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NAND04GR3B2DN6E

Micron Technology Inc. NAND04GR3B2DN6E

Part Number:
NAND04GR3B2DN6E
Manufacturer:
Micron Technology Inc.
Ventron No:
3242740-NAND04GR3B2DN6E
Description:
IC FLASH 4GBIT 48TSOP
ECAD Model:
Datasheet:
NAND04G-B2D, NAND08G-BxC

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Specifications
Micron Technology Inc. NAND04GR3B2DN6E technical specifications, attributes, parameters and parts with similar specifications to Micron Technology Inc. NAND04GR3B2DN6E.
  • Mount
    Surface Mount
  • Mounting Type
    Surface Mount
  • Package / Case
    48-TFSOP (0.724, 18.40mm Width)
  • Number of Pins
    48
  • Operating Temperature
    -40°C~85°C TA
  • Packaging
    Tray
  • Published
    2010
  • JESD-609 Code
    e3
  • Pbfree Code
    yes
  • Part Status
    Discontinued
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    48
  • Terminal Finish
    Matte Tin (Sn)
  • Technology
    FLASH - NAND
  • Voltage - Supply
    1.7V~1.95V
  • Terminal Position
    DUAL
  • Peak Reflow Temperature (Cel)
    260
  • Number of Functions
    1
  • Supply Voltage
    1.8V
  • Terminal Pitch
    0.5mm
  • Time@Peak Reflow Temperature-Max (s)
    30
  • Base Part Number
    NAND04G
  • Pin Count
    48
  • Qualification Status
    Not Qualified
  • Operating Supply Voltage
    1.8V
  • Supply Voltage-Max (Vsup)
    1.95V
  • Supply Voltage-Min (Vsup)
    1.7V
  • Memory Size
    4Gb 512M x 8
  • Nominal Supply Current
    20mA
  • Memory Type
    Non-Volatile
  • Memory Format
    FLASH
  • Memory Interface
    Parallel
  • Organization
    512MX8
  • Memory Width
    8
  • Write Cycle Time - Word, Page
    25ns
  • Address Bus Width
    1b
  • Density
    4 Gb
  • Standby Current-Max
    0.00005A
  • Access Time (Max)
    25000 ns
  • Sync/Async
    Asynchronous
  • Word Size
    16b
  • Data Polling
    NO
  • Toggle Bit
    NO
  • Command User Interface
    YES
  • Number of Sectors/Size
    4K
  • Sector Size
    128K
  • Page Size
    2Kwords
  • Ready/Busy
    YES
  • Height Seated (Max)
    1.2mm
  • Length
    18.4mm
  • RoHS Status
    ROHS3 Compliant
Description
NAND04GR3B2DN6E Overview
The package or case for this electronic component is a 48-TFSOP with dimensions of 0.724 and 18.40mm in width. It was published in 2010 and follows the JESD-609 Code of e3. However, it is currently discontinued. The peak reflow temperature for this component is 260 degrees Celsius. Its base part number is NAND04G and it has an address bus width of 1b. The standby current-max is 0.00005A and the toggle bit is set to NO. Additionally, the page size for this component is 2Kwords. These specifications are important to consider when using this electronic component in any circuit or system.

NAND04GR3B2DN6E Features
Package / Case: 48-TFSOP (0.724, 18.40mm Width)
48 Pins
Operating Supply Voltage:1.8V


NAND04GR3B2DN6E Applications
There are a lot of Micron Technology Inc.
NAND04GR3B2DN6E Memory applications.


