Status
ROHS3 Compliant

Description

W29N01HVSINA Overview
The surface mount type of mount is a common form of electronic packaging, with a mounting type that allows for easy installation on a surface. The operating temperature for this particular mount is -40°C~85°C TA, making it suitable for a wide range of environments. It is packaged in a tray, which provides protection and organization during transportation and storage. With 48 terminations, this mount offers a high level of connectivity. The maximum supply voltage (Vsup) for this mount is 3.6V, providing a reliable power source. It has a memory width of 8 and a fast write cycle time of 25ns, making it ideal for quick data processing. The address bus width is 28b, allowing for efficient data transfer, and the density of 1 Gb ensures ample storage space.

W29N01HVSINA Features
Package / Case: 48-TFSOP (0.488, 12.40mm Width)
48 Pins
Operating Supply Voltage:3.3V

W29N01HVSINA Applications
There are a lot of Winbond Electronics W29N01HVSINA Memory applications.

cell phones
graphics card
multimedia computers
embedded logic
DVD disk buffer
workstations,
hard disk drive (HDD)
Cache memory
printers
servers

W29N01HVSINA More Descriptions

SLC NAND Flash 3V/3.3V 1G-bit 128M x 8 48-Pin TSOP-I | IC FLASH 1G PARALLEL 48TSOP
Active 2016 DUAL Non-Volatile FLASH Memory -40C~85C TA 2.7V 1Gb 18.4mm
SLC NAND 1Gb 2.7^3.6V TSOP1-48 Industry 1bit ECC
TSOP-48-18.4mm NAND FLASH ROHS
Product Description Demo for Development.
IC FLASH 1GBIT PARALLEL 48TSOP

Product Comparison

The three parts on the right have similar specifications to W29N01HVSINA.

Image

Part Number

Manufacturer

Factory Lead Time

Mount

Mounting Type

Package / Case

Number of Pins

Operating Temperature

Packaging

Published

Pbfree Code

Part Status

Moisture Sensitivity Level (MSL)

Number of Terminations

Technology

Voltage - Supply

Terminal Position

Number of Functions

Supply Voltage

Terminal Pitch

Operating Supply Voltage

Supply Voltage-Max (Vsup)

Supply Voltage-Min (Vsup)

Memory Size

Memory Type

Operating Mode

Memory Format

Memory Interface

Organization

Memory Width

Write Cycle Time - Word, Page

Address Bus Width

Density

Page Size

Height Seated (Max)

Length

RoHS Status

Surface Mount

Memory Density

Programming Voltage

Width

JESD-30 Code

View Compare
W29N01HVSINA

Winbond Electronics

10 Weeks

Surface Mount

Surface Mount

48-TFSOP (0.488, 12.40mm Width)

48

-40°C~85°C TA

Tray

2016

yes

Active

3 (168 Hours)

48

FLASH - NAND (SLC)

2.7V~3.6V

DUAL

1

3V

0.5mm

3.3V

3.6V

2.7V

1Gb 128M x 8

Non-Volatile

ASYNCHRONOUS

FLASH

Parallel

128MX8

8

25ns

28b

1 Gb

2.1kB

1.2mm

18.4mm

ROHS3 Compliant

-

-

-

-

-

-
W29N04GVBIAA

Winbond Electronics

10 Weeks

-

Surface Mount

63-VFBGA

63

-40°C~85°C TA

Tray

2016

yes

Active

3 (168 Hours)

63

FLASH - NAND (SLC)

2.7V~3.6V

BOTTOM

1

3.3V

0.8mm

-

3.6V

2.7V

4Gb 512M x 8

Non-Volatile

ASYNCHRONOUS

FLASH

Parallel

512MX8

8

25ns

-

-

-

1mm

11mm

ROHS3 Compliant

YES

4294967296 bit

3.3V

9mm

-

W29N01HVSINA vs W29N04GVBIAA
W29N02GVSIAF

Winbond Electronics

10 Weeks

-

Surface Mount

48-TFSOP (0.488, 12.40mm Width)

-

-40°C~85°C TA

Tray

2016

-

Active

3 (168 Hours)

48

FLASH - NAND (SLC)

2.7V~3.6V

DUAL

1

3V

0.5mm

-

3.6V

2.7V

2Gb 256M x 8

Non-Volatile

ASYNCHRONOUS

FLASH

Parallel

256MX8

8

25ns

-

-

-

1.2mm

18.4mm

ROHS3 Compliant

YES

2147483648 bit

3.3V

12mm

R-PDSO-G48

W29N01HVSINA vs W29N02GVSIAF
W29N01HVSINF

Winbond Electronics

10 Weeks

Surface Mount

Surface Mount

48-TFSOP (0.488, 12.40mm Width)

48

-40°C~85°C TA

Tray

2016

yes

Active

3 (168 Hours)

48

FLASH - NAND (SLC)

2.7V~3.6V

DUAL

1

3V

0.5mm

3.3V

3.6V

2.7V

1Gb 128M x 8

Non-Volatile

ASYNCHRONOUS

FLASH

Parallel

128MX8

8

25ns

28b

1 Gb

2.1kB

1.2mm

18.4mm

ROHS3 Compliant

-

-

-

-

-

W29N01HVSINA vs W29N01HVSINF