SI3900DV-T1-GE3

Vishay Siliconix SI3900DV-T1-GE3

Part Number:
SI3900DV-T1-GE3
Manufacturer:
Vishay Siliconix
Ventron No:
2473884-SI3900DV-T1-GE3
Description:
MOSFET 2N-CH 20V 2A 6-TSOP
ECAD Model:
Datasheet:
SI3900DV-T1-GE3

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Specifications
Vishay Siliconix SI3900DV-T1-GE3 technical specifications, attributes, parameters and parts with similar specifications to Vishay Siliconix SI3900DV-T1-GE3.
  • Factory Lead Time
    14 Weeks
  • Mount
    Surface Mount
  • Mounting Type
    Surface Mount
  • Package / Case
    SOT-23-6 Thin, TSOT-23-6
  • Number of Pins
    6
  • Weight
    19.986414mg
  • Transistor Element Material
    SILICON
  • Operating Temperature
    -55°C~150°C TJ
  • Packaging
    Tape & Reel (TR)
  • Series
    TrenchFET®
  • Published
    2013
  • JESD-609 Code
    e3
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    1 (Unlimited)
  • Number of Terminations
    6
  • ECCN Code
    EAR99
  • Terminal Finish
    PURE MATTE TIN
  • Max Power Dissipation
    830mW
  • Terminal Form
    GULL WING
  • Peak Reflow Temperature (Cel)
    260
  • Time@Peak Reflow Temperature-Max (s)
    30
  • Base Part Number
    SI3900
  • Pin Count
    6
  • Number of Elements
    2
  • Element Configuration
    Dual
  • Operating Mode
    ENHANCEMENT MODE
  • Power Dissipation
    830mW
  • Turn On Delay Time
    10 ns
  • FET Type
    2 N-Channel (Dual)
  • Rds On (Max) @ Id, Vgs
    125m Ω @ 2.4A, 4.5V
  • Vgs(th) (Max) @ Id
    1.5V @ 250μA
  • Current - Continuous Drain (Id) @ 25°C
    2A
  • Gate Charge (Qg) (Max) @ Vgs
    4nC @ 4.5V
  • Rise Time
    30ns
  • Fall Time (Typ)
    6 ns
  • Turn-Off Delay Time
    14 ns
  • Continuous Drain Current (ID)
    2.4A
  • Gate to Source Voltage (Vgs)
    12V
  • Drain Current-Max (Abs) (ID)
    2A
  • Drain to Source Breakdown Voltage
    20V
  • FET Technology
    METAL-OXIDE SEMICONDUCTOR
  • FET Feature
    Logic Level Gate
  • Radiation Hardening
    No
  • RoHS Status
    ROHS3 Compliant
Description
SI3900DV-T1-GE3 Overview
This product is manufactured by Vishay Siliconix and belongs to the category of Transistors - FETs, MOSFETs - Arrays. The images we provide are for reference only, for detailed product information please see specification sheet SI3900DV-T1-GE3 or the datasheet in PDF format. As a professional electronic components distributor, Ventron has five million electronic components available. Additionally, we have over 500,000 electronic components in stock ready for immediate shipment. If you have requirements, you can send us a quotation form to get the price of SI3900DV-T1-GE3. We attach great importance to our customers' purchasing experience and are willing to establish a long-term cooperative relationship with you. If you have any questions or requirements, please feel free to contact us.
SI3900DV-T1-GE3 More Descriptions
SI3900DV-T1-GE3 Dual N-channel MOSFET Transistor; 2 A; 20 V; 6-Pin TSOP
TSOP6 20V DUAL N-CH (D-S) TRENCH
Small Signal Field-Effect Transistor, 2A I(D), 20V, 2-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET
MOSFET 20V 2.4A 1.15W 125mohm @ 4.5V
Dual, 20Volt, 2.4Amp, 125mohm RdsOn4.5V, Tsop-6
French Electronic Distributor since 1988
Transistor; Transistor Polarity:Dual N Channel; Continuous Drain Current, Id:2.4A; Drain Source Voltage, Vds:20V; On Resistance, Rds(on):0.125ohm; Rds(on) Test Voltage, Vgs:4.5V; Threshold Voltage, Vgs Typ:1.5V ;RoHS Compliant: Yes
Product Comparison
The three parts on the right have similar specifications to SI3900DV-T1-GE3.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Mount
    Mounting Type
    Package / Case
    Number of Pins
    Weight
    Transistor Element Material
    Operating Temperature
    Packaging
    Series
    Published
    JESD-609 Code
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    ECCN Code
    Terminal Finish
    Max Power Dissipation
    Terminal Form