telecommunications
workstations,
DVD disk buffer
data buffer
nonvolatile BIOS memory
Camcorders
embedded logic
eDRAM
graphics card
hard disk drive (HDD)
NAND04GR3B2DN6E More Descriptions
IC FLASH 4G PARALLEL 48TSOP
IC FLASH 4GBIT 48TSOP
IC EEPROM 16K I2C 400KHZ 6WLCSP
Product Comparison
The three parts on the right have similar specifications to NAND04GR3B2DN6E.
  • Image
    Part Number
    Manufacturer
    Mount
    Mounting Type
    Package / Case
    Number of Pins
    Operating Temperature
    Packaging
    Published
    JESD-609 Code
    Pbfree Code
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    Terminal Finish
    Technology
    Voltage - Supply
    Terminal Position
    Peak Reflow Temperature (Cel)
    Number of Functions
    Supply Voltage
    Terminal Pitch
    Time@Peak Reflow Temperature-Max (s)
    Base Part Number
    Pin Count
    Qualification Status
    Operating Supply Voltage
    Supply Voltage-Max (Vsup)
    Supply Voltage-Min (Vsup)
    Memory Size
    Nominal Supply Current
    Memory Type
    Memory Format
    Memory Interface
    Organization
    Memory Width
    Write Cycle Time - Word, Page
    Address Bus Width
    Density
    Standby Current-Max
    Access Time (Max)
    Sync/Async
    Word Size
    Data Polling
    Toggle Bit
    Command User Interface
    Number of Sectors/Size
    Sector Size
    Page Size
    Ready/Busy
    Height Seated (Max)
    Length
    RoHS Status
    ECCN Code
    HTS Code
    Power Supplies
    Programming Voltage
    Write Cycle Time-Max (tWC)
    Radiation Hardening
    REACH SVHC
    View Compare
  • NAND04GR3B2DN6E
    NAND04GR3B2DN6E
    Micron Technology Inc.
    Surface Mount
    Surface Mount
    48-TFSOP (0.724, 18.40mm Width)
    48
    -40°C~85°C TA
    Tray
    2010
    e3
    yes
    Discontinued
    3 (168 Hours)
    48
    Matte Tin (Sn)
    FLASH - NAND
    1.7V~1.95V
    DUAL
    260
    1
    1.8V
    0.5mm
    30
    NAND04G
    48
    Not Qualified
    1.8V
    1.95V
    1.7V
    4Gb 512M x 8
    20mA
    Non-Volatile
    FLASH
    Parallel
    512MX8
    8
    25ns
    1b
    4 Gb
    0.00005A
    25000 ns
    Asynchronous
    16b
    NO
    NO
    YES
    4K
    128K
    2Kwords
    YES
    1.2mm
    18.4mm
    ROHS3 Compliant
    -
    -
    -
    -
    -
    -
    -
    -
  • NAND01GW3B2CN6E
    NAND01GW3B2CN6E
    Micron Technology Inc.
    Surface Mount
    Surface Mount
    48-TFSOP (0.724, 18.40mm Width)
    48
    -40°C~85°C TA
    Tray
    2008
    e3
    -
    Obsolete
    3 (168 Hours)
    48
    Matte Tin (Sn)
    FLASH - NAND
    2.7V~3.6V
    DUAL
    260
    1
    3V
    0.5mm
    30
    NAND01G-A
    48
    -
    -
    3.6V
    2.7V
    1Gb 128M x 8
    30mA
    Non-Volatile
    FLASH
    Parallel
    128MX8
    8
    25ns
    28b
    1 Gb
    0.00005A
    25000 ns
    Asynchronous
    8b
    NO
    NO
    YES
    1K
    128K
    2kB
    YES
    1.2mm
    18.4mm
    ROHS3 Compliant
    3A991.B.1.A
    8542.32.00.51
    3/3.3V
    3V
    25ms
    No
    No SVHC
    NAND04GR3B2DN6E vs NAND01GW3B2CN6E
  • NAND01GW3B2BZA6E
    NAND01GW3B2BZA6E
    Micron Technology Inc.
    Surface Mount
    Surface Mount
    63-TFBGA
    63
    -40°C~85°C TA
    Tray
    2004
    e1
    yes
    Obsolete
    3 (168 Hours)
    63
    TIN SILVER COPPER
    FLASH - NAND
    2.7V~3.6V
    BOTTOM
    260
    1
    3V
    0.8mm
    30
    NAND01G-A
    63
    Not Qualified
    -
    3.6V
    2.7V
    1Gb 128M x 8
    30mA
    Non-Volatile
    FLASH
    Parallel
    128MX8
    8
    30ns
    28b
    1 Gb
    0.00005A
    20 ns
    Asynchronous
    8b
    NO
    NO
    YES
    1K
    128K
    2Kwords
    YES
    1.05mm
    12mm
    ROHS3 Compliant
    3A991.B.1.A
    8542.32.00.51
    3/3.3V
    3V
    -
    -
    -
    NAND04GR3B2DN6E vs NAND01GW3B2BZA6E
  • NAND02GR3B2DZA6E
    NAND02GR3B2DZA6E
    Micron Technology Inc.
    Surface Mount
    Surface Mount
    63-TFBGA
    63
    -40°C~85°C TA
    Tray
    2008
    e1
    -
    Discontinued
    3 (168 Hours)
    63
    TIN SILVER COPPER
    FLASH - NAND
    1.7V~1.95V
    BOTTOM
    260
    1
    1.8V
    0.8mm
    30
    NAND02G
    63
    -
    1.8V
    1.95V
    1.7V
    2Gb 256M x 8
    20mA
    Non-Volatile
    FLASH
    Parallel
    256MX8
    8
    45ns
    8b
    2 Gb
    0.00005A
    25000 ns
    Asynchronous
    8b
    NO
    NO
    YES
    2K
    128K
    2kB
    YES
    1.05mm
    11mm
    ROHS3 Compliant
    3A991.B.1.A
    8542.32.00.51
    -
    -
    -
    No
    -
    NAND04GR3B2DN6E vs NAND02GR3B2DZA6E
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS
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