NXP USA Inc. P1010NXE5DFB
- Part Number:
- P1010NXE5DFB
- Manufacturer:
- NXP USA Inc.
- Ventron No:
- 3827802-P1010NXE5DFB
- Description:
- IC MPU Q OR IQ 1.0GHZ 425TEBGA
- Datasheet:
- P1010NXE5DFB
NXP USA Inc. P1010NXE5DFB technical specifications, attributes, parameters and parts with similar specifications to NXP USA Inc. P1010NXE5DFB.
- Factory Lead Time12 Weeks
- Package / Case425-FBGA
- Surface MountYES
- Operating Temperature-40°C~105°C TA
- PackagingTray
- Published2002
- SeriesQorIQ P1
- Part StatusActive
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Number of Terminations425
- HTS Code8542.31.00.01
- SubcategoryMicroprocessors
- TechnologyCMOS
- Supply Voltage1V
- Base Part NumberP1010
- Power Supplies1V
- Speed1.0GHz
- uPs/uCs/Peripheral ICs TypeMICROPROCESSOR, RISC
- Core ProcessorPowerPC e500v2
- Bit Size32
- Ethernet10/100/1000Mbps (3)
- Number of Cores/Bus Width1 Core 32-Bit
- Graphics AccelerationNo
- RAM ControllersDDR3, DDR3L
- USBUSB 2.0 PHY (1)
- Additional InterfacesCAN, DUART, I2C, MMC/SD, SPI
- Co-Processors/DSPSecurity; SEC 4.4
- Security FeaturesBoot Security, Cryptography, Random Number Generator, Secure Fusebox
- SATASATA 3Gbps (2)
- RoHS StatusROHS3 Compliant
P1010NXE5DFB Overview
The NXP USA Inc. brand offers a variety of electronic components, including the Embedded - Microprocessors chip. This chip falls under the Embedded - Microprocessors category and has a 425-FBGA package/case with surface mount capabilities. It can operate in a temperature range of -40°C to 105°C and comes in a tray packaging. With 425 terminations, this chip requires a supply voltage of 1V and has DDR3 and DDR3L RAM controllers. It also has additional interfaces such as CAN, DUART, I2C, MMC/SD, and SPI. Security features include boot security, cryptography, a random number generator, and a secure fusebox. This chip is also compliant with the RoHS3 standard.
P1010NXE5DFB Features
PowerPC e500v2 Core
32-Bit Structure
P1010NXE5DFB Applications
There are a lot of NXP USA Inc. P1010NXE5DFB Microprocessor applications.
Projector
Binding machines
Tape drives
Coffee machines
Monitoring-temperature level, oil level, speed, distance, acceleration
Hearing aids
Switches
Wastewater treatment
Fire detection & safety devices
Dishwashers
The NXP USA Inc. brand offers a variety of electronic components, including the Embedded - Microprocessors chip. This chip falls under the Embedded - Microprocessors category and has a 425-FBGA package/case with surface mount capabilities. It can operate in a temperature range of -40°C to 105°C and comes in a tray packaging. With 425 terminations, this chip requires a supply voltage of 1V and has DDR3 and DDR3L RAM controllers. It also has additional interfaces such as CAN, DUART, I2C, MMC/SD, and SPI. Security features include boot security, cryptography, a random number generator, and a secure fusebox. This chip is also compliant with the RoHS3 standard.
P1010NXE5DFB Features
PowerPC e500v2 Core
32-Bit Structure
P1010NXE5DFB Applications
There are a lot of NXP USA Inc. P1010NXE5DFB Microprocessor applications.