    Peak Reflow Temperature (Cel)
    Time@Peak Reflow Temperature-Max (s)
    Base Part Number
    Pin Count
    Number of Elements
    Element Configuration
    Operating Mode
    Power Dissipation
    Turn On Delay Time
    FET Type
    Rds On (Max) @ Id, Vgs
    Vgs(th) (Max) @ Id
    Current - Continuous Drain (Id) @ 25°C
    Gate Charge (Qg) (Max) @ Vgs
    Rise Time
    Fall Time (Typ)
    Turn-Off Delay Time
    Continuous Drain Current (ID)
    Gate to Source Voltage (Vgs)
    Drain Current-Max (Abs) (ID)
    Drain to Source Breakdown Voltage
    FET Technology
    FET Feature
    Radiation Hardening
    RoHS Status
    Supplier Device Package
    Max Operating Temperature
    Min Operating Temperature
    Number of Channels
    Power - Max
    Drain to Source Voltage (Vdss)
    Drain to Source Resistance
    Rds On Max
    Contact Plating
    Subcategory
    Reach Compliance Code
    Qualification Status
    Transistor Application
    Input Capacitance (Ciss) (Max) @ Vds
    Threshold Voltage
    JEDEC-95 Code
    Drain-source On Resistance-Max
    Nominal Vgs
    REACH SVHC
    Lead Free
    View Compare
  • SI3900DV-T1-GE3
    SI3900DV-T1-GE3
    14 Weeks
    Surface Mount
    Surface Mount
    SOT-23-6 Thin, TSOT-23-6
    6
    19.986414mg
    SILICON
    -55°C~150°C TJ
    Tape & Reel (TR)
    TrenchFET®
    2013
    e3
    Active
    1 (Unlimited)
    6
    EAR99
    PURE MATTE TIN
    830mW
    GULL WING
    260
    30
    SI3900
    6
    2
    Dual
    ENHANCEMENT MODE
    830mW
    10 ns
    2 N-Channel (Dual)
    125m Ω @ 2.4A, 4.5V
    1.5V @ 250μA
    2A
    4nC @ 4.5V
    30ns
    6 ns
    14 ns
    2.4A
    12V
    2A
    20V
    METAL-OXIDE SEMICONDUCTOR
    Logic Level Gate
    No
    ROHS3 Compliant
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • SI3905DV-T1-GE3
    -
    Surface Mount
    Surface Mount
    SOT-23-6 Thin, TSOT-23-6
    -
    19.986414mg
    -
    -55°C~150°C TJ
    Tape & Reel (TR)
    TrenchFET®
    2016
    -
    Obsolete
    1 (Unlimited)
    -
    -
    -
    1.15W
    -
    -
    -
    -
    -
    -
    Dual
    -
    -
    -
    2 P-Channel (Dual)
    125mOhm @ 2.5A, 4.5V
    450mV @ 250μA (Min)
    -
    6nC @ 4.5V
    -
    -
    -
    2.5A
    8V
    -
    -
    -
    Logic Level Gate
    -
    ROHS3 Compliant
    6-TSOP
    150°C
    -55°C
    2
    1.15W
    8V
    125mOhm
    125 mΩ
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • SI3993CDV-T1-GE3
    14 Weeks
    Surface Mount
    Surface Mount
    SOT-23-6 Thin, TSOT-23-6
    6
    19.986414mg
    SILICON
    -55°C~150°C TJ
    Tape & Reel (TR)
    TrenchFET®
    2012
    e3
    Active
    1 (Unlimited)
    6
    EAR99
    -
    1.4W
    GULL WING
    NOT SPECIFIED
    NOT SPECIFIED
    -
    6
    2
    Dual
    ENHANCEMENT MODE
    1.14W
    10 ns
    2 P-Channel (Dual)
    111m Ω @ 2.5A, 10V
    2.2V @ 250μA
    2.9A
    8nC @ 10V
    16ns
    12 ns
    17 ns
    -2.9A
    20V
    -
    -30V
    METAL-OXIDE SEMICONDUCTOR
    Standard
    -
    ROHS3 Compliant
    -
    -
    -
    2
    -
    30V
    -
    -
    Tin
    Other Transistors
    unknown
    Not Qualified
    SWITCHING
    210pF @ 15V
    -1.2V
    MO-193AA
    0.111Ohm
    -1.2 V
    No SVHC
    Lead Free
  • SI3981DV-T1-E3
    -
    Surface Mount
    Surface Mount
    SOT-23-6 Thin, TSOT-23-6
    6
    -
    -
    -55°C~150°C TJ
    Tape & Reel (TR)
    TrenchFET®
    -
    -
    Obsolete
    1 (Unlimited)
    -
    -
    -
    800mW
    -
    -
    -
    SI3981
    -
    2
    Dual
    -
    800mW
    30 ns
    2 P-Channel (Dual)
    185mOhm @ 1.9A, 4.5V
    1.1V @ 250μA
    1.6A
    5nC @ 4.5V
    50ns
    50 ns
    45 ns
    -1.9A
    8V
    -
    -20V
    -
    Logic Level Gate
    No
    ROHS3 Compliant
    6-TSOP
    150°C
    -55°C
    -
    800mW
    20V
    185mOhm
    185 mΩ
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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