Projector
Binding machines
Tape drives
Coffee machines
Monitoring-temperature level, oil level, speed, distance, acceleration
Hearing aids
Switches
Wastewater treatment
Fire detection & safety devices
Dishwashers
P1010NXE5DFB More Descriptions
RISC Microprocessor, 32-Bit, 533MHz, CMOS
ROHS3Compliant MICROPROCESSOR RISC USB 2.0 PHY (1) DDR3DDR3L IC Microprocessor -40C~105C TA 1V 1.0GHz 10/100/1000Mbps (3)
Microprocessors - MPU 32-Bit 533 MHz GbETrust Arch
QorIQ, 32-Bit Power Arch, SoC, 533 MHz, SATA, SEC, GbE, PCIe, DDR3, Trust Arch, -40C to 105C,Rev2.01
IC MPU Q OR IQ 1.0GHZ 425TEPBGA
ROHS3Compliant MICROPROCESSOR RISC USB 2.0 PHY (1) DDR3DDR3L IC Microprocessor -40C~105C TA 1V 1.0GHz 10/100/1000Mbps (3)
Microprocessors - MPU 32-Bit 533 MHz GbETrust Arch
QorIQ, 32-Bit Power Arch, SoC, 533 MHz, SATA, SEC, GbE, PCIe, DDR3, Trust Arch, -40C to 105C,Rev2.01
IC MPU Q OR IQ 1.0GHZ 425TEPBGA
The three parts on the right have similar specifications to P1010NXE5DFB.
-
ImagePart NumberManufacturerFactory Lead TimePackage / CaseSurface MountOperating TemperaturePackagingPublishedSeriesPart StatusMoisture Sensitivity Level (MSL)Number of TerminationsHTS CodeSubcategoryTechnologySupply VoltageBase Part NumberPower SuppliesSpeeduPs/uCs/Peripheral ICs TypeCore ProcessorBit SizeEthernetNumber of Cores/Bus WidthGraphics AccelerationRAM ControllersUSBAdditional InterfacesCo-Processors/DSPSecurity FeaturesSATARoHS StatusJESD-609 CodeTerminal FinishSupplier Device PackageView Compare
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P1010NXE5DFB12 Weeks425-FBGAYES-40°C~105°C TATray2002QorIQ P1Active3 (168 Hours)4258542.31.00.01MicroprocessorsCMOS1VP10101V1.0GHzMICROPROCESSOR, RISCPowerPC e500v23210/100/1000Mbps (3)1 Core 32-BitNoDDR3, DDR3LUSB 2.0 PHY (1)CAN, DUART, I2C, MMC/SD, SPISecurity; SEC 4.4Boot Security, Cryptography, Random Number Generator, Secure FuseboxSATA 3Gbps (2)ROHS3 Compliant----
-
-425-FBGAYES0°C~105°C TATray2002QorIQ P1Obsolete3 (168 Hours)4258542.31.00.01MicroprocessorsCMOS1VP10101V1.0GHzMICROPROCESSOR, RISCPowerPC e500v23210/100/1000Mbps (3)1 Core 32-BitNoDDR3, DDR3LUSB 2.0 PHY (1)CAN, DUART, I2C, MMC/SD, SPI--SATA 3Gbps (2)ROHS3 Compliante2Tin/Silver (Sn/Ag)-
-
-425-FBGAYES0°C~105°C TATray2010QorIQ P1Obsolete3 (168 Hours)4258542.31.00.01MicroprocessorsCMOS1VP10101V1.0GHzMICROPROCESSOR, RISCPowerPC e500v23210/100/1000Mbps (3)1 Core 32-BitNoDDR3, DDR3LUSB 2.0 PHY (1)CAN, DUART, I2C, MMC/SD, SPISecurity; SEC 4.4Boot Security, Cryptography, Random Number Generator, Secure FuseboxSATA 3Gbps (2)ROHS3 Compliante2Tin/Silver (Sn/Ag)-
-
-425-FBGA-0°C~105°C TATray-QorIQ P1Obsolete3 (168 Hours)-------1.0GHz-PowerPC e500v2-10/100/1000Mbps (3)1 Core 32-BitNoDDR3, DDR3LUSB 2.0 PHY (1)CAN, DUART, I2C, MMC/SD, SPISecurity; SEC 4.4Boot Security, Cryptography, Random Number Generator, Secure FuseboxSATA 3Gbps (2)Non-RoHS Compliant--425-TEPBGA I (19x19)
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